AU2002236801A1 - Reduced edge contact wafer handling system and method of retrofitting and using same - Google Patents

Reduced edge contact wafer handling system and method of retrofitting and using same

Info

Publication number
AU2002236801A1
AU2002236801A1 AU2002236801A AU3680102A AU2002236801A1 AU 2002236801 A1 AU2002236801 A1 AU 2002236801A1 AU 2002236801 A AU2002236801 A AU 2002236801A AU 3680102 A AU3680102 A AU 3680102A AU 2002236801 A1 AU2002236801 A1 AU 2002236801A1
Authority
AU
Australia
Prior art keywords
retrofitting
same
handling system
edge contact
wafer handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002236801A
Other languages
English (en)
Inventor
Stanislaw Kopacz
Michael James Lombardi
Glyn Reynolds
Todd Michael Visconti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2002236801A1 publication Critical patent/AU2002236801A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
AU2002236801A 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same Abandoned AU2002236801A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/725,823 US6692219B2 (en) 2000-11-29 2000-11-29 Reduced edge contact wafer handling system and method of retrofitting and using same
US09/725,823 2000-11-29
PCT/US2002/001545 WO2002045137A2 (en) 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same

Publications (1)

Publication Number Publication Date
AU2002236801A1 true AU2002236801A1 (en) 2002-06-11

Family

ID=24916099

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002236801A Abandoned AU2002236801A1 (en) 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same

Country Status (7)

Country Link
US (1) US6692219B2 (https=)
EP (1) EP1340246A2 (https=)
JP (1) JP4060185B2 (https=)
CN (1) CN1481577A (https=)
AU (1) AU2002236801A1 (https=)
TW (1) TW511136B (https=)
WO (1) WO2002045137A2 (https=)

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US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
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CN115485826A (zh) * 2020-03-06 2022-12-16 朗姆研究公司 具有柔性居中指部的环结构
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Also Published As

Publication number Publication date
EP1340246A2 (en) 2003-09-03
US6692219B2 (en) 2004-02-17
JP2004515073A (ja) 2004-05-20
CN1481577A (zh) 2004-03-10
JP4060185B2 (ja) 2008-03-12
US20020064450A1 (en) 2002-05-30
WO2002045137A3 (en) 2003-03-20
TW511136B (en) 2002-11-21
WO2002045137A2 (en) 2002-06-06

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