BR112017002269A2 - banho de galvanoplastia de liga de cobre-níquel - Google Patents

banho de galvanoplastia de liga de cobre-níquel

Info

Publication number
BR112017002269A2
BR112017002269A2 BR112017002269-9A BR112017002269A BR112017002269A2 BR 112017002269 A2 BR112017002269 A2 BR 112017002269A2 BR 112017002269 A BR112017002269 A BR 112017002269A BR 112017002269 A2 BR112017002269 A2 BR 112017002269A2
Authority
BR
Brazil
Prior art keywords
copper
electroplating bath
nickel alloy
alloy electroplating
salt
Prior art date
Application number
BR112017002269-9A
Other languages
English (en)
Japanese (ja)
Inventor
Sakurai Hitoshi
Ono Kazunori
Hashimoto Akira
Yuasa Satoshi
Original Assignee
Dipsol Chemicals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chemicals Co., Ltd. filed Critical Dipsol Chemicals Co., Ltd.
Publication of BR112017002269A2 publication Critical patent/BR112017002269A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

a presente invenção fornece um banho de galvanoplastia de liga de cobre-níquel que contém (a) um sal de cobre e um sal de níquel, (b) um agente de complexação de metal, (c) um agente que confere condutividade, (d) um composto orgânico contendo enxofre e (e) um regulador de potencial redox.
BR112017002269-9A 2014-08-08 2015-07-10 banho de galvanoplastia de liga de cobre-níquel BR112017002269A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014162802A JP6439172B2 (ja) 2014-08-08 2014-08-08 銅−ニッケル合金電気めっき浴
JP2014-162802 2014-08-08
PCT/JP2015/069944 WO2016021369A1 (ja) 2014-08-08 2015-07-10 銅－ニッケル合金電気めっき浴

Publications (1)

Publication Number Publication Date
BR112017002269A2 true BR112017002269A2 (pt) 2018-01-16

Family

ID=55263643

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112017002269-9A BR112017002269A2 (pt) 2014-08-08 2015-07-10 banho de galvanoplastia de liga de cobre-níquel

Country Status (12)

Country Link
US (1) US10316421B2 (pt)
EP (1) EP3178968B1 (pt)
JP (1) JP6439172B2 (pt)
KR (1) KR102001322B1 (pt)
CN (1) CN106574387B (pt)
BR (1) BR112017002269A2 (pt)
MX (1) MX2017001680A (pt)
PH (1) PH12017500218A1 (pt)
RU (1) RU2666391C1 (pt)
SG (1) SG11201700896XA (pt)
TW (1) TWI652378B (pt)
WO (1) WO2016021369A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018110198A1 (ja) * 2016-12-16 2018-06-21 コニカミノルタ株式会社 透明導電膜の形成方法及び電解メッキ用メッキ液
US11800648B2 (en) 2018-02-22 2023-10-24 Konica Minolta, Inc. Pattern forming method
RU2694398C1 (ru) * 2018-12-14 2019-07-12 Федеральное государственное бюджетное образовательное учреждение высшего образования "Елецкий государственный университет им. И.А. Бунина" Электролит для получения сплавов железо-никель
CN111321437B (zh) * 2020-03-31 2021-04-27 安徽铜冠铜箔集团股份有限公司 铜镍合金箔及其电沉积制备方法
CN116034188A (zh) * 2020-06-22 2023-04-28 离网能源实验室私人有限公司 新型共晶溶剂
TWI804149B (zh) 2022-01-10 2023-06-01 國立陽明交通大學 雙晶銅-鎳合金金屬層及其製備方法
KR102587490B1 (ko) * 2022-12-05 2023-10-11 동국제강 주식회사 내식성이 우수한 클래드 후강판용 슬래브의 도금 방법 및 이 도금 방법으로 제조된 내식성이 우수한 클래드 후강판용 슬래브

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1837835A (en) * 1926-12-20 1931-12-22 Gen Spring Bumper Corp Process for electrodepositing bright nickel
US3833481A (en) 1972-12-18 1974-09-03 Buckbel Mears Co Electroforming nickel copper alloys
JPS58133392A (ja) * 1982-02-01 1983-08-09 Oosakashi 光沢銅−ニツケル−コバルト合金電気めつき浴
JPS58133391A (ja) * 1982-02-01 1983-08-09 Oosakashi 光沢銅−ニツケル合金電気めつき浴
JPH02285091A (ja) 1989-04-26 1990-11-22 Kobe Steel Ltd ニッケル―銅合金めっき浴
JPH04198499A (ja) * 1990-07-20 1992-07-17 Asahi Glass Co Ltd 電位調節機構を有する銅溶解槽
JPH0598488A (ja) * 1991-06-05 1993-04-20 Daiwa Kasei Kenkyusho:Kk 銅−ニツケル合金電気メツキ浴
RU2106436C1 (ru) * 1996-07-22 1998-03-10 Тюменский государственный нефтегазовый университет Электролит для осаждения сплава медь - никель
RU2365683C1 (ru) * 2008-09-30 2009-08-27 Государственное образовательное учреждение высшего профессионального образования "Пензенский государственный университет" (ПГУ) Сульфосалицилатный электролит для осаждения сплава медь-никель
KR101077890B1 (ko) * 2008-12-26 2011-10-31 주식회사 포스코 아연-니켈 전기 도금액용 첨가제 조성물, 이를 포함하는 아연-니켈 전기 도금액 조성물 및 이를 이용한 아연-니켈전기도금강판의 제조방법
US9828686B2 (en) * 2012-04-19 2017-11-28 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath and plating method
CN104233302B (zh) * 2014-09-15 2016-09-14 南通万德科技有限公司 一种蚀刻液及其应用

Also Published As

Publication number Publication date
TWI652378B (zh) 2019-03-01
EP3178968B1 (en) 2019-09-04
US20170241031A1 (en) 2017-08-24
JP2016037649A (ja) 2016-03-22
JP6439172B2 (ja) 2018-12-19
US10316421B2 (en) 2019-06-11
MX2017001680A (es) 2017-05-09
SG11201700896XA (en) 2017-03-30
PH12017500218B1 (en) 2017-07-10
RU2666391C1 (ru) 2018-09-07
CN106574387B (zh) 2019-10-18
WO2016021369A1 (ja) 2016-02-11
KR20170038918A (ko) 2017-04-07
PH12017500218A1 (en) 2017-07-10
TW201610241A (zh) 2016-03-16
EP3178968A1 (en) 2017-06-14
KR102001322B1 (ko) 2019-07-17
EP3178968A4 (en) 2018-01-17
CN106574387A (zh) 2017-04-19

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2627 DE 11-05-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.