BR0316358B1 - mistura de compostos oligomÉricos de fenazÍnio, mÉtodo de preparaÇço dessa mistura, banho de Ácido para deposiÇço eletrolÍtica de uma camada de cobre e mÉtodo para deposiÇço eletrolÍtica de uma camada de cobre. - Google Patents
mistura de compostos oligomÉricos de fenazÍnio, mÉtodo de preparaÇço dessa mistura, banho de Ácido para deposiÇço eletrolÍtica de uma camada de cobre e mÉtodo para deposiÇço eletrolÍtica de uma camada de cobre.Info
- Publication number
- BR0316358B1 BR0316358B1 BRPI0316358-0A BR0316358A BR0316358B1 BR 0316358 B1 BR0316358 B1 BR 0316358B1 BR 0316358 A BR0316358 A BR 0316358A BR 0316358 B1 BR0316358 B1 BR 0316358B1
- Authority
- BR
- Brazil
- Prior art keywords
- mixture
- compounds
- phenazinium
- copper layer
- electrolytic deposition
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 6
- SQHWUYVHKRVCMD-UHFFFAOYSA-N 2-n,2-n-dimethyl-10-phenylphenazin-10-ium-2,8-diamine;chloride Chemical compound [Cl-].C12=CC(N(C)C)=CC=C2N=C2C=CC(N)=CC2=[N+]1C1=CC=CC=C1 SQHWUYVHKRVCMD-UHFFFAOYSA-N 0.000 title abstract 5
- 150000001875 compounds Chemical class 0.000 title abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 239000002253 acid Substances 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 230000008021 deposition Effects 0.000 title 2
- 239000000178 monomer Substances 0.000 abstract 5
- -1 phenazinium compound Chemical class 0.000 abstract 2
- 125000001424 substituent group Chemical group 0.000 abstract 2
- 229910006069 SO3H Inorganic materials 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000001450 anions Chemical class 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 125000001841 imino group Chemical group [H]N=* 0.000 abstract 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 abstract 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 abstract 1
- 125000004043 oxo group Chemical group O=* 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D241/00—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings
- C07D241/36—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems
- C07D241/38—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems with only hydrogen or carbon atoms directly attached to the ring nitrogen atoms
- C07D241/46—Phenazines
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10261852A DE10261852B3 (de) | 2002-12-20 | 2002-12-20 | Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad |
| PCT/EP2003/013994 WO2004057061A1 (en) | 2002-12-20 | 2003-12-09 | Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BR0316358A BR0316358A (pt) | 2005-09-27 |
| BR0316358B1 true BR0316358B1 (pt) | 2013-02-05 |
Family
ID=32240577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0316358-0A BR0316358B1 (pt) | 2002-12-20 | 2003-12-09 | mistura de compostos oligomÉricos de fenazÍnio, mÉtodo de preparaÇço dessa mistura, banho de Ácido para deposiÇço eletrolÍtica de uma camada de cobre e mÉtodo para deposiÇço eletrolÍtica de uma camada de cobre. |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US7872130B2 (pt) |
| EP (1) | EP1592825B1 (pt) |
| JP (1) | JP4352004B2 (pt) |
| KR (1) | KR101094117B1 (pt) |
| CN (1) | CN1729312B (pt) |
| AT (1) | ATE426693T1 (pt) |
| AU (1) | AU2003296632A1 (pt) |
| BR (1) | BR0316358B1 (pt) |
| CA (1) | CA2502717C (pt) |
| DE (2) | DE10261852B3 (pt) |
| ES (1) | ES2322052T3 (pt) |
| MX (1) | MXPA05006782A (pt) |
| TW (1) | TWI313679B (pt) |
| WO (1) | WO2004057061A1 (pt) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004346381A (ja) * | 2003-05-23 | 2004-12-09 | Hitachi Ltd | プリント配線基板、その製造方法、電気銅めっき方法、及び電気銅めっき液 |
| DE102005011708B3 (de) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
| JP4950479B2 (ja) * | 2005-11-22 | 2012-06-13 | 三井化学株式会社 | 有機電界発光素子およびジヒドロフェナジン誘導体 |
| GB2436169A (en) * | 2006-03-07 | 2007-09-19 | Garry Myatt | Creation of copper filled blind vias using laser ablation in a double sided PCB |
| US7887693B2 (en) * | 2007-06-22 | 2011-02-15 | Maria Nikolova | Acid copper electroplating bath composition |
| US8735580B2 (en) | 2010-09-24 | 2014-05-27 | Andrew M. Krol | Method of producing polymeric phenazonium compounds |
| US8691987B2 (en) | 2010-09-24 | 2014-04-08 | Andrew M. Krol | Method of producing polymeric phenazonium compounds |
| US9418937B2 (en) | 2011-12-09 | 2016-08-16 | Infineon Technologies Ag | Integrated circuit and method of forming an integrated circuit |
| PL3483307T3 (pl) * | 2017-11-09 | 2020-11-16 | Atotech Deutschland Gmbh | Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłoża |
| CN114539173B (zh) * | 2022-02-18 | 2023-06-02 | 内蒙古科技大学 | 一种四电子双联羟基吩嗪衍生物及其衍生物、制备方法和应用 |
| EP4276224A1 (en) * | 2022-05-13 | 2023-11-15 | Centre national de la recherche scientifique | Functionnalised copper electrochemical catalysts for conversion of co2 to small molecules |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL75967C (pt) | 1952-05-26 | |||
| NL83873C (pt) | 1952-05-26 | |||
| DE1152863B (de) | 1957-03-16 | 1963-08-14 | Riedel & Co | Saure Baeder zur Herstellung von einebnenden Kupferueberzuegen |
| DE1165962B (de) | 1957-03-16 | 1964-03-19 | Riedel & Co | Saure Baeder zur Herstellung von einebnenden Kupferueberzuegen |
| DE1218247B (de) | 1960-06-09 | 1966-06-02 | Riedel & Co | Saures galvanisches Kupferbad |
| NL291575A (pt) | 1962-04-16 | |||
| DE1246347B (de) | 1966-03-08 | 1967-08-03 | Schering Ag | Saures galvanisches Kupferbad |
| DE2039831C3 (de) | 1970-06-06 | 1979-09-06 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge |
| DE2204326C3 (de) * | 1972-01-26 | 1981-07-09 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und duktilen Kupferüberzügen |
| AU554236B2 (en) | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
| AU559896B2 (en) | 1983-06-10 | 1987-03-26 | Omi International Corp. | Electrolytic copper depositing processes |
| JPS6056086A (ja) | 1983-09-06 | 1985-04-01 | Hodogaya Chem Co Ltd | 銅メツキ浴 |
| US4551212A (en) | 1985-03-11 | 1985-11-05 | Rca Corporation | Bath and process for the electrodeposition of micromachinable copper and additive for said bath |
| DD261613A1 (de) | 1987-06-05 | 1988-11-02 | Leipzig Galvanotechnik | Verfahren zur elektrolytischen kupferabscheidung aus sauren elektrolyten mit dimensionsstabiler anode |
| DE4032864A1 (de) | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
| US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
| DE4126502C1 (pt) | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
| DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
| US6242602B1 (en) * | 1999-03-29 | 2001-06-05 | Gentex Corporation | One pot synthesis of 5,10-dihydrophenazine compounds and 5,10-substituted dihydrophenazines |
-
2002
- 2002-12-20 DE DE10261852A patent/DE10261852B3/de not_active Expired - Fee Related
-
2003
- 2003-12-09 DE DE60326885T patent/DE60326885D1/de not_active Expired - Lifetime
- 2003-12-09 US US10/538,286 patent/US7872130B2/en not_active Expired - Fee Related
- 2003-12-09 EP EP03813565A patent/EP1592825B1/en not_active Expired - Lifetime
- 2003-12-09 ES ES03813565T patent/ES2322052T3/es not_active Expired - Lifetime
- 2003-12-09 JP JP2004561264A patent/JP4352004B2/ja not_active Expired - Fee Related
- 2003-12-09 CN CN2003801070069A patent/CN1729312B/zh not_active Expired - Fee Related
- 2003-12-09 CA CA2502717A patent/CA2502717C/en not_active Expired - Fee Related
- 2003-12-09 WO PCT/EP2003/013994 patent/WO2004057061A1/en active Application Filing
- 2003-12-09 MX MXPA05006782A patent/MXPA05006782A/es active IP Right Grant
- 2003-12-09 KR KR1020057011603A patent/KR101094117B1/ko not_active IP Right Cessation
- 2003-12-09 AT AT03813565T patent/ATE426693T1/de not_active IP Right Cessation
- 2003-12-09 AU AU2003296632A patent/AU2003296632A1/en not_active Abandoned
- 2003-12-09 BR BRPI0316358-0A patent/BR0316358B1/pt not_active IP Right Cessation
- 2003-12-15 TW TW092135371A patent/TWI313679B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20060226021A1 (en) | 2006-10-12 |
| CA2502717C (en) | 2011-10-18 |
| AU2003296632A1 (en) | 2004-07-14 |
| CN1729312B (zh) | 2012-05-09 |
| DE60326885D1 (de) | 2009-05-07 |
| CN1729312A (zh) | 2006-02-01 |
| TWI313679B (en) | 2009-08-21 |
| US7872130B2 (en) | 2011-01-18 |
| WO2004057061A1 (en) | 2004-07-08 |
| KR20050085841A (ko) | 2005-08-29 |
| BR0316358A (pt) | 2005-09-27 |
| EP1592825B1 (en) | 2009-03-25 |
| JP2006512480A (ja) | 2006-04-13 |
| CA2502717A1 (en) | 2004-07-08 |
| KR101094117B1 (ko) | 2011-12-15 |
| DE10261852B3 (de) | 2004-06-03 |
| JP4352004B2 (ja) | 2009-10-28 |
| MXPA05006782A (es) | 2005-09-08 |
| ES2322052T3 (es) | 2009-06-16 |
| EP1592825A1 (en) | 2005-11-09 |
| TW200508209A (en) | 2005-03-01 |
| ATE426693T1 (de) | 2009-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 09/12/2003, OBSERVADAS AS CONDICOES LEGAIS. |
|
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 15A ANUIDADE. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2494 DE 23-10-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |