KR20120101427A - 기판을 처리하기 위한 방법 및 장치 - Google Patents

기판을 처리하기 위한 방법 및 장치 Download PDF

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Publication number
KR20120101427A
KR20120101427A KR1020127014173A KR20127014173A KR20120101427A KR 20120101427 A KR20120101427 A KR 20120101427A KR 1020127014173 A KR1020127014173 A KR 1020127014173A KR 20127014173 A KR20127014173 A KR 20127014173A KR 20120101427 A KR20120101427 A KR 20120101427A
Authority
KR
South Korea
Prior art keywords
radiation
substrate
liquid
radicals
radiation source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127014173A
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English (en)
Korean (ko)
Inventor
우위 디체
피터 드레스
쉐르장 싱
Original Assignee
하마테크 에이피이 게엠베하 & 코. 카게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하마테크 에이피이 게엠베하 & 코. 카게 filed Critical 하마테크 에이피이 게엠베하 & 코. 카게
Publication of KR20120101427A publication Critical patent/KR20120101427A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B6/00—Cleaning by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Water Treatments (AREA)
KR1020127014173A 2009-11-03 2010-03-15 기판을 처리하기 위한 방법 및 장치 Ceased KR20120101427A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US25763309P 2009-11-03 2009-11-03
US61/257,633 2009-11-03
DE102009058962A DE102009058962B4 (de) 2009-11-03 2009-12-18 Verfahren und Vorrichtung zum Behandeln von Substraten
DE102009058962.7 2009-12-18

Publications (1)

Publication Number Publication Date
KR20120101427A true KR20120101427A (ko) 2012-09-13

Family

ID=43828929

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127014173A Ceased KR20120101427A (ko) 2009-11-03 2010-03-15 기판을 처리하기 위한 방법 및 장치

Country Status (9)

Country Link
US (3) US9662684B2 (enExample)
EP (1) EP2496367B1 (enExample)
JP (1) JP5766197B2 (enExample)
KR (1) KR20120101427A (enExample)
CN (1) CN102791391B (enExample)
CA (1) CA2778288C (enExample)
DE (1) DE102009058962B4 (enExample)
SG (1) SG10201407169UA (enExample)
WO (1) WO2011054405A2 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150084643A (ko) * 2014-01-14 2015-07-22 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 포토마스크의 클리닝 모듈, 클리닝 장치 및 클리닝 방법
KR20180057697A (ko) * 2015-09-24 2018-05-30 서스 마이크로텍 포토마스크 이큅먼트 게엠베하 운트 코. 카게 Uv 방사에 노출된 수성 액체 매체로 기판들을 처리하기 위한 방법
KR20190124759A (ko) * 2017-03-01 2019-11-05 서스 마이크로텍 포토마스크 이큅먼트 게엠베하 운트 코. 카게 Uv 방사에 노출된 액체 매체를 기판에 도포하기 위한 디바이스
US10622226B2 (en) 2016-10-19 2020-04-14 Semes Co. Ltd. Method and apparatus for cleaning component of substrate processing apparatus
WO2020123510A1 (en) * 2018-12-14 2020-06-18 Tokyo Electron Limited Roughness reduction methods for materials using illuminated etch solutions
US12112959B2 (en) 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions

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JP2013045961A (ja) * 2011-08-25 2013-03-04 Dainippon Screen Mfg Co Ltd 基板洗浄方法、基板洗浄液および基板処理装置
DE102012008220A1 (de) * 2012-04-25 2013-10-31 Süss Microtec Photomask Equipment Gmbh & Co. Kg Verfahren zum Reinigen von Fotomasken unter Verwendung von Megaschall
US9339853B2 (en) 2012-12-04 2016-05-17 The Boeing Company Surface materials for decontamination with decontaminants
US8764905B1 (en) * 2013-03-14 2014-07-01 Intel Corporation Cleaning organic residues from EUV optics and masks
CN103691714B (zh) * 2013-12-19 2015-12-02 合肥京东方光电科技有限公司 一种清洗装置和清洗方法
JP6357319B2 (ja) * 2014-02-17 2018-07-11 株式会社プレテック 被洗浄基板の洗浄方法及び洗浄装置
CN104007610B (zh) * 2014-06-12 2018-03-06 深圳市华星光电技术有限公司 掩模版的清洗方法及装置
KR102296739B1 (ko) * 2014-10-27 2021-09-01 삼성전자 주식회사 포토마스크용 세정 조성물을 이용한 집적회로 소자 제조 방법
DE102015011229B4 (de) * 2015-08-27 2020-07-23 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
DE102015011177B4 (de) * 2015-08-27 2017-09-14 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
DE102015011228B4 (de) * 2015-08-27 2017-06-14 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
US9966266B2 (en) 2016-04-25 2018-05-08 United Microelectronics Corp. Apparatus for semiconductor wafer treatment and semiconductor wafer treatment
US10416575B2 (en) * 2016-11-16 2019-09-17 Suss Microtec Photomask Equipment Gmbh & Co. Kg Apparatus and method for cleaning a partial area of a substrate
JP2018163980A (ja) 2017-03-24 2018-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2017113753A (ja) * 2017-03-30 2017-06-29 株式会社トクヤマ 洗浄方法および洗浄装置
CN107203094B (zh) * 2017-07-03 2020-07-24 京东方科技集团股份有限公司 掩膜版清理装置及方法
CN108380569A (zh) * 2018-03-02 2018-08-10 常州瑞择微电子科技有限公司 高浓度oh自由基发生装置
CN108816870B (zh) * 2018-04-08 2021-05-25 苏州珮凯科技有限公司 半导体8寸晶元制造薄膜制程的WxZ工艺的陶瓷环状零部件再生方法
CN110112084A (zh) * 2019-05-22 2019-08-09 长江存储科技有限责任公司 半导体器件清洗装置
KR102868707B1 (ko) * 2019-07-01 2025-10-02 에이에스엠엘 네델란즈 비.브이. 패터닝 디바이스와 기타 기판의 표면 처리를 위한 표면 처리 장치 및 방법
CN111906093A (zh) * 2020-07-15 2020-11-10 常州瑞择微电子科技有限公司 一种大面积光子发生喷头
CN112435938A (zh) * 2020-11-11 2021-03-02 深圳市华星光电半导体显示技术有限公司 基板清洗设备及基板清洗方法
US11798799B2 (en) * 2021-08-09 2023-10-24 Applied Materials, Inc. Ultraviolet and ozone clean system

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JP2623497B2 (ja) * 1988-03-07 1997-06-25 ウシオ電機株式会社 オゾン水活性化装置
US5068040A (en) * 1989-04-03 1991-11-26 Hughes Aircraft Company Dense phase gas photochemical process for substrate treatment
JPH04277748A (ja) 1991-03-06 1992-10-02 Mitsubishi Paper Mills Ltd 平版印刷版
US5814156A (en) * 1993-09-08 1998-09-29 Uvtech Systems Inc. Photoreactive surface cleaning
US5789755A (en) 1996-08-28 1998-08-04 New Star Lasers, Inc. Method and apparatus for removal of material utilizing near-blackbody radiator means
US6869487B1 (en) 1997-05-09 2005-03-22 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
JPH11121417A (ja) * 1997-10-09 1999-04-30 Mitsubishi Electric Corp 半導体基板の処理システムおよび処理方法
NL1012389C1 (nl) * 1999-06-18 2000-12-19 Remmen Uv Techniek Van Ultraviolette lamp en douchekop voorzien van een lamp.
DE10130999A1 (de) * 2000-06-29 2002-04-18 D M S Co Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben
JP2002110611A (ja) 2000-10-04 2002-04-12 Texas Instr Japan Ltd 半導体ウェハの洗浄方法及び装置
JP4038557B2 (ja) 2002-04-16 2008-01-30 リアライズ・アドバンストテクノロジ株式会社 レジスト除去装置及びレジスト除去方法
JP3776092B2 (ja) * 2003-03-25 2006-05-17 株式会社ルネサステクノロジ エッチング装置、エッチング方法および半導体装置の製造方法
US7921859B2 (en) * 2004-12-16 2011-04-12 Sematech, Inc. Method and apparatus for an in-situ ultraviolet cleaning tool
JP5140916B2 (ja) * 2005-10-07 2013-02-13 富士通株式会社 光化学処理装置及び光化学処理方法
US20070093406A1 (en) 2005-10-24 2007-04-26 Omoregie Henryson Novel cleaning process for masks and mask blanks
JP2007149972A (ja) * 2005-11-28 2007-06-14 Matsushita Electric Ind Co Ltd 電子デバイス洗浄装置および電子デバイス洗浄方法
NL1030589C2 (nl) 2005-12-05 2007-06-06 Houston R & D Consultancy B V Werkwijze en systeem voor het reinigen van een lichaam en/of een fluïdum.
JP5019156B2 (ja) * 2006-08-21 2012-09-05 ウシオ電機株式会社 エキシマランプ装置
JP2008108997A (ja) * 2006-10-27 2008-05-08 Shibuya Kogyo Co Ltd 洗浄装置
WO2008107933A1 (ja) * 2007-03-07 2008-09-12 Fujitsu Limited 洗浄装置および洗浄方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150084643A (ko) * 2014-01-14 2015-07-22 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 포토마스크의 클리닝 모듈, 클리닝 장치 및 클리닝 방법
US9857680B2 (en) 2014-01-14 2018-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning module, cleaning apparatus and method of cleaning photomask
US10747105B2 (en) 2014-01-14 2020-08-18 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning module, cleaning apparatus and method of cleaning photomask
US11237478B2 (en) 2014-01-14 2022-02-01 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning module, cleaning apparatus and method of cleaning photomask
KR20180057697A (ko) * 2015-09-24 2018-05-30 서스 마이크로텍 포토마스크 이큅먼트 게엠베하 운트 코. 카게 Uv 방사에 노출된 수성 액체 매체로 기판들을 처리하기 위한 방법
US10622226B2 (en) 2016-10-19 2020-04-14 Semes Co. Ltd. Method and apparatus for cleaning component of substrate processing apparatus
KR20190124759A (ko) * 2017-03-01 2019-11-05 서스 마이크로텍 포토마스크 이큅먼트 게엠베하 운트 코. 카게 Uv 방사에 노출된 액체 매체를 기판에 도포하기 위한 디바이스
US12112959B2 (en) 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
WO2020123510A1 (en) * 2018-12-14 2020-06-18 Tokyo Electron Limited Roughness reduction methods for materials using illuminated etch solutions

Also Published As

Publication number Publication date
EP2496367B1 (en) 2016-02-10
JP2013510332A (ja) 2013-03-21
CN102791391B (zh) 2016-05-25
US9662684B2 (en) 2017-05-30
SG10201407169UA (en) 2014-12-30
US10265739B2 (en) 2019-04-23
CA2778288C (en) 2016-01-19
JP5766197B2 (ja) 2015-08-19
US20170252781A1 (en) 2017-09-07
DE102009058962A1 (de) 2011-05-05
US20120211024A1 (en) 2012-08-23
HK1175141A1 (zh) 2013-06-28
CA2778288A1 (en) 2011-05-12
WO2011054405A2 (en) 2011-05-12
WO2011054405A3 (en) 2012-06-28
DE102009058962B4 (de) 2012-12-27
CN102791391A (zh) 2012-11-21
US20170320108A1 (en) 2017-11-09
EP2496367A2 (en) 2012-09-12

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