JPS5680181A - Semiconductor luminous device - Google Patents

Semiconductor luminous device

Info

Publication number
JPS5680181A
JPS5680181A JP15754279A JP15754279A JPS5680181A JP S5680181 A JPS5680181 A JP S5680181A JP 15754279 A JP15754279 A JP 15754279A JP 15754279 A JP15754279 A JP 15754279A JP S5680181 A JPS5680181 A JP S5680181A
Authority
JP
Japan
Prior art keywords
lens
outside
luminous element
collector
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15754279A
Other languages
Japanese (ja)
Inventor
Iwao Matsumoto
Yuji Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15754279A priority Critical patent/JPS5680181A/en
Publication of JPS5680181A publication Critical patent/JPS5680181A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To obtain uniform surface luminescence, decreasing the loss of light by forming a lens collector at the outside of solid resin mounted outside a semiconductor luminous element. CONSTITUTION:A fine uniform lens 11 collector is formed at the outside of solid resin 6 integrally sealing sections near to a luminous element 3 of a luminous element unit 5. Transparent epoxy resin is, for example, used as the quality of a material of the resin 6 with the lens collector. When electricity is supplied from leads 1, 2, the luminous element 3 emits light. The light is reflected by a dish-shaped reflecting surface around the liminous element 3, proceeds upward, is collected by means of each lens 11 of the lens collector and is introduced to the outside. Thus, uniform surface luminescence is obtained because the lenses 11, a light collecting section, are formed minutely and evenly.
JP15754279A 1979-12-05 1979-12-05 Semiconductor luminous device Pending JPS5680181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15754279A JPS5680181A (en) 1979-12-05 1979-12-05 Semiconductor luminous device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15754279A JPS5680181A (en) 1979-12-05 1979-12-05 Semiconductor luminous device

Publications (1)

Publication Number Publication Date
JPS5680181A true JPS5680181A (en) 1981-07-01

Family

ID=15651948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15754279A Pending JPS5680181A (en) 1979-12-05 1979-12-05 Semiconductor luminous device

Country Status (1)

Country Link
JP (1) JPS5680181A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038385A (en) * 1989-06-06 1991-01-16 Matsushita Electric Ind Co Ltd Semiconductor laser device and manufacturing thereof
JP2002543594A (en) * 1999-04-22 2002-12-17 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング LED light source with lens
EP1174931A3 (en) * 2000-07-21 2005-09-07 Nichia Corporation Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038385A (en) * 1989-06-06 1991-01-16 Matsushita Electric Ind Co Ltd Semiconductor laser device and manufacturing thereof
JP2002543594A (en) * 1999-04-22 2002-12-17 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング LED light source with lens
EP1174931A3 (en) * 2000-07-21 2005-09-07 Nichia Corporation Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
US7087445B2 (en) 2000-07-21 2006-08-08 Nichia Corporation Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
US7425459B2 (en) 2000-07-21 2008-09-16 Nichia Corporation Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture

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