CA1189984A - Contact structure for securing a semiconductor substrate to a mounting body - Google Patents

Contact structure for securing a semiconductor substrate to a mounting body

Info

Publication number
CA1189984A
CA1189984A CA000406337A CA406337A CA1189984A CA 1189984 A CA1189984 A CA 1189984A CA 000406337 A CA000406337 A CA 000406337A CA 406337 A CA406337 A CA 406337A CA 1189984 A CA1189984 A CA 1189984A
Authority
CA
Canada
Prior art keywords
layer
semiconductor substrate
solder
contact structure
chromium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000406337A
Other languages
English (en)
French (fr)
Inventor
Hirotsugu Hattori
Masahiro Kuwagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14373276&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA1189984(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of CA1189984A publication Critical patent/CA1189984A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
CA000406337A 1981-07-02 1982-06-30 Contact structure for securing a semiconductor substrate to a mounting body Expired CA1189984A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPSHO56-104159/1981 1981-07-02
JP56104159A JPS586143A (ja) 1981-07-02 1981-07-02 半導体装置

Publications (1)

Publication Number Publication Date
CA1189984A true CA1189984A (en) 1985-07-02

Family

ID=14373276

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000406337A Expired CA1189984A (en) 1981-07-02 1982-06-30 Contact structure for securing a semiconductor substrate to a mounting body

Country Status (5)

Country Link
US (1) US4480261A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0070435B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS586143A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1189984A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3277953D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038823A (ja) * 1983-08-11 1985-02-28 Nec Corp 半導体装置
US4737839A (en) * 1984-03-19 1988-04-12 Trilogy Computer Development Partners, Ltd. Semiconductor chip mounting system
US4733127A (en) * 1984-06-12 1988-03-22 Sanyo Electric Co., Ltd. Unit of arrayed light emitting diodes
DE3426199C2 (de) * 1984-07-17 1994-02-03 Asea Brown Boveri Überbrückungselement
DE3446780A1 (de) * 1984-12-21 1986-07-03 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen
US4954870A (en) * 1984-12-28 1990-09-04 Kabushiki Kaisha Toshiba Semiconductor device
US4929516A (en) * 1985-03-14 1990-05-29 Olin Corporation Semiconductor die attach system
US4872047A (en) * 1986-11-07 1989-10-03 Olin Corporation Semiconductor die attach system
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system
JPS63119242A (ja) * 1986-11-07 1988-05-23 Toshiba Corp 基板
US4953003A (en) * 1987-05-21 1990-08-28 Siemens Aktiengesellschaft Power semiconductor device
JPH0750813B2 (ja) * 1988-05-23 1995-05-31 三菱電機株式会社 半導体レーザ素子用サブマウント
US5010387A (en) * 1988-11-21 1991-04-23 Honeywell Inc. Solder bonding material
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EP0070435B1 (en) 1988-01-07
EP0070435A2 (en) 1983-01-26
US4480261A (en) 1984-10-30
EP0070435A3 (en) 1984-11-21
JPH0145220B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-10-03
JPS586143A (ja) 1983-01-13
DE3277953D1 (en) 1988-02-11

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