JP4919243B2 - 電気的絶縁体及び電子デバイス - Google Patents
電気的絶縁体及び電子デバイス Download PDFInfo
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- 239000000615 nonconductor Substances 0.000 title description 24
- 239000004020 conductor Substances 0.000 claims abstract description 102
- 238000010295 mobile communication Methods 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000012212 insulator Substances 0.000 description 74
- 239000010410 layer Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 239000011888 foil Substances 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 238000010924 continuous production Methods 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical group [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
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- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Structure Of Printed Boards (AREA)
Description
[付記]
付記(1):導体パターンを備えた絶縁体であって、第1の側面及び第2の側面を備え、前記側面相互間の夾角は、180゜未満であり、導体パターンは、第1及び第2の側面上に延びていて、多数のストリップ状導体から成り、前記ストリップ状導体は各々、前記ストリップ状導体の幅よりも大きな寸法の少なくとも1つの領域を備え、前記領域は、前記絶縁体と一緒に組み立てられるべき電子要素との電気的接触に適しており、前記絶縁体は、導体パターンの前記キャリヤとして且つ前記電子要素のキャリヤとして働くことを特徴とする電気的絶縁体。
付記(2):電子要素を取り付けるためのキャビティ又は開口部が、前記絶縁体に設けられていることを特徴とする、付記(1)に記載の電気的絶縁体。
付記(3):前記キャビティは、底部及び側壁を有し、導体パターンは、側壁上に延びると共に任意的に前記キャビティの底部上に延び、前記電子要素との電気的接触のための接続領域が、キャビティ内に設けられていることを特徴とする、付記(2)に記載の電気的絶縁体。
付記(4):前記開口部は、前記第1の側面から、前記第1の側面から遠ざかる方向に向いた第3の側面まで貫通して延びていて、第1の部品を第1の側面のところに配置すると共に第2の部品を前記第3の側面に配置できるようになっており、前記部品は、これらの間に介在する絶縁体と一緒になって電子要素を構成していることを特徴とする、付記(2)に記載の電気的絶縁体。
付記(5):少なくとも或る数のストリップ状導体が、それぞれの端部のところに、接続領域として働き、閉じられた、好ましくは矩形の構造をなして配置された領域をそれぞれ備えていることを特徴とする、付記(1)又は(4)に記載の電気的絶縁体。
付記(6):前記絶縁体は、第1の側面から遠ざかる方向に向いた第3の側面を有し、前記導体パターンは、第1の側面から前記第2の側面上でこれに沿って前記第3の側面上まで延びていることを特徴とする、付記(1)に記載の電気的絶縁体。
付記(7):少なくとも或る数のストリップ状導体が、それぞれのストリップ状端部を有し、該端部は、少なくとも実質的に互いに平行に向けられた状態で第1の側面のところに位置していることを特徴とする、付記(1)に記載の電気的絶縁体。
付記(8):前記ストリップ状導体の幅は、10〜500μmであることを特徴とする、付記(1)に記載の電気的絶縁体。
付記(9):電子要素と、付記(1)〜(8)のうち何れか一つに記載の導体パターンが施された電気的絶縁体とを備える電子デバイス。
付記(10):付記(4)に記載の電気的絶縁体が設けられ、前記第1の部品は、感光性半導体素子であり、前記第2の部品は、光学レンズであり、前記第1及び第2の部品は、協働してカメラを構成していることを特徴とする、付記(9)に記載の電子デバイス。
付記(11):前記電気的絶縁体に電気的且つ機械的に接続されたディスプレイが設けられ、導体パターンは、感光性半導体素子からの信号を前記ディスプレイに伝送できるよう構成されていることを特徴とする、付記(10)に記載の電子デバイス。
付記(12):付記(9)〜(11)のうち何れか一つに記載の電子デバイスを備える移動通信機器。
Claims (7)
- 導体パターンが設けられた電気的に絶縁する物体であって、
前記絶縁する物体は直方体であること、
上記の絶縁する物体は第一の及び第二の側面が設けられたものであること、
第三の側面は前記第一の側面から離れて面するものであること
前記第二の側面は前記第一の側面及び前記第三の側面の間にあると共に前記第一の側面及び前記第三の側面に接続されたものであること、
前記導体パターンは前記第一の側面、前記第二の側面、及び前記第三の側面に有るものであること、
前記導体パターンは前記第二の側面において実質的に平行に配向させられた一方の末端を有する複数のストリップの形をした導体を含むこと、
前記導体パターンは前記第二の側面において他方の末端における前記ストリップの形をした導体の幅と比べてより大きい寸法の領域が設けられたものであること、
上記の領域は、前記ストリップの形をした導体の前記他方の末端によって前記物体に有る開口部を囲むように不連続に矩形の形状に囲まれた領域であると共に前記絶縁する物体と一緒に組み立てられるための電子的な素子の電気的な接触をするものであること、
前記一方の末端と対向するものではない前記矩形の形状の三辺の領域からの前記導体パターンは前記第一の側面又は前記第三の側面を経由して前記第二の側面に戻ること、
上記の物体は前記導体パターンのキャリヤとして及び前記素子のキャリヤとして作用すること、
前記第二の側面の側における前記開口部の周囲は前記不連続に矩形の形状に囲まれた領域が設けられた底部を有する凹所であること、
前記第二の側面及び前記凹所の底部が平行であること、
前記開口部は、第二の構成部品が前記第二の側面の反対の側面に置かれることができると共に第一の構成部品が前記第二の側面に置かれることができるように、前記第二の側面の反対の側面を貫通すること、並びに
上記の構成部品は、間に挟まれた前記物体と一緒に電子的な素子を定義すること
を備える、電気的に絶縁する物体。 - 請求項1に記載の電気的に絶縁する物体において、
前記ストリップの形をした導体の前記他方の末端に設けられた領域は、接続領域として作用する、電気的に絶縁する物体。 - 請求項1に記載の電気的に絶縁する物体において、
前記ストリップの形をした導体は、10及び500μmの間の幅を有する、電気的に絶縁する物体。 - 電子的な素子が及び請求項1から3までのいずれか一項に記載の導体パターンが設けられた電気的に絶縁する物体が設けられた電子的なデバイス。
- 請求項4に記載の電子的なデバイスにおいて、
前記第一の構成部品は、感光性の半導体の素子であると共に、
前記第二の構成部品は、一緒にカメラを定義する、光学的なレンズである、
電子的なデバイス。 - 請求項5に記載の電子的なデバイスにおいて、
前記電子的なデバイスは、前記電気的に絶縁する物体へ電気的に及び機械的に接続されたものであるディスプレイを含むと共に、
前記導体パターンは、前記感光性の半導体の素子からの信号が前記ディスプレイへ伝達されることができるように、構築されたものである、
電子的なデバイス。 - 請求項4から6までのいずれか一項に記載の電子的なデバイスが設けられた移動通信のための装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02076427 | 2002-04-11 | ||
EP02076427.0 | 2002-04-11 | ||
EP02078210 | 2002-08-05 | ||
EP02078210.8 | 2002-08-05 | ||
PCT/IB2003/001343 WO2003086034A1 (en) | 2002-04-11 | 2003-04-10 | Electrically insulating body, and electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005522867A JP2005522867A (ja) | 2005-07-28 |
JP4919243B2 true JP4919243B2 (ja) | 2012-04-18 |
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Application Number | Title | Priority Date | Filing Date |
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JP2003583073A Expired - Fee Related JP4919243B2 (ja) | 2002-04-11 | 2003-04-10 | 電気的絶縁体及び電子デバイス |
Country Status (7)
Country | Link |
---|---|
US (1) | US7652895B2 (ja) |
EP (1) | EP1500314A1 (ja) |
JP (1) | JP4919243B2 (ja) |
KR (1) | KR101002116B1 (ja) |
CN (1) | CN1647595A (ja) |
AU (1) | AU2003219358A1 (ja) |
WO (1) | WO2003086034A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003086034A1 (en) * | 2002-04-11 | 2003-10-16 | Koninklijke Philips Electronics N.V. | Electrically insulating body, and electronic device |
JP4112448B2 (ja) * | 2003-07-28 | 2008-07-02 | 株式会社東芝 | 電気光配線基板及び半導体装置 |
JP2007508563A (ja) | 2003-10-15 | 2007-04-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 装置、システム及び電気素子 |
US7258549B2 (en) * | 2004-02-20 | 2007-08-21 | Matsushita Electric Industrial Co., Ltd. | Connection member and mount assembly and production method of the same |
CN100399637C (zh) * | 2005-05-16 | 2008-07-02 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN200941518Y (zh) * | 2006-08-01 | 2007-08-29 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
JP5097179B2 (ja) * | 2009-08-26 | 2012-12-12 | パナソニック株式会社 | スイッチ機能付き回路基板の製造方法 |
JP6451062B2 (ja) * | 2014-03-18 | 2019-01-16 | セイコーエプソン株式会社 | 電子デバイス、電子モジュール、電子機器および移動体 |
US10219381B2 (en) | 2017-03-22 | 2019-02-26 | Carling Technologies, Inc. | Circuit board mounted switch with electro static discharge shield |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3916266A (en) * | 1973-12-13 | 1975-10-28 | Ibm | Planar packaging for integrated circuits |
DE2920091A1 (de) | 1979-05-18 | 1980-11-27 | Subklew Christof Fa | Kunststoff-formteil |
DE3246661A1 (de) | 1982-12-16 | 1984-06-20 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von um eine aussenkante fuehrenden elektrischen anschlussleitungen |
GB8413330D0 (en) * | 1984-05-24 | 1984-06-27 | Mbm Technology Ltd | Mounting semi-conductor chips |
JPH0242738A (ja) | 1988-08-01 | 1990-02-13 | Toagosei Chem Ind Co Ltd | Cob実装プリント回路板 |
EP0569949A3 (en) * | 1992-05-12 | 1994-06-15 | Akira Kitahara | Surface mount components and semifinished products thereof |
DE9300867U1 (de) * | 1993-01-22 | 1994-05-26 | Siemens AG, 80333 München | Einstückiges Isolierteil, insbesondere Spritzgießteil |
US5622522A (en) * | 1995-08-11 | 1997-04-22 | Hon Hai Precision Ind. Co., Ltd. | Shielded electrical connector |
DE19535714C1 (de) * | 1995-09-26 | 1997-02-06 | Weidmueller Interface | Statuszeigeeinrichtung für Leiterplattenanschlußelemente |
US5994648A (en) * | 1997-03-27 | 1999-11-30 | Ford Motor Company | Three-dimensional molded sockets for mechanical and electrical component attachment |
KR100259359B1 (ko) * | 1998-02-10 | 2000-06-15 | 김영환 | 반도체 패키지용 기판 및 반도체 패키지, 그리고 그 제조방법 |
US6037641A (en) * | 1998-08-25 | 2000-03-14 | Hewlett-Packard Company | Optical device package including an aligned lens |
DE19944383A1 (de) * | 1999-09-16 | 2001-04-19 | Ticona Gmbh | Gehäuse für elektrische oder elektronische Vorrichtungen mit integrierten Leiterbahnen |
JP2001245267A (ja) | 2000-02-28 | 2001-09-07 | Matsushita Electric Ind Co Ltd | ビデオカメラ付き携帯型情報通信端末装置 |
JP4004705B2 (ja) | 2000-02-29 | 2007-11-07 | 松下電器産業株式会社 | 撮像装置と撮像装置組立方法 |
US20020020898A1 (en) * | 2000-08-16 | 2002-02-21 | Vu Quat T. | Microelectronic substrates with integrated devices |
JP3741005B2 (ja) * | 2000-09-13 | 2006-02-01 | セイコーエプソン株式会社 | 配線基板、その製造方法、表示装置および電子機器 |
US6555906B2 (en) * | 2000-12-15 | 2003-04-29 | Intel Corporation | Microelectronic package having a bumpless laminated interconnection layer |
US7053381B2 (en) * | 2001-12-06 | 2006-05-30 | General Electric Company | Dual para-xylylene layers for an X-ray detector |
WO2003086034A1 (en) * | 2002-04-11 | 2003-10-16 | Koninklijke Philips Electronics N.V. | Electrically insulating body, and electronic device |
JP2004063425A (ja) * | 2002-07-31 | 2004-02-26 | Mitsumi Electric Co Ltd | モジュール用コネクタ |
WO2004015986A1 (en) * | 2002-08-05 | 2004-02-19 | Koninklijke Philips Electronics N.V. | Device for mobile image communication |
CN2703341Y (zh) * | 2004-01-08 | 2005-06-01 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN100399637C (zh) * | 2005-05-16 | 2008-07-02 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
-
2003
- 2003-04-10 WO PCT/IB2003/001343 patent/WO2003086034A1/en active Application Filing
- 2003-04-10 AU AU2003219358A patent/AU2003219358A1/en not_active Abandoned
- 2003-04-10 CN CNA038081334A patent/CN1647595A/zh active Pending
- 2003-04-10 US US10/510,302 patent/US7652895B2/en not_active Expired - Fee Related
- 2003-04-10 KR KR1020047016003A patent/KR101002116B1/ko not_active IP Right Cessation
- 2003-04-10 EP EP03715168A patent/EP1500314A1/en not_active Withdrawn
- 2003-04-10 JP JP2003583073A patent/JP4919243B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1500314A1 (en) | 2005-01-26 |
KR101002116B1 (ko) | 2010-12-16 |
US7652895B2 (en) | 2010-01-26 |
JP2005522867A (ja) | 2005-07-28 |
CN1647595A (zh) | 2005-07-27 |
WO2003086034A1 (en) | 2003-10-16 |
AU2003219358A1 (en) | 2003-10-20 |
US20050142917A1 (en) | 2005-06-30 |
KR20040099408A (ko) | 2004-11-26 |
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