BR9714585A - Encaixes moldados para fixação de componente eletrônico - Google Patents
Encaixes moldados para fixação de componente eletrônicoInfo
- Publication number
- BR9714585A BR9714585A BR9714585-8A BR9714585A BR9714585A BR 9714585 A BR9714585 A BR 9714585A BR 9714585 A BR9714585 A BR 9714585A BR 9714585 A BR9714585 A BR 9714585A
- Authority
- BR
- Brazil
- Prior art keywords
- component
- cavity
- electrical
- electronic component
- terminations
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
'ENCAIXES MOLDADOS PARA FIXAçãO DE COMPONENTE ELETRôNICO" é descrito aqui um conjunto de circuito elétrico que não exige qualquer processamento de solda, compreendendo um componente eletrônico (10) possuindo terminações (14) dispostas em pelo menos uma de suas superfícies, e um sustrato curvoplano moldado (20) possuindo traços de circuito (30) no mesmo e uma cavidade (24) formada no mesmo, onde a cavidade (24) se conforma substancialmente em formato com o componente eletrônico (10). Próximo à cavidade (24) se encontra uma pluralidade de contatos elétricos (40), dispostos em uma relação de coincidência com as terminações respectivas (14) do componente eletrônico (10), com pelo menos uma dos contratos elétricos (40) sendo conectado a pelo menos um dos traços de circuito (30) no substrato (20). A cavidade (24) e os contatos elétricos (40) são dimensionados de forma que um encaixe de interferência seja fornecido entre as terminações do componente e os contatos elétricos, de forma que o componente (10) seja mantido dentro da cavidade (24) quando o componente (10) é colocado nesse lugar. O componente (10) é disposto na cavidade (24) de forma que suas terminações (14) estejam em conexão física e elétrica com seus respectivos contatos elétricos (40).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/826,461 US5994648A (en) | 1997-03-27 | 1997-03-27 | Three-dimensional molded sockets for mechanical and electrical component attachment |
PCT/GB1997/003558 WO1998044769A1 (en) | 1997-03-27 | 1997-12-31 | Moulded sockets for electronic component attachment |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9714585A true BR9714585A (pt) | 2000-03-08 |
Family
ID=25246602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9714585-8A BR9714585A (pt) | 1997-03-27 | 1997-12-31 | Encaixes moldados para fixação de componente eletrônico |
Country Status (8)
Country | Link |
---|---|
US (1) | US5994648A (pt) |
EP (1) | EP0970594B1 (pt) |
JP (1) | JP2002515184A (pt) |
CN (1) | CN1084585C (pt) |
BR (1) | BR9714585A (pt) |
CA (1) | CA2284072A1 (pt) |
DE (1) | DE69709176T2 (pt) |
WO (1) | WO1998044769A1 (pt) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3063709B2 (ja) * | 1997-11-05 | 2000-07-12 | 日本電気株式会社 | 電子部品の実装構造、搭載用基板および電子部品の搭載方法 |
US6239977B1 (en) * | 1999-05-17 | 2001-05-29 | 3Com Corporation | Technique for mounting electronic components on printed circuit boards |
US6867499B1 (en) * | 1999-09-30 | 2005-03-15 | Skyworks Solutions, Inc. | Semiconductor packaging |
WO2002023566A2 (en) * | 2000-09-18 | 2002-03-21 | Meder Electronic | A lead-less surface mount reed relay |
JP2002134875A (ja) * | 2000-10-26 | 2002-05-10 | Murata Mfg Co Ltd | モジュール部品、モジュール部品の実装構造、および電子装置 |
JP3482183B2 (ja) * | 2000-10-30 | 2003-12-22 | Tdk株式会社 | 電子部品の実装構造 |
JP4919243B2 (ja) * | 2002-04-11 | 2012-04-18 | 奇美電子股▲ふん▼有限公司 | 電気的絶縁体及び電子デバイス |
JP2005535138A (ja) * | 2002-08-05 | 2005-11-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 電子製品、本体、および製造方法 |
DE10302104A1 (de) * | 2003-01-21 | 2004-08-05 | Friwo Gerätebau Gmbh | Verfahren zum Herstellen von Schaltungsträgern mit intergrierten passiven Bauelementen |
US7061076B2 (en) * | 2004-08-12 | 2006-06-13 | Honeywell International Inc. | Solderless component packaging and mounting |
DE102004047590A1 (de) * | 2004-09-23 | 2006-04-06 | Walter Esser, Kunststoff-Spritzgießerei GmbH & Co. KG. | Formteil mit elektrischer Leiterbahn |
DE102006009723A1 (de) * | 2006-03-02 | 2007-09-06 | Siemens Ag | Verfahren zum Herstellen und planaren Kontaktieren einer elektronischen Vorrichtung und entsprechend hergestellte Vorrichtung |
JP4862641B2 (ja) | 2006-12-06 | 2012-01-25 | 株式会社デンソー | 多層基板及び多層基板の製造方法 |
CN101309551A (zh) * | 2007-05-18 | 2008-11-19 | 富葵精密组件(深圳)有限公司 | 电路板 |
US7479604B1 (en) * | 2007-09-27 | 2009-01-20 | Harris Corporation | Flexible appliance and related method for orthogonal, non-planar interconnections |
DE102007046493A1 (de) * | 2007-09-28 | 2009-04-09 | Continental Automotive Gmbh | Dreidimensionaler elektronischer Schaltungsträgeraufbau, sowie Schaltungsgrundträger aufweisend den Schaltungsträgeraufbau als Funktionsbauteil und dreidimensionale Schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen Schaltungsträgeraufbauten |
KR100926619B1 (ko) * | 2007-12-05 | 2009-11-11 | 삼성모바일디스플레이주식회사 | 적층 세라믹 커패시터를 실장한 인쇄회로기판 및 이를이용한 평판 표시장치 |
US11302617B2 (en) * | 2008-09-06 | 2022-04-12 | Broadpak Corporation | Scalable semiconductor interposer integration |
US20110030996A1 (en) * | 2009-08-05 | 2011-02-10 | Weibezahn Karl S | Circuit substrate for electronic device |
EP2369904A1 (fr) * | 2010-03-16 | 2011-09-28 | Gemalto SA | Module électronique à contacts latéraux, dispositif le comportant et procédé de fabrication d'un tel module |
WO2011129130A1 (ja) * | 2010-04-15 | 2011-10-20 | 古河電気工業株式会社 | 基板および基板の製造方法 |
KR20130141559A (ko) | 2010-11-03 | 2013-12-26 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열 관리를 위한 가요성 led 디바이스 및 제조 방법 |
WO2012061184A1 (en) | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device and method of making |
WO2012061182A1 (en) * | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device with wire bond free die |
JP5599328B2 (ja) * | 2011-01-20 | 2014-10-01 | 三菱電機株式会社 | 電力用半導体装置とプリント配線板との接続機構 |
DE102011013449B4 (de) * | 2011-03-09 | 2013-12-05 | Continental Automotive Gmbh | Baugruppe mit einem Träger, einem SMD-Bauteil und einem Stanzgitterteil |
WO2013025402A2 (en) | 2011-08-17 | 2013-02-21 | 3M Innovative Properties Company | Two part flexible light emitting semiconductor device |
JP2013045796A (ja) * | 2011-08-22 | 2013-03-04 | Yazaki Corp | 配線基板 |
DE102011086707A1 (de) * | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Schaltungsanordnung für elektronische und/oder elektrische Bauteile |
US20130258623A1 (en) * | 2012-03-29 | 2013-10-03 | Unimicron Technology Corporation | Package structure having embedded electronic element and fabrication method thereof |
US9155198B2 (en) * | 2012-05-17 | 2015-10-06 | Eagantu Ltd. | Electronic module allowing fine tuning after assembly |
US20140001622A1 (en) * | 2012-06-27 | 2014-01-02 | Infineon Technologies Ag | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages |
US20140055961A1 (en) * | 2012-08-23 | 2014-02-27 | Shayan Malek | Printed Circuit Boards with Recesses |
KR102105403B1 (ko) * | 2013-11-28 | 2020-04-28 | 삼성전기주식회사 | 전자소자 내장 기판 및 그 제조 방법 |
JP6289063B2 (ja) * | 2013-12-09 | 2018-03-07 | 三菱電機株式会社 | 電子部品実装装置及びそれを備える半導体装置 |
GB2523145A (en) * | 2014-02-14 | 2015-08-19 | Nokia Technologies Oy | A circuit board and associated apparatus and methods |
US10539585B2 (en) * | 2014-10-09 | 2020-01-21 | Continental Automotive Systems, Inc. | Arrangement and method for connecting an electrical component to a leadframe |
KR102380304B1 (ko) * | 2015-01-23 | 2022-03-30 | 삼성전기주식회사 | 전자부품 내장 기판 및 그 제조방법 |
WO2018097313A1 (ja) * | 2016-11-28 | 2018-05-31 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
DE112015007224B4 (de) | 2015-12-23 | 2022-06-30 | Intel Corporation | Umgekehrt montiertes Gull-Wing Elektronikgehäuse |
JP7058089B2 (ja) | 2017-07-25 | 2022-04-21 | タイコエレクトロニクスジャパン合同会社 | 基板実装構造 |
CN109693012B (zh) * | 2017-10-24 | 2020-12-18 | 泰科电子(上海)有限公司 | 定位装置 |
WO2020153937A1 (en) * | 2019-01-22 | 2020-07-30 | Siemens Aktiengesellschaft | Integrated no-solder snap-fit electronic component bays for non-traditional pcbs and am structures |
EP3709777A1 (en) | 2019-03-11 | 2020-09-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Solder-free component carrier connection using an elastic element, and method |
US10980115B1 (en) * | 2020-06-05 | 2021-04-13 | Littelfuse, Inc. | Flexible harness assembly for surface mounted devices |
DE102020134205A1 (de) * | 2020-12-18 | 2022-06-23 | Te Connectivity Germany Gmbh | Elektrisches Bauteil, Verfahren zur Vorbereitung eines elektrischen Bauteils auf einen Lötschritt, und Vorrichtung zur Vorbereitung eines elektrischen Bauteils auf einen Lötschritt |
DE102021104696A1 (de) * | 2021-02-26 | 2022-09-01 | Infineon Technologies Ag | Verfahren zur verbindung eines elektrischen bauelementes mit einer bodeneinheit unter verwendung einer lötfreien verbindung |
DE102021119391A1 (de) | 2021-07-27 | 2023-02-02 | Infineon Technologies Ag | Ein halbleiterbauelementmodul mit flexiblen leitern zur höhenverstellung |
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GB1240789A (en) * | 1969-12-18 | 1971-07-28 | Standard Telephones Cables Ltd | Improvements in or relating to electrical equipment |
DE3326968A1 (de) * | 1982-06-12 | 1985-02-14 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | Traegerbauteil aus thermoplastischem material mit durch heisspraegen aufgebrachten metallischen leitern |
US4542439A (en) * | 1984-06-27 | 1985-09-17 | At&T Technologies, Inc. | Surface mount component |
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JPS6474794A (en) * | 1987-09-17 | 1989-03-20 | Matsushita Electronics Corp | Method of mounting substrate of semiconductor device |
JPH0273687A (ja) * | 1988-09-08 | 1990-03-13 | Nec Corp | 表面実装部品の実装構造 |
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US5579206A (en) * | 1993-07-16 | 1996-11-26 | Dallas Semiconductor Corporation | Enhanced low profile sockets and module systems |
JP2809115B2 (ja) * | 1993-10-13 | 1998-10-08 | ヤマハ株式会社 | 半導体装置とその製造方法 |
JPH08255815A (ja) * | 1995-03-16 | 1996-10-01 | Matsushita Electric Works Ltd | 電子部品の実装構造 |
US5745984A (en) * | 1995-07-10 | 1998-05-05 | Martin Marietta Corporation | Method for making an electronic module |
-
1997
- 1997-03-27 US US08/826,461 patent/US5994648A/en not_active Expired - Fee Related
- 1997-12-31 CN CN97182075A patent/CN1084585C/zh not_active Expired - Fee Related
- 1997-12-31 EP EP97950344A patent/EP0970594B1/en not_active Expired - Lifetime
- 1997-12-31 JP JP54126698A patent/JP2002515184A/ja active Pending
- 1997-12-31 DE DE69709176T patent/DE69709176T2/de not_active Expired - Fee Related
- 1997-12-31 WO PCT/GB1997/003558 patent/WO1998044769A1/en active IP Right Grant
- 1997-12-31 BR BR9714585-8A patent/BR9714585A/pt not_active IP Right Cessation
- 1997-12-31 CA CA002284072A patent/CA2284072A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE69709176T2 (de) | 2002-07-18 |
EP0970594B1 (en) | 2001-12-12 |
US5994648A (en) | 1999-11-30 |
DE69709176D1 (de) | 2002-01-24 |
WO1998044769A1 (en) | 1998-10-08 |
EP0970594A1 (en) | 2000-01-12 |
JP2002515184A (ja) | 2002-05-21 |
CA2284072A1 (en) | 1998-10-08 |
CN1249122A (zh) | 2000-03-29 |
CN1084585C (zh) | 2002-05-08 |
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