GB1360213A - Method of mounting a semi-conductor chip on a heat sink - Google Patents

Method of mounting a semi-conductor chip on a heat sink

Info

Publication number
GB1360213A
GB1360213A GB6174670A GB6174670A GB1360213A GB 1360213 A GB1360213 A GB 1360213A GB 6174670 A GB6174670 A GB 6174670A GB 6174670 A GB6174670 A GB 6174670A GB 1360213 A GB1360213 A GB 1360213A
Authority
GB
United Kingdom
Prior art keywords
semi
heat sink
layers
mounting
conductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6174670A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB6174670A priority Critical patent/GB1360213A/en
Publication of GB1360213A publication Critical patent/GB1360213A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04026—Bonding areas specifically adapted for layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)

Abstract

1360213 Semi-conductor devices JOSEPH LUCAS (INDUSTRIES) Ltd 16 Dec 1971 [30 Dec 1970] 61746/70 Heading H1K A semi-conductor body 11 having on one surface 11a at least one Al contact area 13 has on its opposite surface 11b successively deposited layers of Al 14, Cr, Ti or Mo 15, Ni 16 and a metal, such as Au 17, relatively resistant to oxidation. The layer 17 is then soldered, e.g. using a Pb-based solder 18, to a heat sink 12, e.g. of Cu. The layers 14-17 may be deposited by evaporation or sputtering. For a planar power transistor separate Al emitter and base contacts are provided on the surface 11a, the collector being contacted via the layers on the surface 11b.
GB6174670A 1971-12-16 1971-12-16 Method of mounting a semi-conductor chip on a heat sink Expired GB1360213A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB6174670A GB1360213A (en) 1971-12-16 1971-12-16 Method of mounting a semi-conductor chip on a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB6174670A GB1360213A (en) 1971-12-16 1971-12-16 Method of mounting a semi-conductor chip on a heat sink

Publications (1)

Publication Number Publication Date
GB1360213A true GB1360213A (en) 1974-07-17

Family

ID=10487400

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6174670A Expired GB1360213A (en) 1971-12-16 1971-12-16 Method of mounting a semi-conductor chip on a heat sink

Country Status (1)

Country Link
GB (1) GB1360213A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2383522A1 (en) * 1977-03-08 1978-10-06 Ates Componenti Elettron PROCESS FOR FORMING METALLIZED ZONES ON A SERIES OF SEMICONDUCTOR DEVICES
EP0070435A2 (en) * 1981-07-02 1983-01-26 Matsushita Electronics Corporation Semiconductor device comprising a semiconductor substrate bonded to a mounting means
EP0384971A1 (en) * 1989-02-28 1990-09-05 Rockwell International Corporation Barrier disk
US5076486A (en) * 1989-02-28 1991-12-31 Rockwell International Corporation Barrier disk
US20120171814A1 (en) * 2010-12-31 2012-07-05 Samsung Electronics Co., Ltd. Semiconductor packages and methods of fabricating the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2383522A1 (en) * 1977-03-08 1978-10-06 Ates Componenti Elettron PROCESS FOR FORMING METALLIZED ZONES ON A SERIES OF SEMICONDUCTOR DEVICES
EP0070435A2 (en) * 1981-07-02 1983-01-26 Matsushita Electronics Corporation Semiconductor device comprising a semiconductor substrate bonded to a mounting means
EP0070435A3 (en) * 1981-07-02 1984-11-21 Matsushita Electronics Corporation Semiconductor device comprising a semiconductor substrate bonded to a mounting means
EP0384971A1 (en) * 1989-02-28 1990-09-05 Rockwell International Corporation Barrier disk
US5076486A (en) * 1989-02-28 1991-12-31 Rockwell International Corporation Barrier disk
US20120171814A1 (en) * 2010-12-31 2012-07-05 Samsung Electronics Co., Ltd. Semiconductor packages and methods of fabricating the same
US9059072B2 (en) 2010-12-31 2015-06-16 Samsung Electronics Co., Ltd. Semiconductor packages and methods of fabricating the same

Similar Documents

Publication Publication Date Title
EP0085332A3 (en) Metallised semiconductor and process for its manufacture
GB1440545A (en) Semiconductor device including a chip bonded to a metal surface
GB1481015A (en) Bonding of a semiconductor device to an electrical conductor on a supporting substrate
GB1021359A (en) Improved electrical connection to a semiconductor body
GB937438A (en) Method of applying contacts to a semiconductor body
GB907427A (en) A process for the production of a semi-conductor device
GB1053069A (en)
GB1384850A (en) Semiconductor components
GB1360213A (en) Method of mounting a semi-conductor chip on a heat sink
GB1207010A (en) Improvements relating to contact electrodes
GB1381489A (en) Method of manufacturing a semiconductor element
GB789338A (en) Improvements in or relating to methods of applying an ohmic contact to semi-conductive bodies of a p-type conductive telluride of a bivalent metal
GB1364604A (en) Metal-semi-conductor contacts
GB1173117A (en) Improvements relating to Terminal Structures
GB1275153A (en) Semiconductor device
JPS55140238A (en) Tape carrier type semiconductor device
ES363985A1 (en) An integrated circuit provision. (Machine-translation by Google Translate, not legally binding)
JPS54138370A (en) Flip chip mounting body
GB1378218A (en) Semiconductor components
JPS5735318A (en) Manufacture of semiconductor device
GB1448510A (en) Electrically connecting a semiconductor body to a metal body capable of simultaneously serving as a heat sink and as an electrical contact having a low contact resistance
JPS554904A (en) Semi-conductor device
JPS57109350A (en) Semiconductor device
GB1305324A (en)
GB1156895A (en) Improvements in and relating to the Manufacture of Semiconductor Devices

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee