CA2553251A1 - Epoxy adhesive composition - Google Patents
Epoxy adhesive composition Download PDFInfo
- Publication number
- CA2553251A1 CA2553251A1 CA002553251A CA2553251A CA2553251A1 CA 2553251 A1 CA2553251 A1 CA 2553251A1 CA 002553251 A CA002553251 A CA 002553251A CA 2553251 A CA2553251 A CA 2553251A CA 2553251 A1 CA2553251 A1 CA 2553251A1
- Authority
- CA
- Canada
- Prior art keywords
- component
- composition according
- acrylonitrile
- epoxy adhesive
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 77
- 229920006332 epoxy adhesive Polymers 0.000 title claims abstract description 44
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012745 toughening agent Substances 0.000 claims abstract description 8
- 229920000459 Nitrile rubber Polymers 0.000 claims description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 235000013824 polyphenols Nutrition 0.000 claims description 6
- -1 hydroxyl- Chemical group 0.000 claims description 5
- 150000002431 hydrogen Chemical group 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical group 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- LMBFAGIMSUYTBN-MPZNNTNKSA-N teixobactin Chemical compound C([C@H](C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H](CCC(N)=O)C(=O)N[C@H]([C@@H](C)CC)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H]1C(N[C@@H](C)C(=O)N[C@@H](C[C@@H]2NC(=N)NC2)C(=O)N[C@H](C(=O)O[C@H]1C)[C@@H](C)CC)=O)NC)C1=CC=CC=C1 LMBFAGIMSUYTBN-MPZNNTNKSA-N 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 abstract description 2
- 229920002857 polybutadiene Polymers 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000000047 product Substances 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 229910000831 Steel Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920003226 polyurethane urea Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002436 steel type Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04005984.2A EP1574537B2 (en) | 2004-03-12 | 2004-03-12 | Epoxy adhesive composition |
| EP04005984.2 | 2004-03-12 | ||
| PCT/EP2005/002361 WO2005095484A1 (en) | 2004-03-12 | 2005-03-07 | Epoxy adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2553251A1 true CA2553251A1 (en) | 2005-10-13 |
Family
ID=34814318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002553251A Abandoned CA2553251A1 (en) | 2004-03-12 | 2005-03-07 | Epoxy adhesive composition |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7910656B2 (enExample) |
| EP (1) | EP1574537B2 (enExample) |
| JP (1) | JP5102018B2 (enExample) |
| KR (1) | KR101151092B1 (enExample) |
| CN (1) | CN1930206B (enExample) |
| AT (1) | ATE352576T1 (enExample) |
| BR (1) | BRPI0506523B1 (enExample) |
| CA (1) | CA2553251A1 (enExample) |
| DE (1) | DE602004004501T3 (enExample) |
| ES (1) | ES2276182T5 (enExample) |
| WO (1) | WO2005095484A1 (enExample) |
Families Citing this family (87)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1431325A1 (de) * | 2002-12-17 | 2004-06-23 | Sika Technology AG | Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit |
| US7125461B2 (en) | 2003-05-07 | 2006-10-24 | L & L Products, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
| US7199165B2 (en) | 2003-06-26 | 2007-04-03 | L & L Products, Inc. | Expandable material |
| WO2005007766A1 (en) * | 2003-07-07 | 2005-01-27 | Dow Global Technologies Inc. | Adhesive epoxy composition and process for applying it |
| US7557168B2 (en) * | 2003-07-07 | 2009-07-07 | Dow Global Technologies, Inc. | Applying adhesive stream of epoxy resin, rubber modified epoxy resin and capped isocyanate prepolymer |
| EP1498441A1 (de) * | 2003-07-16 | 2005-01-19 | Sika Technology AG | Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren |
| EP1602702B2 (en) * | 2004-06-01 | 2020-09-16 | Dow Global Technologies LLC | Epoxy adhesive composition |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| EP1695990A1 (en) | 2005-02-28 | 2006-08-30 | Dow Global Technologies Inc. | Two-component epoxy adhesive composition |
| DE602005020260D1 (de) * | 2005-06-02 | 2010-05-12 | Dow Global Technologies Inc | Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis |
| EP1741734A1 (de) * | 2005-07-05 | 2007-01-10 | Sika Technology AG | Tieftemperaturschlagzähe hitze-härtbare Epoxidharzzusammensetzung mit Epoxidfestharzen |
| ES2375498T3 (es) * | 2005-08-24 | 2012-03-01 | Henkel Ag & Co. Kgaa | Resinas epoxi que tienen una resistencia al impacto mejorada. |
| EP1876194A1 (de) * | 2006-06-30 | 2008-01-09 | Sika Technology AG | Hitzehärtende Zusammensetzung geeignet zum Verkleben von beschichteten Substraten |
| PL2049611T3 (pl) | 2006-07-31 | 2019-04-30 | Henkel Ag & Co Kgaa | Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych |
| EP2076578A4 (en) | 2006-10-06 | 2011-01-19 | Henkel Ag & Co Kgaa | POWDER-RESISTANT EPOXY-BASED PUMP-BASED ADHESIVES |
| EP1916272A1 (de) * | 2006-10-24 | 2008-04-30 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend ein blockiertes und ein epoxidterminiertes Polyurethanprepolymer |
| DE602007010346D1 (de) * | 2006-12-21 | 2010-12-16 | Dow Global Technologies Inc | Zusammensetzung, die zur verwendung als klebstoff beim einbau von fahrzeugfenstern brauchbar ist |
| WO2008127925A2 (en) * | 2007-04-11 | 2008-10-23 | Dow Global Technologies, Inc. | Structural epoxy resins containing core-shell rubbers |
| ATE510897T1 (de) * | 2007-04-11 | 2011-06-15 | Dow Global Technologies Llc | Hitzebeständige strukturelle epoxidharze |
| ATE541001T1 (de) * | 2007-06-12 | 2012-01-15 | Zephyros Inc | Schlagzäh modifizierter klebstoff |
| JP5662145B2 (ja) * | 2007-06-20 | 2015-01-28 | ダウ グローバル テクノロジーズ エルエルシー | 温度変化に対する非常に低い感受性を有する衝突耐久性エポキシ接着剤 |
| BRPI0813070B1 (pt) * | 2007-07-23 | 2020-10-13 | Dow Global Technologies Inc | composição de duas partes e método para colar dois ou mais substratos juntos |
| EP2181156A1 (en) * | 2007-08-17 | 2010-05-05 | Dow Global Technologies Inc. | Two part crash durable epoxy adhesives |
| EP2205692B1 (en) * | 2007-10-30 | 2020-02-19 | Henkel AG & Co. KGaA | Epoxy paste adhesives resistant to wash-off |
| DE502008001517D1 (de) * | 2008-01-30 | 2010-11-25 | Sika Technology Ag | Auswaschbeständige hitzehärtende Epoxidharzklebstoffe |
| US20110027574A1 (en) * | 2008-03-26 | 2011-02-03 | Lord Corporation | Coating for elastomeric substrates |
| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
| JP5395904B2 (ja) * | 2008-08-11 | 2014-01-22 | ダウ グローバル テクノロジーズ エルエルシー | フェノールとヒドロキシ末端化アクリレートまたはヒドロキシ末端化メタクリレートとでキャップされたエラストマー型強化剤を含有する一液型構造用エポキシ樹脂接着剤 |
| EP2318448B1 (en) * | 2008-08-22 | 2018-08-22 | Dow Global Technologies LLC | Adhesive composition adapted for bonding large mass parts to structures |
| US20110297317A1 (en) | 2009-02-26 | 2011-12-08 | Andreas Lutz | One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol |
| KR101093348B1 (ko) * | 2009-08-17 | 2011-12-14 | 헨켈테크놀러지스 (유) | 접착용 다기능 처리제 및 이를 이용한 신발의 제조방법 |
| KR20110018061A (ko) | 2009-08-17 | 2011-02-23 | 헨켈테크놀러지스 (유) | 접착용 다기능 처리제를 이용한 신발의 제조방법 |
| GB0916205D0 (en) | 2009-09-15 | 2009-10-28 | Zephyros Inc | Improvements in or relating to cavity filling |
| WO2011056357A1 (en) | 2009-11-05 | 2011-05-12 | Dow Global Technologies Llc | Structural epoxy resin adhasives containing elastomeric tougheners capped with ketoximes |
| BR112012022319B1 (pt) | 2010-03-04 | 2020-01-28 | Zephyros Inc | laminado estrutural compósito |
| JP5755737B2 (ja) | 2010-06-29 | 2015-07-29 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂用貯蔵安定性熱活性化第三級アミン触媒 |
| WO2012000171A1 (en) | 2010-06-29 | 2012-01-05 | Dow Global Technologies Llc | Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
| US8440746B2 (en) | 2010-12-02 | 2013-05-14 | Ppg Industries Ohio, Inc | One component epoxy structural adhesive composition prepared from renewable resources |
| US9074040B2 (en) * | 2010-12-20 | 2015-07-07 | Mitsui Chemicals, Inc. | Curable adhesive compositions |
| US9181463B2 (en) | 2010-12-26 | 2015-11-10 | Dow Global Technologies Llc | Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds |
| US9487685B2 (en) | 2011-10-14 | 2016-11-08 | Lg Chem, Ltd. | Adhesive for polarizing plate and polarizing plate including the same |
| EP2828308B1 (en) | 2012-03-23 | 2016-05-04 | Dow Global Technologies LLC | Crash-durable adhesive with enhanced stress durability |
| BR112014018126B1 (pt) | 2012-03-23 | 2021-07-13 | Dow Global Technologies Llc | Adesivo estrutural termocurável e processo para unir e soldar membros metálicos |
| EP2730594A1 (de) | 2012-11-12 | 2014-05-14 | Sika Technology AG | Reaktive Flüssigkautschuke aus blockierten Isocyanat-terminierten Präpolymeren mit Glycolfänger |
| WO2014072515A1 (de) | 2012-11-12 | 2014-05-15 | Sika Technology Ag | Neue schlagzähigkeitsmodifikatoren für epoxy-basierte klebstoffe |
| US10577523B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Relating to thermosetting adhesive films |
| US20170107408A1 (en) * | 2014-07-08 | 2017-04-20 | Dow Europe Gmbh | DELAYED CURING HIGH Tg CRASH DURABLE ADHESIVE |
| BR112017000856A2 (pt) | 2014-07-23 | 2017-12-05 | Dow Global Technologies Llc | adesivos estruturais tendo resistência à lavagem melhorada e método para distribuir os mesmos |
| GB201417985D0 (en) | 2014-10-10 | 2014-11-26 | Zephyros Inc | Improvements in or relating to structural adhesives |
| EP3218433A1 (en) * | 2014-11-11 | 2017-09-20 | Dow Global Technologies LLC | Adhesive composition with glass spheres |
| WO2016108958A1 (en) | 2014-12-31 | 2016-07-07 | Dow Global Technologies Llc | Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance |
| US10081704B2 (en) | 2015-03-24 | 2018-09-25 | Evonik Degussa Gmbh | Epoxy systems having improved fracture toughness |
| US20180163104A1 (en) * | 2015-06-02 | 2018-06-14 | Dow Global Technologies Llc | Blocked polyurethane tougheners for epoxy adhesives |
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-
2004
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- 2004-03-12 AT AT04005984T patent/ATE352576T1/de not_active IP Right Cessation
- 2004-03-12 EP EP04005984.2A patent/EP1574537B2/en not_active Expired - Lifetime
- 2004-03-12 ES ES04005984.2T patent/ES2276182T5/es not_active Expired - Lifetime
-
2005
- 2005-03-07 CA CA002553251A patent/CA2553251A1/en not_active Abandoned
- 2005-03-07 WO PCT/EP2005/002361 patent/WO2005095484A1/en not_active Ceased
- 2005-03-07 CN CN2005800073567A patent/CN1930206B/zh not_active Expired - Lifetime
- 2005-03-07 JP JP2007502252A patent/JP5102018B2/ja not_active Expired - Fee Related
- 2005-03-07 KR KR1020067018504A patent/KR101151092B1/ko not_active Expired - Lifetime
- 2005-03-07 BR BRPI0506523-2A patent/BRPI0506523B1/pt not_active IP Right Cessation
- 2005-03-11 US US11/078,088 patent/US7910656B2/en active Active
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|---|---|
| CN1930206A (zh) | 2007-03-14 |
| EP1574537A1 (en) | 2005-09-14 |
| BRPI0506523B1 (pt) | 2021-10-13 |
| ATE352576T1 (de) | 2007-02-15 |
| EP1574537B2 (en) | 2014-12-24 |
| DE602004004501T2 (de) | 2007-11-15 |
| CN1930206B (zh) | 2011-05-18 |
| WO2005095484A1 (en) | 2005-10-13 |
| ES2276182T5 (es) | 2015-04-10 |
| JP2007528923A (ja) | 2007-10-18 |
| US7910656B2 (en) | 2011-03-22 |
| US20050209401A1 (en) | 2005-09-22 |
| DE602004004501T3 (de) | 2015-05-28 |
| KR20070021152A (ko) | 2007-02-22 |
| JP5102018B2 (ja) | 2012-12-19 |
| ES2276182T3 (es) | 2007-06-16 |
| BRPI0506523A (pt) | 2007-02-27 |
| DE602004004501D1 (de) | 2007-03-15 |
| KR101151092B1 (ko) | 2012-06-01 |
| EP1574537B1 (en) | 2007-01-24 |
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