CA2778288C - Method and apparatus for treating substrates - Google Patents
Method and apparatus for treating substrates Download PDFInfo
- Publication number
- CA2778288C CA2778288C CA2778288A CA2778288A CA2778288C CA 2778288 C CA2778288 C CA 2778288C CA 2778288 A CA2778288 A CA 2778288A CA 2778288 A CA2778288 A CA 2778288A CA 2778288 C CA2778288 C CA 2778288C
- Authority
- CA
- Canada
- Prior art keywords
- radiation
- substrate
- liquid
- radicals
- radiation source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 199
- 238000000034 method Methods 0.000 title claims abstract description 47
- 230000005855 radiation Effects 0.000 claims abstract description 226
- 239000007788 liquid Substances 0.000 claims abstract description 164
- 238000004140 cleaning Methods 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 150000002500 ions Chemical class 0.000 claims description 18
- 230000033001 locomotion Effects 0.000 claims description 11
- 238000011109 contamination Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- XMIIGOLPHOKFCH-UHFFFAOYSA-N 3-phenylpropionic acid Chemical compound OC(=O)CCC1=CC=CC=C1 XMIIGOLPHOKFCH-UHFFFAOYSA-N 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 239000002346 layers by function Substances 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 241000894006 Bacteria Species 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 2
- 239000012620 biological material Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- VTVVPPOHYJJIJR-UHFFFAOYSA-N carbon dioxide;hydrate Chemical compound O.O=C=O VTVVPPOHYJJIJR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000975 dye Substances 0.000 claims description 2
- 238000004049 embossing Methods 0.000 claims description 2
- 239000004922 lacquer Substances 0.000 claims description 2
- 235000011007 phosphoric acid Nutrition 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 235000011149 sulphuric acid Nutrition 0.000 claims description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 description 32
- 238000011282 treatment Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 10
- 238000000354 decomposition reaction Methods 0.000 description 6
- 230000005670 electromagnetic radiation Effects 0.000 description 6
- 230000005660 hydrophilic surface Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000002209 hydrophobic effect Effects 0.000 description 5
- 238000009835 boiling Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000005661 hydrophobic surface Effects 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001483 mobilizing effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B6/00—Cleaning by electrostatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Water Treatments (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25763309P | 2009-11-03 | 2009-11-03 | |
| US61/257,633 | 2009-11-03 | ||
| DE102009058962A DE102009058962B4 (de) | 2009-11-03 | 2009-12-18 | Verfahren und Vorrichtung zum Behandeln von Substraten |
| DE102009058962.7 | 2009-12-18 | ||
| PCT/EP2010/001629 WO2011054405A2 (en) | 2009-11-03 | 2010-03-15 | Method and apparatus for treating substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2778288A1 CA2778288A1 (en) | 2011-05-12 |
| CA2778288C true CA2778288C (en) | 2016-01-19 |
Family
ID=43828929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2778288A Active CA2778288C (en) | 2009-11-03 | 2010-03-15 | Method and apparatus for treating substrates |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US9662684B2 (enExample) |
| EP (1) | EP2496367B1 (enExample) |
| JP (1) | JP5766197B2 (enExample) |
| KR (1) | KR20120101427A (enExample) |
| CN (1) | CN102791391B (enExample) |
| CA (1) | CA2778288C (enExample) |
| DE (1) | DE102009058962B4 (enExample) |
| SG (1) | SG10201407169UA (enExample) |
| WO (1) | WO2011054405A2 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013045961A (ja) * | 2011-08-25 | 2013-03-04 | Dainippon Screen Mfg Co Ltd | 基板洗浄方法、基板洗浄液および基板処理装置 |
| DE102012008220A1 (de) * | 2012-04-25 | 2013-10-31 | Süss Microtec Photomask Equipment Gmbh & Co. Kg | Verfahren zum Reinigen von Fotomasken unter Verwendung von Megaschall |
| US9339853B2 (en) | 2012-12-04 | 2016-05-17 | The Boeing Company | Surface materials for decontamination with decontaminants |
| US8764905B1 (en) * | 2013-03-14 | 2014-07-01 | Intel Corporation | Cleaning organic residues from EUV optics and masks |
| CN103691714B (zh) * | 2013-12-19 | 2015-12-02 | 合肥京东方光电科技有限公司 | 一种清洗装置和清洗方法 |
| US9857680B2 (en) * | 2014-01-14 | 2018-01-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cleaning module, cleaning apparatus and method of cleaning photomask |
| JP6357319B2 (ja) * | 2014-02-17 | 2018-07-11 | 株式会社プレテック | 被洗浄基板の洗浄方法及び洗浄装置 |
| CN104007610B (zh) * | 2014-06-12 | 2018-03-06 | 深圳市华星光电技术有限公司 | 掩模版的清洗方法及装置 |
| KR102296739B1 (ko) * | 2014-10-27 | 2021-09-01 | 삼성전자 주식회사 | 포토마스크용 세정 조성물을 이용한 집적회로 소자 제조 방법 |
| DE102015011229B4 (de) * | 2015-08-27 | 2020-07-23 | Süss Microtec Photomask Equipment Gmbh & Co. Kg | Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat |
| DE102015011177B4 (de) * | 2015-08-27 | 2017-09-14 | Süss Microtec Photomask Equipment Gmbh & Co. Kg | Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat |
| DE102015011228B4 (de) * | 2015-08-27 | 2017-06-14 | Süss Microtec Photomask Equipment Gmbh & Co. Kg | Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat |
| US11358172B2 (en) | 2015-09-24 | 2022-06-14 | Suss Microtec Photomask Equipment Gmbh & Co. Kg | Method for treating substrates with an aqueous liquid medium exposed to UV-radiation |
| US9966266B2 (en) | 2016-04-25 | 2018-05-08 | United Microelectronics Corp. | Apparatus for semiconductor wafer treatment and semiconductor wafer treatment |
| KR101961326B1 (ko) | 2016-10-19 | 2019-07-18 | 세메스 주식회사 | 기판을 처리하는 장치의 부품 세정 방법 및 장치 |
| US10416575B2 (en) * | 2016-11-16 | 2019-09-17 | Suss Microtec Photomask Equipment Gmbh & Co. Kg | Apparatus and method for cleaning a partial area of a substrate |
| DE102017203351B4 (de) | 2017-03-01 | 2021-08-05 | Süss Microtec Photomask Equipment Gmbh & Co. Kg | Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat |
| JP2018163980A (ja) | 2017-03-24 | 2018-10-18 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP2017113753A (ja) * | 2017-03-30 | 2017-06-29 | 株式会社トクヤマ | 洗浄方法および洗浄装置 |
| CN107203094B (zh) * | 2017-07-03 | 2020-07-24 | 京东方科技集团股份有限公司 | 掩膜版清理装置及方法 |
| CN108380569A (zh) * | 2018-03-02 | 2018-08-10 | 常州瑞择微电子科技有限公司 | 高浓度oh自由基发生装置 |
| CN108816870B (zh) * | 2018-04-08 | 2021-05-25 | 苏州珮凯科技有限公司 | 半导体8寸晶元制造薄膜制程的WxZ工艺的陶瓷环状零部件再生方法 |
| US12112959B2 (en) | 2018-09-04 | 2024-10-08 | Tokyo Electron Limited | Processing systems and platforms for roughness reduction of materials using illuminated etch solutions |
| US10896824B2 (en) * | 2018-12-14 | 2021-01-19 | Tokyo Electron Limited | Roughness reduction methods for materials using illuminated etch solutions |
| CN110112084A (zh) * | 2019-05-22 | 2019-08-09 | 长江存储科技有限责任公司 | 半导体器件清洗装置 |
| KR102868707B1 (ko) * | 2019-07-01 | 2025-10-02 | 에이에스엠엘 네델란즈 비.브이. | 패터닝 디바이스와 기타 기판의 표면 처리를 위한 표면 처리 장치 및 방법 |
| CN111906093A (zh) * | 2020-07-15 | 2020-11-10 | 常州瑞择微电子科技有限公司 | 一种大面积光子发生喷头 |
| CN112435938A (zh) * | 2020-11-11 | 2021-03-02 | 深圳市华星光电半导体显示技术有限公司 | 基板清洗设备及基板清洗方法 |
| US11798799B2 (en) * | 2021-08-09 | 2023-10-24 | Applied Materials, Inc. | Ultraviolet and ozone clean system |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2623497B2 (ja) * | 1988-03-07 | 1997-06-25 | ウシオ電機株式会社 | オゾン水活性化装置 |
| US5068040A (en) * | 1989-04-03 | 1991-11-26 | Hughes Aircraft Company | Dense phase gas photochemical process for substrate treatment |
| JPH04277748A (ja) | 1991-03-06 | 1992-10-02 | Mitsubishi Paper Mills Ltd | 平版印刷版 |
| US5814156A (en) * | 1993-09-08 | 1998-09-29 | Uvtech Systems Inc. | Photoreactive surface cleaning |
| US5789755A (en) | 1996-08-28 | 1998-08-04 | New Star Lasers, Inc. | Method and apparatus for removal of material utilizing near-blackbody radiator means |
| US6869487B1 (en) | 1997-05-09 | 2005-03-22 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
| JPH11121417A (ja) * | 1997-10-09 | 1999-04-30 | Mitsubishi Electric Corp | 半導体基板の処理システムおよび処理方法 |
| NL1012389C1 (nl) * | 1999-06-18 | 2000-12-19 | Remmen Uv Techniek Van | Ultraviolette lamp en douchekop voorzien van een lamp. |
| DE10130999A1 (de) * | 2000-06-29 | 2002-04-18 | D M S Co | Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben |
| JP2002110611A (ja) | 2000-10-04 | 2002-04-12 | Texas Instr Japan Ltd | 半導体ウェハの洗浄方法及び装置 |
| JP4038557B2 (ja) | 2002-04-16 | 2008-01-30 | リアライズ・アドバンストテクノロジ株式会社 | レジスト除去装置及びレジスト除去方法 |
| JP3776092B2 (ja) * | 2003-03-25 | 2006-05-17 | 株式会社ルネサステクノロジ | エッチング装置、エッチング方法および半導体装置の製造方法 |
| US7921859B2 (en) * | 2004-12-16 | 2011-04-12 | Sematech, Inc. | Method and apparatus for an in-situ ultraviolet cleaning tool |
| JP5140916B2 (ja) * | 2005-10-07 | 2013-02-13 | 富士通株式会社 | 光化学処理装置及び光化学処理方法 |
| US20070093406A1 (en) | 2005-10-24 | 2007-04-26 | Omoregie Henryson | Novel cleaning process for masks and mask blanks |
| JP2007149972A (ja) * | 2005-11-28 | 2007-06-14 | Matsushita Electric Ind Co Ltd | 電子デバイス洗浄装置および電子デバイス洗浄方法 |
| NL1030589C2 (nl) | 2005-12-05 | 2007-06-06 | Houston R & D Consultancy B V | Werkwijze en systeem voor het reinigen van een lichaam en/of een fluïdum. |
| JP5019156B2 (ja) * | 2006-08-21 | 2012-09-05 | ウシオ電機株式会社 | エキシマランプ装置 |
| JP2008108997A (ja) * | 2006-10-27 | 2008-05-08 | Shibuya Kogyo Co Ltd | 洗浄装置 |
| WO2008107933A1 (ja) * | 2007-03-07 | 2008-09-12 | Fujitsu Limited | 洗浄装置および洗浄方法 |
-
2009
- 2009-12-18 DE DE102009058962A patent/DE102009058962B4/de active Active
-
2010
- 2010-03-15 CN CN201080050483.6A patent/CN102791391B/zh active Active
- 2010-03-15 KR KR1020127014173A patent/KR20120101427A/ko not_active Ceased
- 2010-03-15 SG SG10201407169UA patent/SG10201407169UA/en unknown
- 2010-03-15 EP EP10710543.9A patent/EP2496367B1/en active Active
- 2010-03-15 WO PCT/EP2010/001629 patent/WO2011054405A2/en not_active Ceased
- 2010-03-15 CA CA2778288A patent/CA2778288C/en active Active
- 2010-03-15 JP JP2012537306A patent/JP5766197B2/ja active Active
- 2010-03-15 US US13/505,385 patent/US9662684B2/en active Active
-
2017
- 2017-05-18 US US15/598,344 patent/US20170320108A1/en not_active Abandoned
- 2017-05-18 US US15/598,361 patent/US10265739B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2496367B1 (en) | 2016-02-10 |
| JP2013510332A (ja) | 2013-03-21 |
| CN102791391B (zh) | 2016-05-25 |
| KR20120101427A (ko) | 2012-09-13 |
| US9662684B2 (en) | 2017-05-30 |
| SG10201407169UA (en) | 2014-12-30 |
| US10265739B2 (en) | 2019-04-23 |
| JP5766197B2 (ja) | 2015-08-19 |
| US20170252781A1 (en) | 2017-09-07 |
| DE102009058962A1 (de) | 2011-05-05 |
| US20120211024A1 (en) | 2012-08-23 |
| HK1175141A1 (zh) | 2013-06-28 |
| CA2778288A1 (en) | 2011-05-12 |
| WO2011054405A2 (en) | 2011-05-12 |
| WO2011054405A3 (en) | 2012-06-28 |
| DE102009058962B4 (de) | 2012-12-27 |
| CN102791391A (zh) | 2012-11-21 |
| US20170320108A1 (en) | 2017-11-09 |
| EP2496367A2 (en) | 2012-09-12 |
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| Publication | Publication Date | Title |
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