MY186470A - Plating bath and method for electroless deposition of nickel layers - Google Patents

Plating bath and method for electroless deposition of nickel layers

Info

Publication number
MY186470A
MY186470A MYPI2017701361A MYPI2017701361A MY186470A MY 186470 A MY186470 A MY 186470A MY PI2017701361 A MYPI2017701361 A MY PI2017701361A MY PI2017701361 A MYPI2017701361 A MY PI2017701361A MY 186470 A MY186470 A MY 186470A
Authority
MY
Malaysia
Prior art keywords
plating bath
electroless deposition
nickel layers
nickel
deposition
Prior art date
Application number
MYPI2017701361A
Inventor
Jan Picalek Dr
Holger Bera Dr
Akhtar Shakeel
Iulia Bejan Dr
PINNAU Jennifer
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MY186470A publication Critical patent/MY186470A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising ions of group IIIA metals and iodine containing, inorganic compounds in order to en-hance bath stability.
MYPI2017701361A 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers MY186470A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14194890.1A EP3026143A1 (en) 2014-11-26 2014-11-26 Plating bath and method for electroless deposition of nickel layers
PCT/EP2015/076822 WO2016083195A1 (en) 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers

Publications (1)

Publication Number Publication Date
MY186470A true MY186470A (en) 2021-07-22

Family

ID=51999271

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017701361A MY186470A (en) 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers

Country Status (10)

Country Link
US (1) US20170335462A1 (en)
EP (2) EP3026143A1 (en)
JP (1) JP6667525B2 (en)
KR (1) KR102497590B1 (en)
CN (1) CN107109654B (en)
CA (1) CA2968437C (en)
ES (1) ES2705430T3 (en)
MY (1) MY186470A (en)
TW (1) TWI683927B (en)
WO (1) WO2016083195A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180209047A1 (en) * 2015-07-17 2018-07-26 Coventya, Inc. Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
DE102019112883B4 (en) * 2019-05-16 2024-05-16 Pac Tech - Packaging Technologies Gmbh Coating bath for electroless coating of a substrate
JP2022185929A (en) * 2021-06-03 2022-12-15 東洋鋼鈑株式会社 Nickel phosphorus alloy coated substrate, solution for electroless plating nickel phosphorus alloy film, and method for manufacturing nickel phosphorus alloy coated substrate

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658841A (en) 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658842A (en) 1951-01-04 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2762723A (en) 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US2935425A (en) 1954-12-29 1960-05-03 Gen Am Transport Chemical nickel plating processes and baths therefor
US3338726A (en) 1958-10-01 1967-08-29 Du Pont Chemical reduction plating process and bath
US3597266A (en) 1968-09-23 1971-08-03 Enthone Electroless nickel plating
US3915716A (en) 1969-04-17 1975-10-28 Schering Ag Chemical nickel plating bath
US3719508A (en) * 1971-11-16 1973-03-06 Shipley Co Electroless nickel solution
US3953654A (en) 1973-08-13 1976-04-27 Rca Corporation Temperature-stable non-magnetic alloy
US4189324A (en) 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
US4780342A (en) 1987-07-20 1988-10-25 General Electric Company Electroless nickel plating composition and method for its preparation and use
JP3455709B2 (en) * 1999-04-06 2003-10-14 株式会社大和化成研究所 Plating method and plating solution precursor used for it
CN1132963C (en) * 2000-03-03 2003-12-31 北京航空航天大学 Formula for chemical plating nickel and application thereof
US6800121B2 (en) * 2002-06-18 2004-10-05 Atotech Deutschland Gmbh Electroless nickel plating solutions
JP2005194562A (en) 2004-01-06 2005-07-21 Murata Mfg Co Ltd Electroless nickel plating liquid, and method for producing ceramic electronic component
CN100476026C (en) * 2005-07-11 2009-04-08 佛山市顺德区汉达精密电子科技有限公司 Copper-alloy chemical nickeling process
WO2010045559A1 (en) 2008-10-16 2010-04-22 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom
JP5297171B2 (en) * 2008-12-03 2013-09-25 上村工業株式会社 Electroless nickel plating bath and electroless nickel plating method
US8404369B2 (en) * 2010-08-03 2013-03-26 WD Media, LLC Electroless coated disks for high temperature applications and methods of making the same
KR101365457B1 (en) * 2012-03-15 2014-02-21 한국기계연구원 Method of Manufacturing Ni-coated Nano- carbons
EP2671969A1 (en) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
CN103952687B (en) * 2014-05-05 2017-02-15 广东东硕科技有限公司 Plating penetration prevention method for chemical nickel-plating of printed circuit board
CN104103433B (en) * 2014-07-21 2016-02-17 南通万德科技有限公司 Switch contact of a kind of arc ablation resistance and preparation method thereof

Also Published As

Publication number Publication date
JP6667525B2 (en) 2020-03-18
TWI683927B (en) 2020-02-01
CA2968437A1 (en) 2016-06-02
CN107109654B (en) 2019-08-27
ES2705430T3 (en) 2019-03-25
EP3224388B1 (en) 2018-10-17
EP3026143A1 (en) 2016-06-01
WO2016083195A1 (en) 2016-06-02
JP2017535674A (en) 2017-11-30
EP3224388A1 (en) 2017-10-04
KR20170086051A (en) 2017-07-25
US20170335462A1 (en) 2017-11-23
CN107109654A (en) 2017-08-29
CA2968437C (en) 2022-11-22
TW201623686A (en) 2016-07-01
KR102497590B1 (en) 2023-02-07

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