BR112016030304A2 - Chapa de aço inoxidável estanhado - Google Patents
Chapa de aço inoxidável estanhadoInfo
- Publication number
- BR112016030304A2 BR112016030304A2 BR112016030304A BR112016030304A BR112016030304A2 BR 112016030304 A2 BR112016030304 A2 BR 112016030304A2 BR 112016030304 A BR112016030304 A BR 112016030304A BR 112016030304 A BR112016030304 A BR 112016030304A BR 112016030304 A2 BR112016030304 A2 BR 112016030304A2
- Authority
- BR
- Brazil
- Prior art keywords
- stainless steel
- steel sheet
- plating layer
- tin
- nickel
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
CHAPA DE AÇO INOXIDÁVEL ESTANHADO. Uma chapa de aço inoxidável estanhado que tem uma camada de estanhagem que tem boa aderência a uma chapa de aço inoxidável e que exibe excelente resistência a filamento em vários ambientes, e em que uma camada de niquelagem tendo uma espessura de 0,3 a 3 micrometro é formada em uma chapa de aço inoxidável e uma camada de estanhagem tendo uma espessura de 0,3 a 5 micrometro é formada na camada de niquelagem. Esta chapa de aço inoxidável estanhado é caracterizada pelo fato de os cristais de níquel na camada de niquelagem terem uma taxa de deformação em malha de 0,5% ou menos.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014129927A JP5646105B1 (ja) | 2013-06-27 | 2014-06-25 | Snめっきステンレス鋼板 |
PCT/JP2014/069875 WO2015198495A1 (ja) | 2014-06-25 | 2014-07-29 | Snめっきステンレス鋼板 |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112016030304A2 true BR112016030304A2 (pt) | 2017-08-22 |
Family
ID=54979330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112016030304A BR112016030304A2 (pt) | 2014-06-25 | 2014-07-29 | Chapa de aço inoxidável estanhado |
Country Status (14)
Country | Link |
---|---|
US (1) | US9834848B2 (pt) |
EP (1) | EP3162920B1 (pt) |
JP (1) | JP5646105B1 (pt) |
KR (1) | KR20170023930A (pt) |
CN (1) | CN106661754B (pt) |
AU (1) | AU2014398388B2 (pt) |
BR (1) | BR112016030304A2 (pt) |
CA (1) | CA2953649C (pt) |
MX (1) | MX2017000155A (pt) |
MY (1) | MY168987A (pt) |
PH (1) | PH12016502589B1 (pt) |
RU (1) | RU2642248C1 (pt) |
SG (1) | SG11201610775YA (pt) |
WO (1) | WO2015198495A1 (pt) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016166935A1 (ja) * | 2015-04-14 | 2016-10-20 | Jfeスチール株式会社 | 固体高分子形燃料電池のセパレータ用金属板 |
JP6423383B2 (ja) * | 2016-03-31 | 2018-11-14 | 日新製鋼株式会社 | 接続部品用材料 |
KR20190101466A (ko) * | 2017-01-30 | 2019-08-30 | 제이엑스금속주식회사 | 표면 처리 도금재, 커넥터 단자, 커넥터, ffc 단자, ffc, fpc 및 전자 부품 |
KR101789749B1 (ko) * | 2017-04-12 | 2017-10-25 | 주창환 | 휴대폰 카메라 모듈에 포함되는 sus 304 소재의 도금방법 |
DE102019102544A1 (de) * | 2019-02-01 | 2020-08-06 | Vacuumschmelze Gmbh & Co. Kg | Verfahren zur vorbehandlung von edelstahlsubstraten vor dem löten mittels nanokristalliner lötfolien |
KR102275538B1 (ko) * | 2019-05-13 | 2021-07-12 | 주식회사 이피코리아 | Fpcb 보강용 sus 플레이트 표면처리 방법 |
CN111826689B (zh) * | 2020-07-28 | 2022-02-11 | 翔声科技(厦门)有限公司 | 一种多阶段镀镍工艺 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
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FR1500185A (fr) * | 1966-08-08 | 1967-11-03 | Ct De Rech S Du Fer Blanc | Procédé d'étamage électrolytique d'un feuillard d'acier |
JPS53115623A (en) | 1977-03-19 | 1978-10-09 | Alps Electric Co Ltd | Multilayer plating method of preventing generation of whisker of tin plating |
JPS582598B2 (ja) | 1980-10-13 | 1983-01-17 | 古河電気工業株式会社 | Cu−Sn系複合材の製造方法 |
JPS59143089A (ja) | 1983-02-02 | 1984-08-16 | Furukawa Electric Co Ltd:The | 錫メツキの表面処理方法 |
JPS616293A (ja) | 1984-06-21 | 1986-01-11 | Nippon Steel Corp | 高耐食性snメツキ鋼板の製造法 |
JPS6230896A (ja) | 1985-08-01 | 1987-02-09 | Nippon Steel Corp | 高耐食性Sn系被覆鋼板とその製造法 |
JPS6277481A (ja) | 1985-08-05 | 1987-04-09 | オリンコ−ポレ−シヨン | スズホイスカ−の成長防止方法 |
JPH0765214B2 (ja) * | 1988-11-18 | 1995-07-12 | 新日本製鐵株式会社 | めっき密着性及び耐食性にすぐれたNi,Co,及びNi−Co合金めっきCr含有鋼板の製造法 |
JPH05171488A (ja) * | 1991-12-20 | 1993-07-09 | Toyo Kohan Co Ltd | Niストライクめっき方法 |
AU9763898A (en) * | 1997-11-14 | 1999-06-07 | Toyo Kohan Co. Ltd. | Surface-treated steel sheet having lowered contact resistance and connecting terminal members made by using the same |
JP2001246317A (ja) * | 1999-12-27 | 2001-09-11 | Toyo Kohan Co Ltd | 塗装金属板の製造方法、塗装金属板およびそれを用いた電気的接続部材 |
JP3908912B2 (ja) | 2001-02-22 | 2007-04-25 | 新日本製鐵株式会社 | 半田濡れ性、耐錆性、耐ホイスカー性に優れた環境対応型電子部品用表面処理鋼板 |
CN1407141A (zh) | 2001-03-16 | 2003-04-02 | 希普雷公司 | 镀锡 |
US6551722B2 (en) * | 2001-04-11 | 2003-04-22 | Masco Corporation Of Indiana | Coated article having a stainless steel color |
JP3513709B2 (ja) * | 2001-10-16 | 2004-03-31 | 石原薬品株式会社 | 前処理によるスズホイスカーの防止方法 |
JP2006127939A (ja) | 2004-10-29 | 2006-05-18 | Sumitomo Electric Ind Ltd | 電気導体部品及びその製造方法 |
JP5261859B2 (ja) | 2005-03-24 | 2013-08-14 | Jfeスチール株式会社 | 半田付け性、耐食性および耐ホイスカー性に優れるSn系めっき鋼板並びにその製造方法 |
US7984841B2 (en) | 2005-06-17 | 2011-07-26 | Fujitsu Limited | Member formed with coating film having tin as its main component, coating film forming method and soldering method |
JP4904810B2 (ja) | 2005-12-28 | 2012-03-28 | 富士通株式会社 | めっき皮膜及びその形成方法並びに電子部品 |
JP2007262458A (ja) | 2006-03-27 | 2007-10-11 | Nikko Kinzoku Kk | 耐ウィスカー性リフローSnめっき材 |
KR101821659B1 (ko) | 2010-01-08 | 2018-01-25 | 도요 고한 가부시키가이샤 | 표면처리금속판 및 그 표면처리금속판을 이용한 성형품의 제조방법 |
CN101771142B (zh) | 2010-02-10 | 2012-09-19 | 力佳电源科技(深圳)有限公司 | 一种软包锂电池极耳材料及其电镀和应用方法 |
JP2012140678A (ja) | 2010-12-28 | 2012-07-26 | Kyowa Densen Kk | 曲げ加工部のウィスカ発生を防止するめっき被膜部材、これを用いた電気電子部品、並びにめっき被膜部材の製造方法とめっき皮膜部材のウィスカ発生防止方法 |
TW201413068A (zh) * | 2012-07-02 | 2014-04-01 | Mitsubishi Materials Corp | 插拔性優良之鍍錫銅合金端子材料及其製造方法 |
JP5667152B2 (ja) | 2012-09-19 | 2015-02-12 | Jx日鉱日石金属株式会社 | 表面処理めっき材およびその製造方法、並びに電子部品 |
-
2014
- 2014-06-25 JP JP2014129927A patent/JP5646105B1/ja not_active Expired - Fee Related
- 2014-07-29 EP EP14895541.2A patent/EP3162920B1/en active Active
- 2014-07-29 RU RU2017102046A patent/RU2642248C1/ru active
- 2014-07-29 MX MX2017000155A patent/MX2017000155A/es unknown
- 2014-07-29 WO PCT/JP2014/069875 patent/WO2015198495A1/ja active Application Filing
- 2014-07-29 US US15/321,851 patent/US9834848B2/en not_active Expired - Fee Related
- 2014-07-29 SG SG11201610775YA patent/SG11201610775YA/en unknown
- 2014-07-29 AU AU2014398388A patent/AU2014398388B2/en not_active Ceased
- 2014-07-29 BR BR112016030304A patent/BR112016030304A2/pt not_active Application Discontinuation
- 2014-07-29 CN CN201480080042.9A patent/CN106661754B/zh not_active Expired - Fee Related
- 2014-07-29 MY MYPI2016704800A patent/MY168987A/en unknown
- 2014-07-29 CA CA2953649A patent/CA2953649C/en not_active Expired - Fee Related
- 2014-07-29 KR KR1020177000152A patent/KR20170023930A/ko not_active Application Discontinuation
-
2016
- 2016-12-22 PH PH12016502589A patent/PH12016502589B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3162920A1 (en) | 2017-05-03 |
KR20170023930A (ko) | 2017-03-06 |
RU2642248C1 (ru) | 2018-01-24 |
JP2015028208A (ja) | 2015-02-12 |
AU2014398388B2 (en) | 2017-06-08 |
CA2953649C (en) | 2018-12-04 |
MY168987A (en) | 2019-01-29 |
CA2953649A1 (en) | 2015-12-30 |
MX2017000155A (es) | 2017-05-01 |
PH12016502589A1 (en) | 2017-04-24 |
WO2015198495A1 (ja) | 2015-12-30 |
CN106661754A (zh) | 2017-05-10 |
SG11201610775YA (en) | 2017-01-27 |
JP5646105B1 (ja) | 2014-12-24 |
EP3162920B1 (en) | 2020-01-22 |
CN106661754B (zh) | 2018-03-27 |
US9834848B2 (en) | 2017-12-05 |
AU2014398388A1 (en) | 2017-01-19 |
EP3162920A4 (en) | 2018-01-03 |
US20170159197A1 (en) | 2017-06-08 |
PH12016502589B1 (en) | 2017-04-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |