CA2991933C - Integrated device package comprising bridge in litho-etchable layer - Google Patents

Integrated device package comprising bridge in litho-etchable layer Download PDF

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Publication number
CA2991933C
CA2991933C CA2991933A CA2991933A CA2991933C CA 2991933 C CA2991933 C CA 2991933C CA 2991933 A CA2991933 A CA 2991933A CA 2991933 A CA2991933 A CA 2991933A CA 2991933 C CA2991933 C CA 2991933C
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Prior art keywords
die
integrated device
device package
bridge
layer
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CA2991933A
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English (en)
French (fr)
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CA2991933A1 (en
Inventor
Shiqun Gu
Hong Bok We
Jae Sik Lee
Dong Wook Kim
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Qualcomm Inc
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Qualcomm Inc
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    • H10W70/611—
    • H10W20/20—
    • H10W70/618—
    • H10W72/20—
    • H10W72/30—
    • H10W90/00—
    • H10W90/401—
    • H10W99/00—
    • H10W70/63—
    • H10W70/635—
    • H10W70/685—
    • H10W72/072—
    • H10W72/073—
    • H10W72/252—
    • H10W74/117—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Geometry (AREA)
CA2991933A 2015-08-21 2016-06-03 Integrated device package comprising bridge in litho-etchable layer Active CA2991933C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/832,363 2015-08-21
US14/832,363 US9368450B1 (en) 2015-08-21 2015-08-21 Integrated device package comprising bridge in litho-etchable layer
PCT/US2016/035895 WO2017034641A1 (en) 2015-08-21 2016-06-03 Integrated device package comprising bridge in litho-etchable layer

Publications (2)

Publication Number Publication Date
CA2991933A1 CA2991933A1 (en) 2017-03-02
CA2991933C true CA2991933C (en) 2024-05-21

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CA2991933A Active CA2991933C (en) 2015-08-21 2016-06-03 Integrated device package comprising bridge in litho-etchable layer

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US (1) US9368450B1 (enExample)
EP (1) EP3338303B1 (enExample)
JP (1) JP6748186B2 (enExample)
KR (1) KR102541861B1 (enExample)
CN (1) CN107924905B (enExample)
BR (1) BR112018003233B1 (enExample)
CA (1) CA2991933C (enExample)
WO (1) WO2017034641A1 (enExample)

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Also Published As

Publication number Publication date
EP3338303B1 (en) 2022-04-20
WO2017034641A1 (en) 2017-03-02
US9368450B1 (en) 2016-06-14
KR20180044905A (ko) 2018-05-03
CA2991933A1 (en) 2017-03-02
KR102541861B1 (ko) 2023-06-08
CN107924905B (zh) 2020-10-30
EP3338303A1 (en) 2018-06-27
JP2018523925A (ja) 2018-08-23
CN107924905A (zh) 2018-04-17
JP6748186B2 (ja) 2020-08-26
BR112018003233A2 (en) 2018-09-25
BR112018003233B1 (pt) 2023-01-31

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