CA2383740C - Silicon-based sensor system - Google Patents

Silicon-based sensor system Download PDF

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Publication number
CA2383740C
CA2383740C CA002383740A CA2383740A CA2383740C CA 2383740 C CA2383740 C CA 2383740C CA 002383740 A CA002383740 A CA 002383740A CA 2383740 A CA2383740 A CA 2383740A CA 2383740 C CA2383740 C CA 2383740C
Authority
CA
Canada
Prior art keywords
sensor system
transducer element
carrier member
contact
transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002383740A
Other languages
English (en)
French (fr)
Other versions
CA2383740A1 (en
Inventor
Matthias Mullenborn
Jochen F. Kuhmann
Peter U. Scheel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pulse Mems ApS
TDK Corp
Original Assignee
MEMS APS
Sonion Lyngby AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,434 external-priority patent/US6522762B1/en
Application filed by MEMS APS, Sonion Lyngby AS filed Critical MEMS APS
Publication of CA2383740A1 publication Critical patent/CA2383740A1/en
Application granted granted Critical
Publication of CA2383740C publication Critical patent/CA2383740C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Air Bags (AREA)
  • Silicon Polymers (AREA)
CA002383740A 1999-09-06 2000-09-06 Silicon-based sensor system Expired - Fee Related CA2383740C (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DKPA199901254 1999-09-06
DKPA1999/01254 1999-09-06
US39162899A 1999-09-07 1999-09-07
US09/391,628 1999-09-07
US09/570,434 US6522762B1 (en) 1999-09-07 2000-05-12 Silicon-based sensor system
US09/570,434 2000-05-12
PCT/DK2000/000491 WO2001019134A2 (en) 1999-09-06 2000-09-06 Silicon-based sensor system

Publications (2)

Publication Number Publication Date
CA2383740A1 CA2383740A1 (en) 2001-03-15
CA2383740C true CA2383740C (en) 2005-04-05

Family

ID=27221189

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002383740A Expired - Fee Related CA2383740C (en) 1999-09-06 2000-09-06 Silicon-based sensor system

Country Status (10)

Country Link
EP (1) EP1214864B1 (ja)
JP (2) JP4459498B2 (ja)
CN (1) CN1203726C (ja)
AT (1) ATE242587T1 (ja)
AU (1) AU6984100A (ja)
CA (1) CA2383740C (ja)
DE (1) DE60003199T2 (ja)
DK (1) DK1214864T3 (ja)
PL (1) PL209935B1 (ja)
WO (1) WO2001019134A2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102086020A (zh) * 2009-12-07 2011-06-08 罗伯特.博世有限公司 用于制造硅中间承载体的方法
CN111711903A (zh) * 2020-06-24 2020-09-25 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
JP2004356708A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構及びその製造方法
CN100515119C (zh) * 2003-08-12 2009-07-15 中国科学院声学研究所 一种用于硅微电容传声器中的芯片及其制备方法
CN100499877C (zh) * 2003-12-17 2009-06-10 中国科学院声学研究所 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法
DE102004011203B4 (de) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
JP4553611B2 (ja) 2004-03-15 2010-09-29 三洋電機株式会社 回路装置
JP4539450B2 (ja) * 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
DE102005008512B4 (de) * 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005056759A1 (de) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
CN101005718B (zh) * 2006-01-16 2011-04-20 财团法人工业技术研究院 微型声学传感器及其制造方法
JP4771290B2 (ja) * 2006-07-19 2011-09-14 ヤマハ株式会社 圧力センサの製造方法
DE112007003083B4 (de) * 2006-12-22 2019-05-09 Tdk Corp. Mikrofonbaugruppe mit Unterfüllmittel mit niedrigem Wärmeausdehnungskoeffizienten
JP4893380B2 (ja) * 2007-03-09 2012-03-07 ヤマハ株式会社 コンデンサマイク装置
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
DE102007008518A1 (de) * 2007-02-21 2008-08-28 Infineon Technologies Ag Modul mit einem ein bewegliches Element umfassenden Halbleiterchip
US8767983B2 (en) 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
JP2009081624A (ja) * 2007-09-26 2009-04-16 Rohm Co Ltd 半導体センサ装置
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
EP2094028B8 (en) * 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring
CN102187685B (zh) * 2008-10-14 2015-03-11 美商楼氏电子有限公司 具有多个换能器元件的传声器
US20100303274A1 (en) * 2009-05-18 2010-12-02 William Ryan Microphone Having Reduced Vibration Sensitivity
KR101609270B1 (ko) 2009-08-12 2016-04-06 삼성전자주식회사 압전형 마이크로 스피커 및 그 제조 방법
IT1397976B1 (it) * 2009-12-23 2013-02-04 St Microelectronics Rousset Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.
JP2013093637A (ja) * 2010-02-24 2013-05-16 Panasonic Corp 半導体装置及びその製造方法
TWI491009B (zh) 2010-10-08 2015-07-01 晶片級電磁干擾屏蔽結構及製造方法
CN102456669B (zh) * 2010-10-25 2015-07-22 环旭电子股份有限公司 芯片级电磁干扰屏蔽结构及制造方法
CN102726065B (zh) * 2010-12-30 2014-06-04 歌尔声学股份有限公司 Mems麦克风及其封装方法
JP5721452B2 (ja) * 2011-01-27 2015-05-20 ローム株式会社 静電容量型ｍｅｍｓセンサ
JP5799619B2 (ja) 2011-06-24 2015-10-28 船井電機株式会社 マイクロホンユニット
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US20130147040A1 (en) * 2011-12-09 2013-06-13 Robert Bosch Gmbh Mems chip scale package
DE102012203373A1 (de) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren
US20140090485A1 (en) * 2012-10-02 2014-04-03 Robert Bosch Gmbh MEMS Pressure Sensor Assembly
DE112012007235T5 (de) * 2012-12-18 2015-09-24 Epcos Ag Top-Port-Mems-Mikrofon und Verfahren zu dessen Herstellung
US20140312439A1 (en) * 2013-04-19 2014-10-23 Infineon Technologies Ag Microphone Module and Method of Manufacturing Thereof
ITTO20130350A1 (it) * 2013-04-30 2014-10-31 St Microelectronics Srl Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems
US9264832B2 (en) 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
GB2529134B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
CN106716636B (zh) * 2014-09-17 2021-05-28 英特尔公司 具有使用穿硅过孔(tsv)的集成麦克风器件的管芯
CN104780490A (zh) * 2015-04-20 2015-07-15 歌尔声学股份有限公司 一种mems麦克风的封装结构及其制造方法
TWI660466B (zh) * 2017-04-26 2019-05-21 矽品精密工業股份有限公司 封裝結構及其製法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533795A (en) * 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102086020A (zh) * 2009-12-07 2011-06-08 罗伯特.博世有限公司 用于制造硅中间承载体的方法
CN102086020B (zh) * 2009-12-07 2016-01-27 罗伯特.博世有限公司 用于制造硅中间承载体的方法
CN111711903A (zh) * 2020-06-24 2020-09-25 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风
CN111711903B (zh) * 2020-06-24 2021-10-01 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

Also Published As

Publication number Publication date
DK1214864T3 (da) 2003-08-25
EP1214864A2 (en) 2002-06-19
JP2007028671A (ja) 2007-02-01
WO2001019134A2 (en) 2001-03-15
DE60003199D1 (de) 2003-07-10
ATE242587T1 (de) 2003-06-15
JP4459498B2 (ja) 2010-04-28
JP2003508998A (ja) 2003-03-04
DE60003199T2 (de) 2004-07-01
CN1387741A (zh) 2002-12-25
JP4303742B2 (ja) 2009-07-29
CN1203726C (zh) 2005-05-25
CA2383740A1 (en) 2001-03-15
PL209935B1 (pl) 2011-11-30
EP1214864B1 (en) 2003-06-04
AU6984100A (en) 2001-04-10
PL354095A1 (en) 2003-12-29
WO2001019134A3 (en) 2001-09-07

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Effective date: 20190906