CA2069363C - Thermal annealing of palladium alloys - Google Patents
Thermal annealing of palladium alloysInfo
- Publication number
- CA2069363C CA2069363C CA002069363A CA2069363A CA2069363C CA 2069363 C CA2069363 C CA 2069363C CA 002069363 A CA002069363 A CA 002069363A CA 2069363 A CA2069363 A CA 2069363A CA 2069363 C CA2069363 C CA 2069363C
- Authority
- CA
- Canada
- Prior art keywords
- alloy
- nickel
- plated
- temperature
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000137 annealing Methods 0.000 title claims abstract description 25
- 229910001252 Pd alloy Inorganic materials 0.000 title claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 34
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000000956 alloy Substances 0.000 claims abstract description 24
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 16
- 239000010931 gold Substances 0.000 claims abstract description 13
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052737 gold Inorganic materials 0.000 claims abstract description 11
- 238000005336 cracking Methods 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 7
- 239000010941 cobalt Substances 0.000 claims abstract description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 5
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000004332 silver Substances 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 33
- 238000007747 plating Methods 0.000 claims description 17
- 238000009713 electroplating Methods 0.000 claims description 7
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- 239000010953 base metal Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- 229910052724 xenon Inorganic materials 0.000 claims 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 238000000926 separation method Methods 0.000 abstract description 2
- 229910002669 PdNi Inorganic materials 0.000 description 19
- 239000000758 substrate Substances 0.000 description 14
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 230000013011 mating Effects 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- GWUSZQUVEVMBPI-UHFFFAOYSA-N nimetazepam Chemical compound N=1CC(=O)N(C)C2=CC=C([N+]([O-])=O)C=C2C=1C1=CC=CC=C1 GWUSZQUVEVMBPI-UHFFFAOYSA-N 0.000 description 3
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical class ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 2
- 229910002666 PdCl2 Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 239000002659 electrodeposit Substances 0.000 description 2
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- -1 Alkyl hydroxyamines Chemical class 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 101100189618 Caenorhabditis elegans pdi-2 gene Proteins 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 241001474977 Palla Species 0.000 description 1
- 229910021605 Palladium(II) bromide Inorganic materials 0.000 description 1
- 229910021606 Palladium(II) iodide Inorganic materials 0.000 description 1
- 229910021120 PdC12 Inorganic materials 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- IZXGZAJMDLJLMF-UHFFFAOYSA-N methylaminomethanol Chemical compound CNCO IZXGZAJMDLJLMF-UHFFFAOYSA-N 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- RFLFDJSIZCCYIP-UHFFFAOYSA-L palladium(2+);sulfate Chemical compound [Pd+2].[O-]S([O-])(=O)=O RFLFDJSIZCCYIP-UHFFFAOYSA-L 0.000 description 1
- 229910000364 palladium(II) sulfate Inorganic materials 0.000 description 1
- INIOZDBICVTGEO-UHFFFAOYSA-L palladium(ii) bromide Chemical compound Br[Pd]Br INIOZDBICVTGEO-UHFFFAOYSA-L 0.000 description 1
- HNNUTDROYPGBMR-UHFFFAOYSA-L palladium(ii) iodide Chemical compound [Pd+2].[I-].[I-] HNNUTDROYPGBMR-UHFFFAOYSA-L 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 1
- 235000019798 tripotassium phosphate Nutrition 0.000 description 1
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/733,492 US5180482A (en) | 1991-07-22 | 1991-07-22 | Thermal annealing of palladium alloys |
| US733,492 | 1991-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2069363A1 CA2069363A1 (en) | 1993-01-23 |
| CA2069363C true CA2069363C (en) | 1999-05-18 |
Family
ID=24947830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002069363A Expired - Fee Related CA2069363C (en) | 1991-07-22 | 1992-05-25 | Thermal annealing of palladium alloys |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5180482A (en, 2012) |
| EP (1) | EP0524760B1 (en, 2012) |
| JP (1) | JP2607002B2 (en, 2012) |
| KR (1) | KR950004992B1 (en, 2012) |
| CA (1) | CA2069363C (en, 2012) |
| DE (1) | DE69210704T2 (en, 2012) |
| HK (1) | HK179096A (en, 2012) |
| SG (1) | SG43778A1 (en, 2012) |
| TW (1) | TW208046B (en, 2012) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7628339B2 (en) | 1991-04-24 | 2009-12-08 | Novartis Pharma Ag | Systems and methods for controlling fluid feed to an aerosol generator |
| US6540154B1 (en) * | 1991-04-24 | 2003-04-01 | Aerogen, Inc. | Systems and methods for controlling fluid feed to an aerosol generator |
| EP0600570A1 (en) * | 1992-11-30 | 1994-06-08 | Dynapro Thin Film Products Inc. | Touch switch with coating for inhibiting increased contact resistance |
| US7200930B2 (en) * | 1994-11-15 | 2007-04-10 | Formfactor, Inc. | Probe for semiconductor devices |
| US5665639A (en) * | 1994-02-23 | 1997-09-09 | Cypress Semiconductor Corp. | Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal |
| US6085740A (en) | 1996-02-21 | 2000-07-11 | Aerogen, Inc. | Liquid dispensing apparatus and methods |
| US5758637A (en) | 1995-08-31 | 1998-06-02 | Aerogen, Inc. | Liquid dispensing apparatus and methods |
| US6205999B1 (en) | 1995-04-05 | 2001-03-27 | Aerogen, Inc. | Methods and apparatus for storing chemical compounds in a portable inhaler |
| KR960039315A (ko) * | 1995-04-06 | 1996-11-25 | 이대원 | 리드프레임 제조방법 |
| FR2766396B1 (fr) * | 1997-07-25 | 1999-10-01 | Radiall Sa | Procede pour revetir une piece metallique destinee a etre brasee, revetement utilise a cet effet et piece ainsi revetue |
| US6807734B2 (en) * | 1998-02-13 | 2004-10-26 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
| US6255126B1 (en) * | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
| US6235177B1 (en) * | 1999-09-09 | 2001-05-22 | Aerogen, Inc. | Method for the construction of an aperture plate for dispensing liquid droplets |
| US6335107B1 (en) * | 1999-09-23 | 2002-01-01 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
| US6948491B2 (en) | 2001-03-20 | 2005-09-27 | Aerogen, Inc. | Convertible fluid feed system with comformable reservoir and methods |
| US8336545B2 (en) * | 2000-05-05 | 2012-12-25 | Novartis Pharma Ag | Methods and systems for operating an aerosol generator |
| US7100600B2 (en) * | 2001-03-20 | 2006-09-05 | Aerogen, Inc. | Fluid filled ampoules and methods for their use in aerosolizers |
| MXPA02010884A (es) * | 2000-05-05 | 2003-03-27 | Aerogen Ireland Ltd | Aparato y metodo para el suministro de medicamentos al sistema respiratorio. |
| US7971588B2 (en) * | 2000-05-05 | 2011-07-05 | Novartis Ag | Methods and systems for operating an aerosol generator |
| US7600511B2 (en) * | 2001-11-01 | 2009-10-13 | Novartis Pharma Ag | Apparatus and methods for delivery of medicament to a respiratory system |
| US6546927B2 (en) | 2001-03-13 | 2003-04-15 | Aerogen, Inc. | Methods and apparatus for controlling piezoelectric vibration |
| US6732944B2 (en) | 2001-05-02 | 2004-05-11 | Aerogen, Inc. | Base isolated nebulizing device and methods |
| US20050205089A1 (en) * | 2002-01-07 | 2005-09-22 | Aerogen, Inc. | Methods and devices for aerosolizing medicament |
| US7677467B2 (en) * | 2002-01-07 | 2010-03-16 | Novartis Pharma Ag | Methods and devices for aerosolizing medicament |
| US7360536B2 (en) | 2002-01-07 | 2008-04-22 | Aerogen, Inc. | Devices and methods for nebulizing fluids for inhalation |
| JP4761709B2 (ja) | 2002-01-15 | 2011-08-31 | エアロジェン，インコーポレイテッド | エアロゾル発生器を作動するための方法およびシステム |
| US7109111B2 (en) * | 2002-02-11 | 2006-09-19 | Applied Materials, Inc. | Method of annealing metal layers |
| US6915962B2 (en) * | 2002-05-20 | 2005-07-12 | Aerogen, Inc. | Apparatus for providing aerosol for medical treatment and methods |
| US20070044792A1 (en) * | 2005-08-30 | 2007-03-01 | Aerogen, Inc. | Aerosol generators with enhanced corrosion resistance |
| US8616195B2 (en) * | 2003-07-18 | 2013-12-31 | Novartis Ag | Nebuliser for the production of aerosolized medication |
| US7290541B2 (en) * | 2004-04-20 | 2007-11-06 | Aerogen, Inc. | Aerosol delivery apparatus and method for pressure-assisted breathing systems |
| EP1740242A4 (en) * | 2004-04-20 | 2009-12-23 | Aerogen Inc | AEROSOL LABELING DEVICE, METHOD AND COMPOSITIONS FOR PRESSURE SUPPORTED AIR SYSTEMS |
| US7267121B2 (en) | 2004-04-20 | 2007-09-11 | Aerogen, Inc. | Aerosol delivery apparatus and method for pressure-assisted breathing systems |
| US7946291B2 (en) | 2004-04-20 | 2011-05-24 | Novartis Ag | Ventilation systems and methods employing aerosol generators |
| US9108211B2 (en) * | 2005-05-25 | 2015-08-18 | Nektar Therapeutics | Vibration systems and methods |
| JP4828884B2 (ja) * | 2005-07-26 | 2011-11-30 | 株式会社東芝 | プリント回路配線基板、及び電子機器 |
| CN100388572C (zh) * | 2006-03-15 | 2008-05-14 | 上海坤链电子产品有限公司 | 电连接器的盒式结构插孔接触件的局部电镀金方法 |
| JP5318375B2 (ja) * | 2007-06-25 | 2013-10-16 | 株式会社サンユー | パラジウム−コバルト合金めっき液、パラジウム−コバルト合金被膜の形成方法及びパラジウム−コバルト合金硬質被膜の製造方法 |
| JP4846740B2 (ja) * | 2008-01-23 | 2011-12-28 | 旭鍍金株式会社 | めっき物の製造方法及び電気めっき方法 |
| US7842170B1 (en) * | 2009-03-09 | 2010-11-30 | Von Detten Volker | Device for selective plating of electrical contacts for connectors |
| RU2593254C2 (ru) | 2010-12-28 | 2016-08-10 | Стэмфорд Девайсиз Лтд. | Полученная фотолитографическим способом дырчатая пластина и способ ее изготовления |
| US9981090B2 (en) * | 2012-06-11 | 2018-05-29 | Stamford Devices Limited | Method for producing an aperture plate |
| EP3146090B1 (en) | 2014-05-23 | 2018-03-28 | Stamford Devices Limited | A method for producing an aperture plate |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3925170A (en) * | 1974-01-23 | 1975-12-09 | American Chem & Refining Co | Method and composition for producing bright palladium electrodepositions |
| GB1495910A (en) * | 1975-10-30 | 1977-12-21 | Ibm | Method and bath for electroplating palladium on an articl |
| US4066517A (en) * | 1976-03-11 | 1978-01-03 | Oxy Metal Industries Corporation | Electrodeposition of palladium |
| JPS569387A (en) * | 1979-07-04 | 1981-01-30 | Seiko Instr & Electronics Ltd | Plating method of decorative article |
| JPS6019630B2 (ja) * | 1979-07-18 | 1985-05-17 | 日本鉱業株式会社 | 接触子 |
| US4319967A (en) * | 1979-11-01 | 1982-03-16 | Bell Telephone Laboratories, Incorporated | Fabrication of palladium anode for X-ray lithography |
| JPS5772284A (en) * | 1980-10-21 | 1982-05-06 | Fujitsu Ltd | Method of producing electric contactor |
| US4486274A (en) * | 1981-02-27 | 1984-12-04 | At&T Bell Laboratories | Palladium plating prodedure |
| US4468296A (en) * | 1982-12-10 | 1984-08-28 | At&T Bell Laboratories | Process for electroplating palladium |
| JPH0244106B2 (ja) * | 1985-06-17 | 1990-10-02 | Yazaki Corp | Denkyosetsuten |
| JPS6353872A (ja) * | 1986-08-22 | 1988-03-08 | 三菱電機株式会社 | 接触子用材料 |
| US4911798A (en) * | 1988-12-20 | 1990-03-27 | At&T Bell Laboratories | Palladium alloy plating process |
| US4911799A (en) * | 1989-08-29 | 1990-03-27 | At&T Bell Laboratories | Electrodeposition of palladium films |
-
1991
- 1991-07-22 US US07/733,492 patent/US5180482A/en not_active Expired - Lifetime
-
1992
- 1992-05-20 TW TW081103936A patent/TW208046B/zh active
- 1992-05-25 CA CA002069363A patent/CA2069363C/en not_active Expired - Fee Related
- 1992-06-08 JP JP4171482A patent/JP2607002B2/ja not_active Expired - Fee Related
- 1992-07-14 SG SG1996000810A patent/SG43778A1/en unknown
- 1992-07-14 EP EP92306432A patent/EP0524760B1/en not_active Expired - Lifetime
- 1992-07-14 DE DE69210704T patent/DE69210704T2/de not_active Expired - Fee Related
- 1992-07-15 KR KR1019920012559A patent/KR950004992B1/ko not_active Expired - Fee Related
-
1996
- 1996-09-26 HK HK179096A patent/HK179096A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05190250A (ja) | 1993-07-30 |
| EP0524760A3 (en) | 1994-07-13 |
| EP0524760A2 (en) | 1993-01-27 |
| HK179096A (en) | 1996-10-04 |
| US5180482A (en) | 1993-01-19 |
| DE69210704T2 (de) | 1996-10-10 |
| DE69210704D1 (de) | 1996-06-20 |
| KR930003459A (ko) | 1993-02-24 |
| EP0524760B1 (en) | 1996-05-15 |
| TW208046B (en, 2012) | 1993-06-21 |
| CA2069363A1 (en) | 1993-01-23 |
| KR950004992B1 (ko) | 1995-05-16 |
| JP2607002B2 (ja) | 1997-05-07 |
| SG43778A1 (en) | 1997-11-14 |
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