CA2353326C - Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture - Google Patents

Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture Download PDF

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Publication number
CA2353326C
CA2353326C CA2353326A CA2353326A CA2353326C CA 2353326 C CA2353326 C CA 2353326C CA 2353326 A CA2353326 A CA 2353326A CA 2353326 A CA2353326 A CA 2353326A CA 2353326 C CA2353326 C CA 2353326C
Authority
CA
Canada
Prior art keywords
layer
light emitting
emitting device
scattering material
light scattering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA2353326A
Other languages
English (en)
French (fr)
Other versions
CA2353326A1 (en
Inventor
Yoshifumi Nagai
Yuichi Fujiwara
Kunihiro Izuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of CA2353326A1 publication Critical patent/CA2353326A1/en
Application granted granted Critical
Publication of CA2353326C publication Critical patent/CA2353326C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
CA2353326A 2000-07-21 2001-07-20 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture Expired - Lifetime CA2353326C (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000219932 2000-07-21
JP219932/2000 2000-07-21
JP2001202600 2001-07-03
JP202600/2001 2001-07-03
JP2001217915A JP4066620B2 (ja) 2000-07-21 2001-07-18 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法
JP217915/2001 2001-07-18

Publications (2)

Publication Number Publication Date
CA2353326A1 CA2353326A1 (en) 2002-01-21
CA2353326C true CA2353326C (en) 2011-07-12

Family

ID=27344122

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2353326A Expired - Lifetime CA2353326C (en) 2000-07-21 2001-07-20 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture

Country Status (4)

Country Link
US (4) US6657382B2 (enExample)
EP (2) EP2244245B1 (enExample)
JP (1) JP4066620B2 (enExample)
CA (1) CA2353326C (enExample)

Families Citing this family (177)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100038121A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
AU6531600A (en) 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7637737B2 (en) 1999-12-21 2009-12-29 S.C. Johnson & Son, Inc. Candle assembly with light emitting system
US7699603B2 (en) 1999-12-21 2010-04-20 S.C. Johnson & Son, Inc. Multisensory candle assembly
JP4066620B2 (ja) * 2000-07-21 2008-03-26 日亜化学工業株式会社 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法
US6833566B2 (en) 2001-03-28 2004-12-21 Toyoda Gosei Co., Ltd. Light emitting diode with heat sink
US6812481B2 (en) * 2001-09-03 2004-11-02 Toyoda Gosei Co., Ltd. LED device and manufacturing method thereof
JP2003234509A (ja) * 2002-02-08 2003-08-22 Citizen Electronics Co Ltd 発光ダイオード
DE10220583B4 (de) * 2002-03-27 2007-07-05 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
TW574822B (en) * 2002-09-19 2004-02-01 Veutron Corp Light source module for scanning
JP4201167B2 (ja) * 2002-09-26 2008-12-24 シチズン電子株式会社 白色発光装置の製造方法
JP4280050B2 (ja) * 2002-10-07 2009-06-17 シチズン電子株式会社 白色発光装置
JP4254266B2 (ja) * 2003-02-20 2009-04-15 豊田合成株式会社 発光装置及び発光装置の製造方法
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
JP4263051B2 (ja) 2003-07-31 2009-05-13 俊信 横尾 発光ダイオード
JP5177186B2 (ja) * 2003-10-30 2013-04-03 日亜化学工業株式会社 半導体素子用の支持体及びその製造方法並びに半導体装置
TWI291770B (en) * 2003-11-14 2007-12-21 Hon Hai Prec Ind Co Ltd Surface light source device and light emitting diode
JP2005197369A (ja) * 2004-01-05 2005-07-21 Toshiba Corp 光半導体装置
JP4451178B2 (ja) * 2004-03-25 2010-04-14 スタンレー電気株式会社 発光デバイス
DE102004015293B3 (de) * 2004-03-29 2005-12-08 Albis Plastic Gmbh Beleuchtbare Informationseinheit für technische Geräte oder Maschinen und deren Verwendung
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
USD513477S1 (en) * 2004-05-18 2006-01-10 Nicotech Limited Beacon
KR100616594B1 (ko) * 2004-07-02 2006-08-28 삼성전기주식회사 색 혼합성이 향상된 ｒｇｂ 발광 다이오드 패키지
JP4571139B2 (ja) * 2004-08-10 2010-10-27 ルネサスエレクトロニクス株式会社 発光装置および発光装置の製造方法
US7477013B2 (en) * 2004-08-12 2009-01-13 E. I. Du Pont De Nemours And Company Organic light emitting devices with distinct resistance regions
JP2006056105A (ja) * 2004-08-19 2006-03-02 Ryoko:Kk 電飾樹木構造体
US20060067073A1 (en) * 2004-09-30 2006-03-30 Chu-Chi Ting White led device
JP2006140362A (ja) * 2004-11-15 2006-06-01 Nitto Denko Corp 光半導体素子封止用シートおよび該シートを用いた光半導体装置の製造方法
TWI317829B (en) * 2004-12-15 2009-12-01 Epistar Corp Led illumination device and application thereof
US7473889B2 (en) * 2004-12-16 2009-01-06 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Optical integrated circuit package
JP4665158B2 (ja) * 2004-12-28 2011-04-06 スタンレー電気株式会社 発光装置
US20060154393A1 (en) * 2005-01-11 2006-07-13 Doan Trung T Systems and methods for removing operating heat from a light emitting diode
US20060151801A1 (en) * 2005-01-11 2006-07-13 Doan Trung T Light emitting diode with thermo-electric cooler
US20070205969A1 (en) 2005-02-23 2007-09-06 Pixtronix, Incorporated Direct-view MEMS display devices and methods for generating images thereon
US7616368B2 (en) 2005-02-23 2009-11-10 Pixtronix, Inc. Light concentrating reflective display methods and apparatus
US8519945B2 (en) 2006-01-06 2013-08-27 Pixtronix, Inc. Circuits for controlling display apparatus
US8310442B2 (en) 2005-02-23 2012-11-13 Pixtronix, Inc. Circuits for controlling display apparatus
US9229222B2 (en) 2005-02-23 2016-01-05 Pixtronix, Inc. Alignment methods in fluid-filled MEMS displays
US9261694B2 (en) 2005-02-23 2016-02-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US9082353B2 (en) 2010-01-05 2015-07-14 Pixtronix, Inc. Circuits for controlling display apparatus
US9158106B2 (en) 2005-02-23 2015-10-13 Pixtronix, Inc. Display methods and apparatus
US8159428B2 (en) 2005-02-23 2012-04-17 Pixtronix, Inc. Display methods and apparatus
US7999994B2 (en) 2005-02-23 2011-08-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US8482496B2 (en) 2006-01-06 2013-07-09 Pixtronix, Inc. Circuits for controlling MEMS display apparatus on a transparent substrate
JP2006237190A (ja) * 2005-02-24 2006-09-07 Toshiba Discrete Technology Kk 半導体発光装置
JPWO2006090834A1 (ja) * 2005-02-24 2008-07-24 京セラ株式会社 発光装置および照明装置
KR101174770B1 (ko) * 2005-02-28 2012-08-17 엘지디스플레이 주식회사 백라이트 유닛 및 이를 이용한 액정표시장치
US20060231848A1 (en) * 2005-04-14 2006-10-19 Chien-Kun Fu Light emitting diode package for enhancing light extraction
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
JP4991173B2 (ja) * 2005-04-27 2012-08-01 京セラ株式会社 発光素子搭載用基体ならびにこれを用いた発光装置
IT1361896B1 (it) * 2005-07-28 2009-06-12 Immobiliare Eder S R L Corpi illuminanti a led per fissaggio su sedi murali/pavimentazioni od integrabile in elementi di arredo e destinati ad ambienti soggetti a forti sollecitazioni fisico/chimiche ed agenti atmosferici
USD535707S1 (en) 2005-08-25 2007-01-23 Mattel, Inc. Electronic toy house
DE102005054955A1 (de) * 2005-08-31 2007-04-26 Osram Opto Semiconductors Gmbh Lichtemittierendes Modul, insbesondere zur Verwendung in einem optischen Projektionsgerät und optisches Projektionsgerät
TWI363219B (en) * 2005-09-05 2012-05-01 Hon Hai Prec Ind Co Ltd Direct type backlight module
US7261454B2 (en) * 2005-09-23 2007-08-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for forming a back-lighted array using an omni-directional light source
USD533773S1 (en) 2005-09-26 2006-12-19 Mattel, Inc. Packaging for a toy
DE102006004397A1 (de) * 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US7910943B2 (en) * 2005-11-01 2011-03-22 Nexxus Lighting, Inc. Light emitting diode fixture and heat sink
US20070096139A1 (en) * 2005-11-02 2007-05-03 3M Innovative Properties Company Light emitting diode encapsulation shape control
USD536042S1 (en) 2005-11-10 2007-01-30 Mattel, Inc. Electronic toy house
USD532461S1 (en) 2005-11-10 2006-11-21 Mattel, Inc. Electronic toy house
US20100263200A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
CN101496167A (zh) 2005-11-22 2009-07-29 肖克科技有限公司 用于过电压保护的包括电压可变换材料的半导体器件
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US8526096B2 (en) 2006-02-23 2013-09-03 Pixtronix, Inc. Mechanical light modulators with stressed beams
JP2007273562A (ja) * 2006-03-30 2007-10-18 Toshiba Corp 半導体発光装置
US20070241339A1 (en) * 2006-04-12 2007-10-18 Jui-Kang Yen Light-emitting diode with low thermal resistance
US7521727B2 (en) * 2006-04-26 2009-04-21 Rohm And Haas Company Light emitting device having improved light extraction efficiency and method of making same
US7661840B1 (en) 2006-06-21 2010-02-16 Ilight Technologies, Inc. Lighting device with illuminated front panel
US20080012035A1 (en) * 2006-07-11 2008-01-17 Bily Wang LED chip package structure and method for manufacturing the same
US7968014B2 (en) 2006-07-29 2011-06-28 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
KR20090057449A (ko) * 2006-09-24 2009-06-05 쇼킹 테크놀로지스 인코포레이티드 전압 절환형 유전 물질 및 광-보조를 이용한 기판 장치 도금 기술
JP2010521058A (ja) 2006-09-24 2010-06-17 ショッキング テクノロジーズ，インコーポレイテッド ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法
USD606948S1 (en) 2006-09-28 2009-12-29 Cree, Inc. Led
DE102006046678A1 (de) 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement
US20090027900A1 (en) * 2006-10-31 2009-01-29 The L.D. Kichler Co. Positionable outdoor lighting
TWI407196B (zh) * 2006-11-03 2013-09-01 Innolux Corp 發光二極體背光模組及其應用
GB0623611D0 (en) * 2006-11-27 2007-01-03 Barco Nv A method to provide a display panel
DE102006059994A1 (de) * 2006-12-19 2008-06-26 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
DE102007001706A1 (de) 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
US8109656B1 (en) 2007-01-12 2012-02-07 Ilight Technologies, Inc. Bulb for light-emitting diode with modified inner cavity
US7686478B1 (en) 2007-01-12 2010-03-30 Ilight Technologies, Inc. Bulb for light-emitting diode with color-converting insert
US20080169746A1 (en) * 2007-01-12 2008-07-17 Ilight Technologies, Inc. Bulb for light-emitting diode
USD595673S1 (en) 2007-01-19 2009-07-07 Cree, Inc. Light emitting diode
US9176318B2 (en) 2007-05-18 2015-11-03 Pixtronix, Inc. Methods for manufacturing fluid-filled MEMS displays
EP1962350A1 (en) * 2007-02-22 2008-08-27 LEXEDIS Lighting GmbH Emitting surface of light emitting diode packages
DE102007015474A1 (de) * 2007-03-30 2008-10-02 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US7841741B2 (en) * 2007-04-02 2010-11-30 Endicott Interconnect Technologies, Inc. LED lighting assembly and lamp utilizing same
WO2008151009A1 (en) * 2007-05-31 2008-12-11 Lumination Llc Environmentally robust lighting devices and methods of manufacturing same
GB0711684D0 (en) * 2007-06-18 2007-07-25 Barco Nv Method and device for improving optical LED performance
US7663315B1 (en) 2007-07-24 2010-02-16 Ilight Technologies, Inc. Spherical bulb for light-emitting diode with spherical inner cavity
US20090050856A1 (en) * 2007-08-20 2009-02-26 Lex Kosowsky Voltage switchable dielectric material incorporating modified high aspect ratio particles
DE102007060206A1 (de) * 2007-12-14 2009-06-18 Osram Opto Semiconductors Gmbh Anordnung mit mindestens einem optoelektronischen Halbleiterbauelement
KR100944008B1 (ko) 2007-12-17 2010-02-24 삼성전기주식회사 백색 발광소자 및 그 제조방법
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
JP5374876B2 (ja) * 2008-01-19 2013-12-25 日亜化学工業株式会社 発光装置
TW200943591A (en) * 2008-01-22 2009-10-16 Alps Electric Co Ltd Led package using light reflector
DE102008005936A1 (de) * 2008-01-24 2009-07-30 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
TW200938762A (en) * 2008-03-14 2009-09-16 xue-zhong Gao Assembly of light emitting unit
JP5092866B2 (ja) * 2008-04-18 2012-12-05 日亜化学工業株式会社 ディスプレイユニット及びその製造方法
USD608739S1 (en) 2008-04-21 2010-01-26 Cree, Inc. Led
US8461608B2 (en) * 2008-06-26 2013-06-11 3M Innovative Properties Company Light converting construction
US20100002286A1 (en) * 2008-07-01 2010-01-07 Koenraad Maenhout Method to provide a display panel
DE102008033385A1 (de) * 2008-07-16 2010-02-18 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung und Serie von Beleuchtungsvorrichtungen
TWM351985U (en) * 2008-07-25 2009-03-01 Bi Chi Corp LED base structure capable of enhancing effect of mixture of light
USD608307S1 (en) 2008-08-28 2010-01-19 Cree, Inc. Light emitting diode
CN102246246A (zh) 2008-09-30 2011-11-16 肖克科技有限公司 含有导电芯壳粒子的电压可切换电介质材料
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8169679B2 (en) 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
US20100119839A1 (en) 2008-11-13 2010-05-13 Maven Optronics Corp. System and Method for Forming a Thin-Film Phosphor Layer for Phosphor-Converted Light Emitting Devices
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8968606B2 (en) 2009-03-26 2015-03-03 Littelfuse, Inc. Components having voltage switchable dielectric materials
US20100302771A1 (en) * 2009-06-02 2010-12-02 Joe Yang LED-based streetlamp for emitting white light with easily adjustable color temperature
US8547009B2 (en) * 2009-07-10 2013-10-01 Cree, Inc. Lighting structures including diffuser particles comprising phosphor host materials
KR20120132680A (ko) 2010-02-02 2012-12-07 픽스트로닉스 인코포레이티드 저온 실 유체 충전된 디스플레이 장치의 제조 방법
WO2011097258A1 (en) 2010-02-02 2011-08-11 Pixtronix, Inc. Circuits for controlling display apparatus
JP5724183B2 (ja) * 2010-02-26 2015-05-27 日亜化学工業株式会社 発光装置
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
JP5758082B2 (ja) * 2010-03-24 2015-08-05 日亜化学工業株式会社 発光装置
EP2400569B1 (en) * 2010-06-28 2018-10-24 LG Innotek Co., Ltd. Light-emitting diode package
JP5488310B2 (ja) * 2010-07-30 2014-05-14 市光工業株式会社 車両用灯具の半導体型光源の光源ユニット、車両用灯具
JP5778999B2 (ja) * 2010-08-06 2015-09-16 日亜化学工業株式会社 発光装置および画像表示ユニット
EP2472578B1 (en) * 2010-12-28 2020-06-03 Nichia Corporation Light emitting device
JP5814947B2 (ja) * 2011-01-20 2015-11-17 シャープ株式会社 発光装置、照明装置、表示装置及び発光装置の製造方法
US9209373B2 (en) * 2011-02-23 2015-12-08 Intellectual Discovery Co., Ltd. High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink
CN102185081A (zh) * 2011-04-07 2011-09-14 深圳市华星光电技术有限公司 发光二极管封装构造
JP5899507B2 (ja) * 2011-04-27 2016-04-06 パナソニックＩｐマネジメント株式会社 発光装置及びそれを用いた照明装置
US8816512B2 (en) * 2011-07-28 2014-08-26 Lg Innotek Co., Ltd. Light emitting device module
JP2013062393A (ja) * 2011-09-14 2013-04-04 Sharp Corp 発光装置
US9141157B2 (en) * 2011-10-13 2015-09-22 Texas Instruments Incorporated Molded power supply system having a thermally insulated component
CN103187507A (zh) * 2011-12-30 2013-07-03 展晶科技(深圳)有限公司 发光二极管封装结构
TW201425814A (zh) * 2012-12-26 2014-07-01 鴻海精密工業股份有限公司 發光二極體模組及其製造方法
JP2014130963A (ja) * 2012-12-28 2014-07-10 Nichia Chem Ind Ltd 発光装置
US9134552B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus with narrow gap electrostatic actuators
JP6104832B2 (ja) * 2013-03-25 2017-03-29 ソニーセミコンダクタソリューションズ株式会社 発光素子組立体及びその製造方法、並びに、表示装置
JP6107510B2 (ja) 2013-07-25 2017-04-05 日亜化学工業株式会社 発光装置及びその製造方法
KR20150039518A (ko) * 2013-10-02 2015-04-10 엘지이노텍 주식회사 발광소자
KR102156764B1 (ko) * 2013-11-13 2020-09-16 엘지디스플레이 주식회사 유기 발광 다이오드 표시 장치 및 이의 제조 방법
JP2015111626A (ja) * 2013-12-06 2015-06-18 シャープ株式会社 発光装置およびその製造方法
CN103700628B (zh) * 2013-12-26 2016-05-04 京东方科技集团股份有限公司 阵列基板制作方法、阵列基板及显示装置
JP6312586B2 (ja) * 2014-12-08 2018-04-18 三菱電機株式会社 表示ユニット、映像表示装置及び表示ユニットの製造方法
JP6599128B2 (ja) * 2015-05-12 2019-10-30 三菱電機株式会社 表示装置
JP2016213364A (ja) * 2015-05-12 2016-12-15 三菱電機株式会社 発光装置及び表示装置
JP6131986B2 (ja) * 2015-06-01 2017-05-24 日亜化学工業株式会社 発光装置の製造方法
DE102015112042B4 (de) * 2015-07-23 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Leuchtvorrichtung
KR20170029037A (ko) * 2015-09-04 2017-03-15 삼성디스플레이 주식회사 투명 표시 장치 및 투명 표시 장치의 제조 방법
KR102562090B1 (ko) * 2016-01-07 2023-08-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
JP6520736B2 (ja) * 2016-01-28 2019-05-29 日亜化学工業株式会社 照明装置
JP2019090842A (ja) * 2016-03-31 2019-06-13 三菱電機株式会社 表示ユニット装置及び表示装置
JP6846877B2 (ja) * 2016-05-16 2021-03-24 三菱電機株式会社 表示ユニット装置及び表示装置
JP6418200B2 (ja) * 2016-05-31 2018-11-07 日亜化学工業株式会社 発光装置及びその製造方法
CN110088923A (zh) * 2016-09-01 2019-08-02 亮锐有限责任公司 具有温度敏感的低折射率颗粒层的白色外观半导体发光器件
US11081628B2 (en) 2016-09-01 2021-08-03 Lumileds Llc White-appearing semiconductor light-emitting devices having a temperature sensitive low-index particle layer
JP6536560B2 (ja) 2016-12-27 2019-07-03 日亜化学工業株式会社 発光装置及びその製造方法
JP2018148110A (ja) * 2017-03-08 2018-09-20 スタンレー電気株式会社 発光装置及びその製造方法
KR102530124B1 (ko) 2017-06-12 2023-05-08 니치아 카가쿠 고교 가부시키가이샤 발광 장치 및 그 제조 방법
DE102017117425A1 (de) * 2017-08-01 2019-02-07 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements
DE102017117438A1 (de) * 2017-08-01 2019-02-07 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements
JP6791105B2 (ja) 2017-11-30 2020-11-25 日亜化学工業株式会社 発光装置の製造方法
CN110010745B (zh) * 2017-12-25 2024-07-26 日亚化学工业株式会社 发光装置以及发光装置的制造方法
JP6658808B2 (ja) 2017-12-25 2020-03-04 日亜化学工業株式会社 発光装置および発光装置の製造方法
JP6665872B2 (ja) 2018-01-15 2020-03-13 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP6777105B2 (ja) * 2018-01-31 2020-10-28 日亜化学工業株式会社 発光装置の製造方法
JP7161100B2 (ja) * 2018-09-25 2022-10-26 日亜化学工業株式会社 発光装置及びその製造方法
EP3858923A1 (en) 2018-09-28 2021-08-04 Nitto Denko Corporation Resin composition, optical semiconductor element, and optical semiconductor device
DE112021000854T5 (de) * 2020-02-03 2022-12-01 Rohm Co., Ltd. Wandler und elektronische vorrichtung
CN111489638B (zh) * 2020-05-29 2022-05-27 维沃移动通信有限公司 电子设备
US20220246584A1 (en) * 2021-02-03 2022-08-04 Samsung Electronics Co., Ltd. Display transferring structure and display device including the same
KR102338707B1 (ko) * 2021-06-14 2021-12-13 주식회사 소룩스 광원 및 조명장치
KR102831579B1 (ko) * 2021-06-14 2025-07-08 (주)엘이디온 광원 및 조명장치

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2706262A (en) 1950-07-15 1955-04-12 American Optical Corp Diffusion coated articles
US2706202A (en) 1953-12-07 1955-04-12 Pfizer & Co C Bicycloheptane derivatives and process for preparing the same
JPS5936837B2 (ja) * 1977-04-05 1984-09-06 株式会社東芝 光半導体装置
US4163920A (en) * 1977-09-26 1979-08-07 Ford Motor Company Solid state source of radiant energy having a controllable frequency spectra characteristic
JPS5680181A (en) * 1979-12-05 1981-07-01 Toshiba Corp Semiconductor luminous device
JPS59151478A (ja) * 1983-02-17 1984-08-29 Omron Tateisi Electronics Co 面発光装置の製造方法
JPS62130573A (ja) 1985-11-30 1987-06-12 Toyoda Gosei Co Ltd 面発光ｌｅｄランプ
DE8713875U1 (de) * 1987-10-15 1988-02-18 Siemens AG, 1000 Berlin und 8000 München Optisches Senderbauelement
JPH01287973A (ja) 1988-05-13 1989-11-20 Takiron Co Ltd ドットマトリックス発光表示体
US5218268A (en) * 1989-10-31 1993-06-08 Kabushiki Kaisha Toshiba Optical filter for cathode ray tube
JP2900000B2 (ja) * 1991-07-12 1999-06-02 タキロン株式会社 発光表示体及びその製造方法
EP0658655B1 (fr) * 1993-12-15 1999-03-10 Michel Niezen Dispositif lumineux
JPH08293269A (ja) * 1995-04-21 1996-11-05 Mitsubishi Electric Corp 陰極線管
US5846677A (en) * 1996-03-12 1998-12-08 Futaba Denshi Kogyo K.K. Color filter, color filter-equipped display device and method for manufacturing same
JP3009626B2 (ja) * 1996-05-20 2000-02-14 日吉電子株式会社 Ｌｅｄ発光球
BR9709998B1 (pt) * 1996-06-26 2010-04-20 elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência
JP3065263B2 (ja) 1996-12-27 2000-07-17 日亜化学工業株式会社 発光装置及びそれを用いたｌｅｄ表示器
US6340824B1 (en) * 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
JPH11133891A (ja) * 1997-11-04 1999-05-21 Nichia Chem Ind Ltd Ｌｅｄ表示装置
JP3399342B2 (ja) 1998-02-17 2003-04-21 日亜化学工業株式会社 発光ダイオードの形成方法
JP4743927B2 (ja) * 1998-03-27 2011-08-10 吉雄 高田 発光体
JP4536171B2 (ja) 1998-05-22 2010-09-01 日亜化学工業株式会社 Ｌｅｄ表示装置
JP3613041B2 (ja) 1998-12-16 2005-01-26 日亜化学工業株式会社 発光装置及びその製造方法
US6155699A (en) * 1999-03-15 2000-12-05 Agilent Technologies, Inc. Efficient phosphor-conversion led structure
US6100162A (en) * 1999-05-14 2000-08-08 Micron Technology, Inc. Method of forming a circuitry isolation region within a semiconductive wafer
US6504301B1 (en) * 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
JP4066620B2 (ja) * 2000-07-21 2008-03-26 日亜化学工業株式会社 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法

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