CN102791391B - 处理基片的方法和装置 - Google Patents

处理基片的方法和装置 Download PDF

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Publication number
CN102791391B
CN102791391B CN201080050483.6A CN201080050483A CN102791391B CN 102791391 B CN102791391 B CN 102791391B CN 201080050483 A CN201080050483 A CN 201080050483A CN 102791391 B CN102791391 B CN 102791391B
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CN
China
Prior art keywords
radiation
substrate
liquid
radiation source
flow chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
CN201080050483.6A
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English (en)
Chinese (zh)
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CN102791391A (zh
Inventor
U·迪策
P·德雷斯
S·辛格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUSS MicroTec Photomask Equipment GmbH and Co KG
Original Assignee
SUSS MicroTec Photomask Equipment GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN102791391A publication Critical patent/CN102791391A/zh
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Publication of CN102791391B publication Critical patent/CN102791391B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B6/00—Cleaning by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Water Treatments (AREA)
CN201080050483.6A 2009-11-03 2010-03-15 处理基片的方法和装置 Active CN102791391B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US25763309P 2009-11-03 2009-11-03
US61/257633 2009-11-03
DE102009058962A DE102009058962B4 (de) 2009-11-03 2009-12-18 Verfahren und Vorrichtung zum Behandeln von Substraten
DE102009058962.7 2009-12-18
PCT/EP2010/001629 WO2011054405A2 (en) 2009-11-03 2010-03-15 Method and apparatus for treating substrates

Publications (2)

Publication Number Publication Date
CN102791391A CN102791391A (zh) 2012-11-21
CN102791391B true CN102791391B (zh) 2016-05-25

Family

ID=43828929

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080050483.6A Active CN102791391B (zh) 2009-11-03 2010-03-15 处理基片的方法和装置

Country Status (9)

Country Link
US (3) US9662684B2 (enExample)
EP (1) EP2496367B1 (enExample)
JP (1) JP5766197B2 (enExample)
KR (1) KR20120101427A (enExample)
CN (1) CN102791391B (enExample)
CA (1) CA2778288C (enExample)
DE (1) DE102009058962B4 (enExample)
SG (1) SG10201407169UA (enExample)
WO (1) WO2011054405A2 (enExample)

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JP2013045961A (ja) * 2011-08-25 2013-03-04 Dainippon Screen Mfg Co Ltd 基板洗浄方法、基板洗浄液および基板処理装置
DE102012008220A1 (de) * 2012-04-25 2013-10-31 Süss Microtec Photomask Equipment Gmbh & Co. Kg Verfahren zum Reinigen von Fotomasken unter Verwendung von Megaschall
US9339853B2 (en) 2012-12-04 2016-05-17 The Boeing Company Surface materials for decontamination with decontaminants
US8764905B1 (en) * 2013-03-14 2014-07-01 Intel Corporation Cleaning organic residues from EUV optics and masks
CN103691714B (zh) * 2013-12-19 2015-12-02 合肥京东方光电科技有限公司 一种清洗装置和清洗方法
US9857680B2 (en) * 2014-01-14 2018-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning module, cleaning apparatus and method of cleaning photomask
JP6357319B2 (ja) * 2014-02-17 2018-07-11 株式会社プレテック 被洗浄基板の洗浄方法及び洗浄装置
CN104007610B (zh) * 2014-06-12 2018-03-06 深圳市华星光电技术有限公司 掩模版的清洗方法及装置
KR102296739B1 (ko) * 2014-10-27 2021-09-01 삼성전자 주식회사 포토마스크용 세정 조성물을 이용한 집적회로 소자 제조 방법
DE102015011229B4 (de) * 2015-08-27 2020-07-23 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
DE102015011177B4 (de) * 2015-08-27 2017-09-14 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
DE102015011228B4 (de) * 2015-08-27 2017-06-14 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
US11358172B2 (en) 2015-09-24 2022-06-14 Suss Microtec Photomask Equipment Gmbh & Co. Kg Method for treating substrates with an aqueous liquid medium exposed to UV-radiation
US9966266B2 (en) 2016-04-25 2018-05-08 United Microelectronics Corp. Apparatus for semiconductor wafer treatment and semiconductor wafer treatment
KR101961326B1 (ko) 2016-10-19 2019-07-18 세메스 주식회사 기판을 처리하는 장치의 부품 세정 방법 및 장치
US10416575B2 (en) * 2016-11-16 2019-09-17 Suss Microtec Photomask Equipment Gmbh & Co. Kg Apparatus and method for cleaning a partial area of a substrate
DE102017203351B4 (de) 2017-03-01 2021-08-05 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
JP2018163980A (ja) 2017-03-24 2018-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2017113753A (ja) * 2017-03-30 2017-06-29 株式会社トクヤマ 洗浄方法および洗浄装置
CN107203094B (zh) * 2017-07-03 2020-07-24 京东方科技集团股份有限公司 掩膜版清理装置及方法
CN108380569A (zh) * 2018-03-02 2018-08-10 常州瑞择微电子科技有限公司 高浓度oh自由基发生装置
CN108816870B (zh) * 2018-04-08 2021-05-25 苏州珮凯科技有限公司 半导体8寸晶元制造薄膜制程的WxZ工艺的陶瓷环状零部件再生方法
US12112959B2 (en) 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
US10896824B2 (en) * 2018-12-14 2021-01-19 Tokyo Electron Limited Roughness reduction methods for materials using illuminated etch solutions
CN110112084A (zh) * 2019-05-22 2019-08-09 长江存储科技有限责任公司 半导体器件清洗装置
KR102868707B1 (ko) * 2019-07-01 2025-10-02 에이에스엠엘 네델란즈 비.브이. 패터닝 디바이스와 기타 기판의 표면 처리를 위한 표면 처리 장치 및 방법
CN111906093A (zh) * 2020-07-15 2020-11-10 常州瑞择微电子科技有限公司 一种大面积光子发生喷头
CN112435938A (zh) * 2020-11-11 2021-03-02 深圳市华星光电半导体显示技术有限公司 基板清洗设备及基板清洗方法
US11798799B2 (en) * 2021-08-09 2023-10-24 Applied Materials, Inc. Ultraviolet and ozone clean system

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US5814156A (en) * 1993-09-08 1998-09-29 Uvtech Systems Inc. Photoreactive surface cleaning
US6028316A (en) * 1996-08-28 2000-02-22 New Star Lasers, Inc. Method and apparatus for removal of material utilizing near-blackbody radiator means
CN1344590A (zh) * 2000-06-29 2002-04-17 株式会社D.M.S 多功能清洗模块及应用该模块的清洗设备
US20020083961A1 (en) * 2000-10-04 2002-07-04 Toshihito Tsuga Method and apparatus for cleaning semiconductor wafer
US6869487B1 (en) * 1997-05-09 2005-03-22 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
CN1653596A (zh) * 2002-04-16 2005-08-10 禧沛股份有限公司 光刻胶除去装置和光刻胶除去方法
US20060207629A1 (en) * 2004-12-16 2006-09-21 Sematech, Inc. Method and apparatus for an in-situ ultraviolet cleaning tool
CN1958177A (zh) * 2005-10-24 2007-05-09 史考特公司 用于衬底、尤其是掩膜和掩膜基底的无酸清洗工艺
US20080113518A1 (en) * 2003-03-25 2008-05-15 Renesas Technology Corp. Wet etching method using ultraviolet light and method of manufacturing semiconductor device

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JPH04277748A (ja) 1991-03-06 1992-10-02 Mitsubishi Paper Mills Ltd 平版印刷版
JPH11121417A (ja) * 1997-10-09 1999-04-30 Mitsubishi Electric Corp 半導体基板の処理システムおよび処理方法
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JP5140916B2 (ja) * 2005-10-07 2013-02-13 富士通株式会社 光化学処理装置及び光化学処理方法
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JP5019156B2 (ja) * 2006-08-21 2012-09-05 ウシオ電機株式会社 エキシマランプ装置
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Publication number Priority date Publication date Assignee Title
US5236602A (en) * 1989-04-03 1993-08-17 Hughes Aircraft Company Dense fluid photochemical process for liquid substrate treatment
US5814156A (en) * 1993-09-08 1998-09-29 Uvtech Systems Inc. Photoreactive surface cleaning
US6028316A (en) * 1996-08-28 2000-02-22 New Star Lasers, Inc. Method and apparatus for removal of material utilizing near-blackbody radiator means
US6869487B1 (en) * 1997-05-09 2005-03-22 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
CN1344590A (zh) * 2000-06-29 2002-04-17 株式会社D.M.S 多功能清洗模块及应用该模块的清洗设备
US20020083961A1 (en) * 2000-10-04 2002-07-04 Toshihito Tsuga Method and apparatus for cleaning semiconductor wafer
CN1653596A (zh) * 2002-04-16 2005-08-10 禧沛股份有限公司 光刻胶除去装置和光刻胶除去方法
US20080113518A1 (en) * 2003-03-25 2008-05-15 Renesas Technology Corp. Wet etching method using ultraviolet light and method of manufacturing semiconductor device
US20060207629A1 (en) * 2004-12-16 2006-09-21 Sematech, Inc. Method and apparatus for an in-situ ultraviolet cleaning tool
CN1958177A (zh) * 2005-10-24 2007-05-09 史考特公司 用于衬底、尤其是掩膜和掩膜基底的无酸清洗工艺

Also Published As

Publication number Publication date
EP2496367B1 (en) 2016-02-10
JP2013510332A (ja) 2013-03-21
KR20120101427A (ko) 2012-09-13
US9662684B2 (en) 2017-05-30
SG10201407169UA (en) 2014-12-30
US10265739B2 (en) 2019-04-23
CA2778288C (en) 2016-01-19
JP5766197B2 (ja) 2015-08-19
US20170252781A1 (en) 2017-09-07
DE102009058962A1 (de) 2011-05-05
US20120211024A1 (en) 2012-08-23
HK1175141A1 (zh) 2013-06-28
CA2778288A1 (en) 2011-05-12
WO2011054405A2 (en) 2011-05-12
WO2011054405A3 (en) 2012-06-28
DE102009058962B4 (de) 2012-12-27
CN102791391A (zh) 2012-11-21
US20170320108A1 (en) 2017-11-09
EP2496367A2 (en) 2012-09-12

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