AU627757B2 - Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof - Google Patents

Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof

Info

Publication number
AU627757B2
AU627757B2 AU39322/89A AU3932289A AU627757B2 AU 627757 B2 AU627757 B2 AU 627757B2 AU 39322/89 A AU39322/89 A AU 39322/89A AU 3932289 A AU3932289 A AU 3932289A AU 627757 B2 AU627757 B2 AU 627757B2
Authority
AU
Australia
Prior art keywords
epoxy
resin
groups
reactive hot
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU39322/89A
Other languages
English (en)
Other versions
AU3932289A (en
Inventor
Hubert Schenkel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Teroson GmbH
Original Assignee
Henkel Teroson GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Teroson GmbH filed Critical Henkel Teroson GmbH
Publication of AU3932289A publication Critical patent/AU3932289A/en
Application granted granted Critical
Publication of AU627757B2 publication Critical patent/AU627757B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/10—Polycondensates containing more than one epoxy group per molecule of polyamines with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU39322/89A 1988-08-10 1989-08-04 Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof Ceased AU627757B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3827626 1988-08-10
DE3827626A DE3827626A1 (de) 1988-08-10 1988-08-10 Reaktiver schmelzklebstoff

Publications (2)

Publication Number Publication Date
AU3932289A AU3932289A (en) 1990-02-15
AU627757B2 true AU627757B2 (en) 1992-09-03

Family

ID=6360865

Family Applications (1)

Application Number Title Priority Date Filing Date
AU39322/89A Ceased AU627757B2 (en) 1988-08-10 1989-08-04 Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof

Country Status (8)

Country Link
US (1) US5084532A (enExample)
EP (1) EP0354498B1 (enExample)
JP (1) JP2689992B2 (enExample)
AT (1) ATE185830T1 (enExample)
AU (1) AU627757B2 (enExample)
CA (1) CA1341122C (enExample)
DE (2) DE3827626A1 (enExample)
ES (1) ES2138954T3 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4023145A1 (de) * 1990-07-20 1992-01-23 Thera Ges Fuer Patente Copolymerisierbare zusammensetzung, diese enthaltende haertbare harzmasse und ihre verwendung
CA2112410C (en) * 1991-06-26 2003-12-09 Norman E. Blank Reactive hot-melt adhesive
DE4342721A1 (de) * 1993-12-15 1995-06-22 Hoechst Ag Elastisches Epoxidharz-Härter-System
DE4342722A1 (de) * 1993-12-15 1995-06-22 Hoechst Ag Elastisches Epoxidharz-Härter-System
US5708056A (en) * 1995-12-04 1998-01-13 Delco Electronics Corporation Hot melt epoxy encapsulation material
US6162504A (en) * 1997-12-04 2000-12-19 Henkel Corporation Adhesives and sealants containing adhesion promoter comprising waste powder prime
US20040181013A1 (en) * 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
DE19909270A1 (de) 1999-03-03 2000-09-07 Henkel Teroson Gmbh Hitzehärtbarer, thermisch expandierbarer Formkörper
ES2221909T3 (es) 2000-04-10 2005-01-16 Henkel Kommanditgesellschaft Auf Aktien Composiciones de resina epoxi resilientes.
DE10062009A1 (de) * 2000-12-13 2002-07-04 Henkel Teroson Gmbh Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis
DE10163859A1 (de) * 2001-12-22 2003-07-10 Henkel Kgaa Mehrphasige Strukturklebstoffe
US20030192643A1 (en) 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
US7176044B2 (en) 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
DE10312815A1 (de) 2003-03-22 2004-10-07 Henkel Kgaa Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen
ES2375498T3 (es) * 2005-08-24 2012-03-01 Henkel Ag & Co. Kgaa Resinas epoxi que tienen una resistencia al impacto mejorada.
ES2691528T3 (es) * 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
US7759435B2 (en) * 2006-09-26 2010-07-20 Loctite (R&D) Limited Adducts and curable compositions using same
CN101547990B (zh) * 2006-10-06 2012-09-05 汉高股份及两合公司 可泵送的耐洗掉的环氧膏状粘合剂
EP2086927B1 (en) * 2006-10-25 2013-02-27 Loctite (R & D) Limited Iminium salts and methods of preparing electron deficient olefins using such novel iminium salts
DE102007027595A1 (de) 2007-06-12 2008-12-18 Henkel Ag & Co. Kgaa Klebstoffzusammensetzungen
EP2173810A4 (en) * 2007-07-26 2012-07-25 Henkel Corp CURABLE ADHESIVE COMPOSITIONS BASED ON EPOXY RESIN
US20090104448A1 (en) * 2007-10-17 2009-04-23 Henkel Ag & Co. Kgaa Preformed adhesive bodies useful for joining substrates
MX2010004855A (es) * 2007-10-30 2010-06-30 Henkel Ag & Co Kgaa Adhesivos de pasta epoxi resistentes al lavado.
US20090188269A1 (en) * 2008-01-25 2009-07-30 Henkel Corporation High pressure connection systems and methods for their manufacture
DE102008009371A1 (de) * 2008-02-14 2009-08-20 Henkel Ag & Co. Kgaa Verfahren zur Herstellung eines Wärmetauschers
DE102008023276A1 (de) 2008-05-13 2009-11-19 Henkel Ag & Co. Kgaa Verbinden von Rohren mit thermisch härtbaren Klebstoffen
EP2135909B1 (en) * 2008-06-12 2018-01-10 Henkel IP & Holding GmbH Next generation, highly toughened two part structural epoxy adhesive compositions
DE102008034105A1 (de) 2008-07-21 2010-01-28 Henkel Ag & Co. Kgaa Verbinden von Rohren mittels einer Hülse und einem thermisch expandierbaren Klebstoff
DE102009028100A1 (de) * 2009-07-29 2011-02-03 Henkel Ag & Co. Kgaa Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis
DE102009028180A1 (de) 2009-08-03 2011-02-10 Henkel Ag & Co. Kgaa Verfahren zum Befestigen eines Magneten auf oder in einem Rotor oder Stator
WO2011025873A1 (en) 2009-08-31 2011-03-03 Cytec Technology Corp. High performance adhesive compositions
DE102009045903A1 (de) 2009-10-21 2011-04-28 Henkel Ag & Co. Kgaa Schlagzähe, bei Raumtemperatur härtende zweikomponentige Masse auf Epoxidbasis
DE102010004792A1 (de) * 2010-01-16 2011-07-28 Aktiebolaget Skf Verfahren zum Festlegen eines Lagerrings an oder in einem Bauteil
JP5597498B2 (ja) * 2010-09-22 2014-10-01 電気化学工業株式会社 エポキシ樹脂組成物、回路基板及び発光装置
MX2013003295A (es) 2010-09-23 2013-05-22 Henkel Corp Composicion epoxica resistente a vapor quimico.
DE102011003915A1 (de) 2011-02-10 2012-08-16 Aktiebolaget Skf Dichtungsanordnung
DE102011005500A1 (de) 2011-03-14 2012-09-20 Aktiebolaget Skf Lagerring eines Gleit- oder Wälzlagers
EP3024871B1 (en) 2013-07-26 2022-12-07 Zephyros Inc. Thermosetting adhesive films including a fibrous carrier
DE102014226826A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Epoxidharz-Zusammensetzung
CN107567486A (zh) 2015-05-01 2018-01-09 洛德公司 用于橡胶粘接的粘合剂
CN108603009B (zh) 2016-02-29 2020-10-20 三菱化学株式会社 环氧树脂组合物、成型材料及纤维增强复合材料
EP3595892B1 (en) 2017-03-13 2023-07-05 Zephyros Inc. Composite sandwich panel comprising honeycomb core and layer of damping or attenuation material
JP6708256B2 (ja) 2017-04-12 2020-06-10 三菱ケミカル株式会社 シートモールディングコンパウンド、および繊維強化複合材料
US11485881B2 (en) 2017-12-15 2022-11-01 3M Innovative Properties Company High temperature structural adhesive films
HUE072999T2 (hu) * 2018-07-25 2025-12-28 Lg Chemical Ltd Ragasztó készítmény
JP7238092B2 (ja) 2018-07-25 2023-03-13 エルジー・ケム・リミテッド 接着剤組成物
US12173194B2 (en) 2018-07-25 2024-12-24 Lg Chem, Ltd. Adhesive composition
US12173195B2 (en) 2018-07-25 2024-12-24 Lg Chem, Ltd. Adhesive composition
JP7154378B2 (ja) 2018-07-25 2022-10-17 エルジー・ケム・リミテッド 接着剤組成物
KR102183705B1 (ko) 2018-07-25 2020-11-27 주식회사 엘지화학 접착제 조성물
JP7167301B2 (ja) 2018-07-25 2022-11-08 エルジー・ケム・リミテッド 接着剤組成物
WO2020050200A1 (ja) 2018-09-05 2020-03-12 三菱ケミカル株式会社 シートモールディングコンパウンド、および繊維強化複合材料
CN114364765B (zh) 2019-09-27 2024-04-19 株式会社钟化 粘接剂及粘接剂的制造方法
EP3822078A1 (de) * 2019-11-15 2021-05-19 voestalpine Stahl GmbH Elektroband oder -blech, verfahren zur herstellung solch eines elektrobands oder -blechs sowie blechpaket daraus

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3299169A (en) * 1961-09-18 1967-01-17 Dow Chemical Co Elastomeric epoxy resin
DE2123033A1 (de) * 1971-02-11 1972-08-24 Du Pont Epoxy haltige Polymermasse
DE2659928C2 (de) * 1976-01-22 1982-12-23 Hoechst Ag, 6000 Frankfurt Wäßrige Epoxidharzdispersionen, Verfahren zur Herstellung und Verwendung derselben
DE2659989C2 (de) * 1976-01-22 1982-10-21 Hoechst Ag, 6000 Frankfurt Wäßrige Epoxidharzdispersionen Verfahren zur Herstellung und Verwendung derselben
DE3108073C2 (de) * 1981-03-04 1983-10-06 Basf Farben + Fasern Ag, 2000 Hamburg Wasserdispergierbare Bindemittel für kationische Elektrotauchlacke
DE3202300C1 (de) * 1982-01-26 1983-07-28 Th. Goldschmidt Ag, 4300 Essen Verfahren zum Flexibilisieren von Epoxidharzen
US4403078A (en) * 1982-09-07 1983-09-06 Texaco Inc. Epoxy resin composition
US4423170A (en) * 1982-10-15 1983-12-27 Texaco Inc. One component water reduced epoxy adhesives
EP0130741A1 (en) * 1983-07-05 1985-01-09 Texaco Development Corporation Extended amine curing agents and epoxy resins cured therewith
US4578412A (en) * 1983-07-05 1986-03-25 Texaco Inc. Extended amine curing agents [and epoxy resins cured therewith]
US4552933A (en) * 1983-07-05 1985-11-12 Texaco Inc. Extended amine curing agents and epoxy resins cured therewith
US4514530A (en) * 1983-07-05 1985-04-30 Texaco Inc. Modified amine curing agents and epoxy resins cured therewith
DE3409188A1 (de) * 1984-03-14 1985-09-19 Basf Farben + Fasern Ag, 2000 Hamburg Mit alkoholen modifizierte polyepoxide, ihre herstellung und verwendung in haertbaren mischungen
JPS61188478A (ja) * 1985-02-18 1986-08-22 Toagosei Chem Ind Co Ltd 接着剤組成物
US4734468A (en) * 1986-02-28 1988-03-29 Shell Oil Company Epoxy resin composition
US4728384A (en) * 1986-06-23 1988-03-01 Ashland Oil, Inc. Two component epoxy structural adhesives with improved flexibility
JPS63308026A (ja) * 1987-06-09 1988-12-15 Mitsubishi Kasei Corp 繊維強化プラスチック用樹脂組成物
US4912179A (en) * 1988-03-30 1990-03-27 Toa Nenryo Kogyo Kabushiki Kaisha Bisphenol A epoxy resin mixtures with aromatic di-secondary amine

Also Published As

Publication number Publication date
US5084532A (en) 1992-01-28
ATE185830T1 (de) 1999-11-15
EP0354498A2 (de) 1990-02-14
JPH0288685A (ja) 1990-03-28
CA1341122C (en) 2000-10-17
DE3827626A1 (de) 1990-03-08
JP2689992B2 (ja) 1997-12-10
DE58909861D1 (de) 1999-11-25
DE3827626C2 (enExample) 1991-03-07
AU3932289A (en) 1990-02-15
EP0354498A3 (de) 1991-07-03
EP0354498B1 (de) 1999-10-20
ES2138954T3 (es) 2000-02-01

Similar Documents

Publication Publication Date Title
AU3932289A (en) Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof
AU3495789A (en) Colour-changeable adhesive
ES2071078T3 (es) Mezclas de materiales, endurecibles, a base de resina epoxi, que contienen un endurecedor latente, una amina y un tiol.
MY110809A (en) Epoxy molding composition for surface mount applications
EP0200678A3 (en) Method for glueing surfaces with a curable epoxy resin composition
EP0398700A3 (en) Latent hardeners for epoxy resin compositions
BR8400531A (pt) Composicoes de epoxido com um endurecedor de diamina,material de reforco pre-impregnado com a resina sintetica(prepreg),e aglomerado
ATE123502T1 (de) Härtbare epoxydharzzusammensetzungen.
DE68914081D1 (de) Schnellhärtende Polyurethandichtmasse, die silylsubstituierte Guanidinbeschleuniger enthält.
AU5141290A (en) Imidazoline compounds
RU95105458A (ru) Способ отверждения композиции, отверждаемая композиция, изделие, выполненное из отверждаемой композиции
EP0388473A4 (en) Silicone-epoxy resin composition and conductive adhesive prepared therefrom
DE69011688D1 (de) Pulverförmige überzugsmittel auf der basis von epoxyharzen.
EP0197524A3 (en) Curable epoxy-acrylamide compositions
ES8500305A1 (es) Procedimiento para preparar un endurecedor para adhesivos de acrilato reactivos.
EP0428863A3 (en) Epoxy resin mixtures
SU1501506A1 (ru) Состав для герметизации радиоэлектронных устройств
JPS5792019A (en) Preparation of imidazole mixture assuming liquidity at room temperature
AU2715088A (en) Epoxy resin compositions for use in low temperature curing applications

Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired