KR100793329B1 - 웨이퍼들을 열처리하기 위한 방법들 및 장치 - Google Patents

웨이퍼들을 열처리하기 위한 방법들 및 장치 Download PDF

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KR100793329B1
KR100793329B1 KR1020027013933A KR20027013933A KR100793329B1 KR 100793329 B1 KR100793329 B1 KR 100793329B1 KR 1020027013933 A KR1020027013933 A KR 1020027013933A KR 20027013933 A KR20027013933 A KR 20027013933A KR 100793329 B1 KR100793329 B1 KR 100793329B1
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wafer
processing chamber
processing
zone
gas
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KR20030010601A (ko
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제임스 제이. 메제이 에스 알.
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제임스 제이. 메제이 에스 알.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
KR1020027013933A 2000-04-17 2001-04-12 웨이퍼들을 열처리하기 위한 방법들 및 장치 Expired - Fee Related KR100793329B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/550,888 2000-04-17
US09/550,888 US6331212B1 (en) 2000-04-17 2000-04-17 Methods and apparatus for thermally processing wafers
PCT/US2001/040511 WO2001080291A1 (en) 2000-04-17 2001-04-12 Methods and apparatus for thermally processing wafers

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KR20030010601A KR20030010601A (ko) 2003-02-05
KR100793329B1 true KR100793329B1 (ko) 2008-01-11

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US (2) US6331212B1 (enExample)
EP (1) EP1275135B1 (enExample)
JP (1) JP2003531489A (enExample)
KR (1) KR100793329B1 (enExample)
CN (1) CN1199236C (enExample)
AT (1) ATE390705T1 (enExample)
AU (1) AU2001253890A1 (enExample)
DE (1) DE60133376T2 (enExample)
TW (1) TW529059B (enExample)
WO (1) WO2001080291A1 (enExample)

Cited By (1)

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KR20160043487A (ko) * 2014-10-13 2016-04-21 주식회사 테스 유기금속화학기상증착장치

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KR101651880B1 (ko) * 2014-10-13 2016-08-29 주식회사 테스 유기금속화학기상증착장치

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US6331212B1 (en) 2001-12-18
US6774060B2 (en) 2004-08-10
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KR20030010601A (ko) 2003-02-05
ATE390705T1 (de) 2008-04-15
EP1275135B1 (en) 2008-03-26
AU2001253890A1 (en) 2001-10-30
JP2003531489A (ja) 2003-10-21
WO2001080291A1 (en) 2001-10-25
TW529059B (en) 2003-04-21
CN1199236C (zh) 2005-04-27
DE60133376D1 (de) 2008-05-08
WO2001080291B1 (en) 2002-02-21
US20010046768A1 (en) 2001-11-29
DE60133376T2 (de) 2009-04-23
EP1275135A1 (en) 2003-01-15

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