CA2556066C - Vapor phase growth apparatus - Google Patents

Vapor phase growth apparatus Download PDF

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Publication number
CA2556066C
CA2556066C CA2556066A CA2556066A CA2556066C CA 2556066 C CA2556066 C CA 2556066C CA 2556066 A CA2556066 A CA 2556066A CA 2556066 A CA2556066 A CA 2556066A CA 2556066 C CA2556066 C CA 2556066C
Authority
CA
Canada
Prior art keywords
wafer
vapor phase
phase growth
growth apparatus
containing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA2556066A
Other languages
English (en)
French (fr)
Other versions
CA2556066A1 (en
Inventor
Eiichi Shimizu
Nobuhito Makino
Manabu Kawabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Publication of CA2556066A1 publication Critical patent/CA2556066A1/en
Application granted granted Critical
Publication of CA2556066C publication Critical patent/CA2556066C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/10Heating of the reaction chamber or the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/12Substrate holders or susceptors

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
CA2556066A 2004-02-25 2005-02-15 Vapor phase growth apparatus Expired - Lifetime CA2556066C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004-049125 2004-02-25
JP2004049125 2004-02-25
PCT/JP2005/002225 WO2005081298A1 (ja) 2004-02-25 2005-02-15 気相成長装置

Publications (2)

Publication Number Publication Date
CA2556066A1 CA2556066A1 (en) 2005-09-01
CA2556066C true CA2556066C (en) 2013-07-16

Family

ID=34879535

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2556066A Expired - Lifetime CA2556066C (en) 2004-02-25 2005-02-15 Vapor phase growth apparatus

Country Status (8)

Country Link
US (1) US7670434B2 (enExample)
EP (1) EP1720200B1 (enExample)
JP (1) JP4647595B2 (enExample)
KR (1) KR101322217B1 (enExample)
CN (1) CN100539027C (enExample)
CA (1) CA2556066C (enExample)
TW (1) TW200539322A (enExample)
WO (1) WO2005081298A1 (enExample)

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Publication number Priority date Publication date Assignee Title
JP2009502039A (ja) * 2005-07-21 2009-01-22 エルピーイー ソシエタ ペル アチオニ ウェーハ処理装置の処理室の中でサセプタを支持し回転させるためのシステム
KR100925060B1 (ko) * 2007-11-08 2009-11-03 삼성전기주식회사 화학 기상 증착 장치용 서셉터
EP2562291A1 (en) * 2008-08-29 2013-02-27 Veeco Instruments Inc. Wafer carrier with varying thermal resistance
US8486726B2 (en) * 2009-12-02 2013-07-16 Veeco Instruments Inc. Method for improving performance of a substrate carrier
JP5031910B2 (ja) * 2010-06-23 2012-09-26 シャープ株式会社 気相成長装置
TW201239124A (en) * 2011-03-22 2012-10-01 Chi Mei Lighting Tech Corp Wafer susceptor and chemical vapor deposition apparatus
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
CN103668123A (zh) * 2012-09-19 2014-03-26 甘志银 金属有机物化学气相沉积设备的载片盘
US10167571B2 (en) 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
US9716010B2 (en) 2013-11-12 2017-07-25 Globalfoundries Inc. Handle wafer
CN104818527A (zh) * 2015-04-08 2015-08-05 上海晶盟硅材料有限公司 外延片生产设备
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
TWI656235B (zh) * 2017-07-28 2019-04-11 漢民科技股份有限公司 化學氣相沉積系統
WO2025155610A1 (en) * 2024-01-18 2025-07-24 Lam Research Corporation Heat tuner for heating substrates in a processing tool

Family Cites Families (25)

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JPS5944818A (ja) 1982-09-07 1984-03-13 Toshiba Corp 加熱基台
JPS61112325A (ja) * 1984-11-07 1986-05-30 Hitachi Hokkai Semiconductor Kk 板状物回転処理装置
JPS61242014A (ja) 1985-04-19 1986-10-28 Toshiba Corp 気相成長装置用サセプタ
JPH02151024A (ja) * 1988-12-01 1990-06-11 Kyushu Electron Metal Co Ltd 気相成長装置
JP2511336B2 (ja) * 1991-05-15 1996-06-26 株式会社荏原総合研究所 有機性汚水や汚泥からの水素生産法及び装置
JPH07176482A (ja) 1991-05-31 1995-07-14 At & T Corp エピタキシャル成長方法および装置
JPH06124901A (ja) 1992-10-09 1994-05-06 Furukawa Electric Co Ltd:The 化合物半導体薄膜の製造方法
JPH07136694A (ja) * 1993-11-16 1995-05-30 Ebara Res Co Ltd 有機性廃棄物の加圧水素発酵法
JPH0936049A (ja) * 1995-07-21 1997-02-07 Mitsubishi Electric Corp 気相成長装置およびこれによって製造された化合物半導体装置
US6001183A (en) * 1996-06-10 1999-12-14 Emcore Corporation Wafer carriers for epitaxial growth processes
JP3336897B2 (ja) * 1997-02-07 2002-10-21 三菱住友シリコン株式会社 気相成長装置用サセプター
JPH118119A (ja) 1997-06-19 1999-01-12 Nissan Motor Co Ltd 電子コントロールユニット
JP2000355766A (ja) 1999-06-15 2000-12-26 Hitachi Kokusai Electric Inc 基板処理装置及び基板処理方法
US6494955B1 (en) * 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
JP2002134484A (ja) 2000-10-19 2002-05-10 Asm Japan Kk 半導体基板保持装置
JP2003037071A (ja) * 2001-07-25 2003-02-07 Shin Etsu Handotai Co Ltd サセプタ、気相成長装置および気相成長方法
JP3771475B2 (ja) * 2001-10-05 2006-04-26 忠行 今中 水素の製造法および製造装置
JP3857106B2 (ja) * 2001-11-06 2006-12-13 株式会社タクマ 微生物を用いた水素及びメタンの製造方法ならびに装置
JP4003527B2 (ja) * 2002-04-25 2007-11-07 信越半導体株式会社 サセプタおよび半導体ウェーハの製造方法
JP4216541B2 (ja) 2002-06-13 2009-01-28 日鉱金属株式会社 気相成長装置
JP3882141B2 (ja) 2002-06-13 2007-02-14 日鉱金属株式会社 気相成長装置および気相成長方法
JP2004194625A (ja) * 2002-12-20 2004-07-15 Densei:Kk 水素生成装置および水素生成方法
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JP2005066420A (ja) * 2003-08-20 2005-03-17 Japan Science & Technology Agency 廃棄パンの水素・メタン二段発酵処理方法

Also Published As

Publication number Publication date
TW200539322A (en) 2005-12-01
US7670434B2 (en) 2010-03-02
KR20070019689A (ko) 2007-02-15
JPWO2005081298A1 (ja) 2008-01-17
EP1720200A1 (en) 2006-11-08
EP1720200A4 (en) 2007-01-31
EP1720200B1 (en) 2014-12-03
WO2005081298A1 (ja) 2005-09-01
JP4647595B2 (ja) 2011-03-09
CN1965390A (zh) 2007-05-16
KR101322217B1 (ko) 2013-10-25
CA2556066A1 (en) 2005-09-01
TWI345264B (enExample) 2011-07-11
US20070163504A1 (en) 2007-07-19
CN100539027C (zh) 2009-09-09

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