JP2013045796A - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP2013045796A JP2013045796A JP2011180422A JP2011180422A JP2013045796A JP 2013045796 A JP2013045796 A JP 2013045796A JP 2011180422 A JP2011180422 A JP 2011180422A JP 2011180422 A JP2011180422 A JP 2011180422A JP 2013045796 A JP2013045796 A JP 2013045796A
- Authority
- JP
- Japan
- Prior art keywords
- component
- electronic component
- substrate
- base substrate
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0169—Using a temporary frame during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
Abstract
【解決手段】メタルコア31を有するベース基板10に、電子部品80が内層部品として配置された配線基板1であって、前記電子部品80が配置される領域に形成された部品配置開口部15と、部品配置開口部15の周囲に、ベース基板10の表面より基板内部側に窪んで形成され、電子部品80の第1〜3の端子部81〜83を配置する端子配置部と、を備える。部品配置開口部15の内部には、電子部品80の部品本体85が収容される。
【選択図】図4
Description
また、前記内層部品は、前記端子配置部に配置されたときに、前記ベース基板の表面より外部に露出しなくともよい。
また、前記内層部品は、パッケージ化された部品であってもよい。
10 ベース基板
11a 第1の配線領域
11b 第2の配線領域
11c 第3の配線領域
12 外周溝部
13 内部溝部
15 部品配置開口部
18 連絡部
19 外周フレーム
20 部品実装パッド
21、21a、21b 第1のパッド部
22、22a、22b 第2のパッド部
23、23a、23b 第3のパッド部
31 メタルコア
32 絶縁層
80 電子部品
81 第1の端子部
82 第2の端子部
83 第3の端子部
85 部品本体
91 絶縁層
Claims (3)
- メタルコア基板であるベース基板に、電気部品又は電子部品が内層部品として配置された配線基板であって、
前記内層部品が配置される領域に形成された凹部と、
前記凹部の周囲に、前記ベース基板の表面より基板内部側に窪んで形成され、前記内層部品の端子を配置する端子配置部と、
を備え、
前記内層部品の本体が、前記凹部の中に配置されていることを特徴とする配線基板。 - 前記内層部品は、前記端子配置部に配置されたときに、前記ベース基板の表面より外部に露出しないことを特徴とする請求項1に記載の配線基板。
- 前記内層部品は、パッケージ化された部品であることを特徴とする請求項1または2に記載の配線基板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011180422A JP2013045796A (ja) | 2011-08-22 | 2011-08-22 | 配線基板 |
US14/363,208 US20140369014A1 (en) | 2011-08-22 | 2012-08-22 | Wiring board |
CN201280036195.4A CN103843468A (zh) | 2011-08-22 | 2012-08-22 | 安装有部件的布线板 |
PCT/JP2012/071922 WO2013027856A2 (en) | 2011-08-22 | 2012-08-22 | Wiring board |
EP12762411.2A EP2749155B1 (en) | 2011-08-22 | 2012-08-22 | Wiring board in which a component is mounted |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011180422A JP2013045796A (ja) | 2011-08-22 | 2011-08-22 | 配線基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013045796A true JP2013045796A (ja) | 2013-03-04 |
Family
ID=46889400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011180422A Abandoned JP2013045796A (ja) | 2011-08-22 | 2011-08-22 | 配線基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140369014A1 (ja) |
EP (1) | EP2749155B1 (ja) |
JP (1) | JP2013045796A (ja) |
CN (1) | CN103843468A (ja) |
WO (1) | WO2013027856A2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110139477B (zh) * | 2018-02-09 | 2021-10-08 | 台达电子企业管理(上海)有限公司 | 应用于智能终端的电源模块及电源模块组装结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5428612Y2 (ja) * | 1973-04-25 | 1979-09-13 | ||
JPS63165869U (ja) * | 1987-04-20 | 1988-10-28 | ||
JP2002515184A (ja) * | 1997-03-27 | 2002-05-21 | ヴィステオン グローバル テクノロジーズ インコーポレーテッド | 電子部品取付用成形ソケット |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1074683B (de) * | 1960-02-04 | Siemens &. Halske Aktiengesellschaft, Berlin und München | Elektrisches Bauelement für gedruckte Schaltungen | |
US4254448A (en) * | 1979-05-14 | 1981-03-03 | Western Electric Company, Inc. | Techniques for assembling electrical components with printed circuit boards |
DE3501710A1 (de) * | 1985-01-19 | 1986-07-24 | Allied Corp., Morristown, N.J. | Leiterplatte mit integralen positioniermitteln |
US5055637A (en) * | 1989-05-02 | 1991-10-08 | Hagner George R | Circuit boards with recessed traces |
JP3956204B2 (ja) | 2002-06-27 | 2007-08-08 | 日本特殊陶業株式会社 | 積層樹脂配線基板及びその製造方法、積層樹脂配線基板用金属板 |
JP2011180422A (ja) | 2010-03-02 | 2011-09-15 | Oki Electric Industry Co Ltd | 光合分波素子 |
-
2011
- 2011-08-22 JP JP2011180422A patent/JP2013045796A/ja not_active Abandoned
-
2012
- 2012-08-22 EP EP12762411.2A patent/EP2749155B1/en active Active
- 2012-08-22 WO PCT/JP2012/071922 patent/WO2013027856A2/en active Application Filing
- 2012-08-22 US US14/363,208 patent/US20140369014A1/en not_active Abandoned
- 2012-08-22 CN CN201280036195.4A patent/CN103843468A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5428612Y2 (ja) * | 1973-04-25 | 1979-09-13 | ||
JPS63165869U (ja) * | 1987-04-20 | 1988-10-28 | ||
JP2002515184A (ja) * | 1997-03-27 | 2002-05-21 | ヴィステオン グローバル テクノロジーズ インコーポレーテッド | 電子部品取付用成形ソケット |
Also Published As
Publication number | Publication date |
---|---|
WO2013027856A3 (en) | 2013-06-20 |
WO2013027856A2 (en) | 2013-02-28 |
EP2749155B1 (en) | 2015-07-08 |
EP2749155A2 (en) | 2014-07-02 |
CN103843468A (zh) | 2014-06-04 |
US20140369014A1 (en) | 2014-12-18 |
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Legal Events
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Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140718 |
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A762 | Written abandonment of application |
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