AU2001253890A1 - Methods and apparatus for thermally processing wafers - Google Patents

Methods and apparatus for thermally processing wafers

Info

Publication number
AU2001253890A1
AU2001253890A1 AU2001253890A AU5389001A AU2001253890A1 AU 2001253890 A1 AU2001253890 A1 AU 2001253890A1 AU 2001253890 A AU2001253890 A AU 2001253890A AU 5389001 A AU5389001 A AU 5389001A AU 2001253890 A1 AU2001253890 A1 AU 2001253890A1
Authority
AU
Australia
Prior art keywords
methods
wafers
thermally processing
process chamber
processing wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001253890A
Other languages
English (en)
Inventor
James J. Mezey Sr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JAMES J MEZEY SR
Original Assignee
JAMES J MEZEY SR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JAMES J MEZEY SR filed Critical JAMES J MEZEY SR
Publication of AU2001253890A1 publication Critical patent/AU2001253890A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
AU2001253890A 2000-04-17 2001-04-12 Methods and apparatus for thermally processing wafers Abandoned AU2001253890A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09550888 2000-04-17
US09/550,888 US6331212B1 (en) 2000-04-17 2000-04-17 Methods and apparatus for thermally processing wafers
PCT/US2001/040511 WO2001080291A1 (en) 2000-04-17 2001-04-12 Methods and apparatus for thermally processing wafers

Publications (1)

Publication Number Publication Date
AU2001253890A1 true AU2001253890A1 (en) 2001-10-30

Family

ID=24198985

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001253890A Abandoned AU2001253890A1 (en) 2000-04-17 2001-04-12 Methods and apparatus for thermally processing wafers

Country Status (10)

Country Link
US (2) US6331212B1 (enExample)
EP (1) EP1275135B1 (enExample)
JP (1) JP2003531489A (enExample)
KR (1) KR100793329B1 (enExample)
CN (1) CN1199236C (enExample)
AT (1) ATE390705T1 (enExample)
AU (1) AU2001253890A1 (enExample)
DE (1) DE60133376T2 (enExample)
TW (1) TW529059B (enExample)
WO (1) WO2001080291A1 (enExample)

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Also Published As

Publication number Publication date
CN1430789A (zh) 2003-07-16
KR100793329B1 (ko) 2008-01-11
US6331212B1 (en) 2001-12-18
US6774060B2 (en) 2004-08-10
HK1057130A1 (en) 2004-03-12
KR20030010601A (ko) 2003-02-05
ATE390705T1 (de) 2008-04-15
EP1275135B1 (en) 2008-03-26
JP2003531489A (ja) 2003-10-21
WO2001080291A1 (en) 2001-10-25
TW529059B (en) 2003-04-21
CN1199236C (zh) 2005-04-27
DE60133376D1 (de) 2008-05-08
WO2001080291B1 (en) 2002-02-21
US20010046768A1 (en) 2001-11-29
DE60133376T2 (de) 2009-04-23
EP1275135A1 (en) 2003-01-15

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