AU1790001A - Method and apparatus for separating non-metallic materials - Google Patents

Method and apparatus for separating non-metallic materials

Info

Publication number
AU1790001A
AU1790001A AU17900/01A AU1790001A AU1790001A AU 1790001 A AU1790001 A AU 1790001A AU 17900/01 A AU17900/01 A AU 17900/01A AU 1790001 A AU1790001 A AU 1790001A AU 1790001 A AU1790001 A AU 1790001A
Authority
AU
Australia
Prior art keywords
laser beam
substrate
quenching
housing
affected zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU17900/01A
Other languages
English (en)
Inventor
Roger Flannigan
Brian Hoekstra
David Wegerif
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Photonics Inc
Original Assignee
Applied Photonics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Photonics Inc filed Critical Applied Photonics Inc
Publication of AU1790001A publication Critical patent/AU1790001A/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0736Shaping the laser spot into an oval shape, e.g. elliptic shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1423Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the flow carrying an electric current
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow-control means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476Features inside the nozzle for feeding the fluid stream through the nozzle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/102Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic materials other than metals or composite materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/10Methods
    • Y10T225/12With preliminary weakening
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/30Breaking or tearing apparatus
    • Y10T225/304Including means to apply thermal shock to work
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/30Breaking or tearing apparatus
    • Y10T225/307Combined with preliminary weakener or with nonbreaking cutter

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Investigating And Analyzing Materials By Characteristic Methods (AREA)
  • ing And Chemical Polishing (AREA)
AU17900/01A 1999-11-24 2000-11-22 Method and apparatus for separating non-metallic materials Abandoned AU1790001A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16728599P 1999-11-24 1999-11-24
US60167285 1999-11-24
PCT/US2000/032076 WO2001038039A1 (en) 1999-11-24 2000-11-22 Method and apparatus for separating non-metallic materials

Publications (1)

Publication Number Publication Date
AU1790001A true AU1790001A (en) 2001-06-04

Family

ID=22606723

Family Applications (1)

Application Number Title Priority Date Filing Date
AU17900/01A Abandoned AU1790001A (en) 1999-11-24 2000-11-22 Method and apparatus for separating non-metallic materials

Country Status (11)

Country Link
US (2) US6489588B1 (https=)
EP (1) EP1232038B1 (https=)
JP (1) JP3895179B2 (https=)
KR (1) KR100721391B1 (https=)
CN (1) CN1413136A (https=)
AT (1) ATE392984T1 (https=)
AU (1) AU1790001A (https=)
DE (1) DE60038692T2 (https=)
ES (1) ES2304987T3 (https=)
TR (1) TR200201402T2 (https=)
WO (1) WO2001038039A1 (https=)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
DE10041519C1 (de) * 2000-08-24 2001-11-22 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP3802442B2 (ja) * 2000-12-01 2006-07-26 エルジー電子株式会社 ガラス切断方法および装置
US20020170318A1 (en) * 2001-04-02 2002-11-21 Andreas Gartner Brief summary of the invention
KR100676249B1 (ko) * 2001-05-23 2007-01-30 삼성전자주식회사 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치
KR100700997B1 (ko) * 2001-06-21 2007-03-28 삼성전자주식회사 기판 다중 절단 방법 및 이를 수행하기 위한 기판 다중절단 장치
CZ20033505A3 (cs) * 2001-07-02 2004-12-15 Virtek Laser Systems, Inc. Způsob vyhloubení otvoru v tvrdém, nekovovém podkladu
KR100583889B1 (ko) * 2001-07-16 2006-05-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료기판의 스크라이브 장치
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
CN101335235B (zh) 2002-03-12 2010-10-13 浜松光子学株式会社 基板的分割方法
AU2003211581A1 (en) 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method of cutting processed object
US6919531B2 (en) 2002-03-25 2005-07-19 Agilent Technologies, Inc. Methods for producing glass substrates for use in biopolymeric microarrays
FR2839508B1 (fr) * 2002-05-07 2005-03-04 Saint Gobain Vitrage decoupe sans rompage
JP4408607B2 (ja) * 2002-06-11 2010-02-03 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライブ装置
US8348115B2 (en) * 2002-11-06 2013-01-08 Mitsuboshi Diamond Industrial Co., Ltd. Scribe line forming device and scribe line forming method
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
JP4606325B2 (ja) * 2003-01-29 2011-01-05 三星ダイヤモンド工業株式会社 基板分断装置および基板分断方法
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
DE60315515T2 (de) 2003-03-12 2007-12-13 Hamamatsu Photonics K.K., Hamamatsu Laserstrahlbearbeitungsverfahren
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
EP2269765B1 (en) * 2003-07-18 2014-10-15 Hamamatsu Photonics K.K. Cut semiconductor chip
US20050029240A1 (en) * 2003-08-07 2005-02-10 Translume, Inc. Dual light source machining method and system
JP4563097B2 (ja) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
EP1690835B1 (en) * 2003-12-05 2011-08-17 Asahi Glass Company Ltd. Method for cutting glass plates
JP4598407B2 (ja) 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
KR20050100733A (ko) * 2004-04-14 2005-10-20 주식회사 탑 엔지니어링 비금속재 절단장치
KR20050100734A (ko) * 2004-04-14 2005-10-20 주식회사 탑 엔지니어링 비금속재 절단방법
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
JP2008503355A (ja) * 2004-06-21 2008-02-07 アプライド フォトニクス,インク. 基板材料の切断、分断または分割装置、システムおよび方法
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US20060021977A1 (en) * 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
US20090078370A1 (en) * 2004-08-31 2009-03-26 Vladislav Sklyarevich Method of separating non-metallic material using microwave radiation
WO2006062017A1 (ja) * 2004-12-08 2006-06-15 Laser Solutions Co., Ltd. 被分割体における分割起点形成方法、被分割体の分割方法、およびパルスレーザー光による被加工物の加工方法
WO2006083902A1 (en) * 2005-02-02 2006-08-10 Cardinal Ig Company Edge treatment for glass panes
WO2006129504A1 (ja) * 2005-06-03 2006-12-07 Asahi Glass Company, Limited 合わせガラスの切断方法および装置
DE102005027800A1 (de) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum mehrfachen Trennen eines flachen Werkstückes aus einem spröden Material mittels Laser
KR100978259B1 (ko) * 2005-06-20 2010-08-26 엘지디스플레이 주식회사 액정패널 절단시스템 및 이를 이용한 액정표시소자제조방법
US20080236199A1 (en) * 2005-07-28 2008-10-02 Vladislav Sklyarevich Method of Separating Non-Metallic Material Using Microwave Radiation
KR100971042B1 (ko) * 2005-08-12 2010-07-16 시바우라 메카트로닉스 가부시키가이샤 취성 재료의 할단가공 시스템 및 그 방법
KR101081613B1 (ko) * 2005-09-13 2011-11-09 가부시키가이샤 레미 취성재료의 할단방법 및 장치
TW200724276A (en) * 2005-12-26 2007-07-01 Foxsemicon Integrated Tech Inc Laser cutting apparatus
DE102006012582B4 (de) * 2006-03-16 2010-01-21 Schott Ag Vorrichtung und Verfahren zum Abtrennen von Abschnitten von Glasstangen
US20090050661A1 (en) * 2006-03-24 2009-02-26 Youn-Ho Na Glass Cutting Apparatus With Bending Member and Method Using Thereof
JP4977391B2 (ja) * 2006-03-27 2012-07-18 日本電気株式会社 レーザ切断方法、表示装置の製造方法、および表示装置
TWI298280B (en) * 2006-09-06 2008-07-01 Nat Applied Res Laboratories Method for cutting non-metal material
JP4869002B2 (ja) * 2006-09-26 2012-02-01 株式会社東芝 セラミックス基板の製造方法およびセラミックス回路基板の製造方法
JP2008183599A (ja) * 2007-01-31 2008-08-14 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置
US20100320249A1 (en) * 2007-02-28 2010-12-23 Claus Peter Kluge Method for producing a component using asymmetrical energy input along the parting or predetermined breaking line
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US20090085254A1 (en) * 2007-09-28 2009-04-02 Anatoli Anatolyevich Abramov Laser scoring with flat profile beam
US8011207B2 (en) * 2007-11-20 2011-09-06 Corning Incorporated Laser scoring of glass sheets at high speeds and with low residual stress
US8035901B2 (en) * 2008-04-30 2011-10-11 Corning Incorporated Laser scoring with curved trajectory
US8895892B2 (en) * 2008-10-23 2014-11-25 Corning Incorporated Non-contact glass shearing device and method for scribing or cutting a moving glass sheet
CN102203943B (zh) * 2008-10-29 2013-07-31 欧瑞康太阳能股份公司(特吕巴赫) 通过多激光束照射将在基板上形成的半导体膜划分成多个区域的方法
DE102008058310B3 (de) * 2008-11-18 2010-06-17 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Randentschichten beschichteter Substrate und Trennen in einzelne Module
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
KR20170082649A (ko) * 2009-03-20 2017-07-14 코닝 인코포레이티드 정밀 레이저 스코어링
TWI517922B (zh) * 2009-05-13 2016-01-21 康寧公司 切割脆性材料之方法
DE102009023602B4 (de) * 2009-06-02 2012-08-16 Grenzebach Maschinenbau Gmbh Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
WO2011038902A1 (en) * 2009-09-29 2011-04-07 Picodrill Sa A method of cutting a substrate and a device for cutting
US8171753B2 (en) * 2009-11-18 2012-05-08 Corning Incorporated Method for cutting a brittle material
JP5795000B2 (ja) 2009-11-30 2015-10-14 コーニング インコーポレイテッド ガラス基板のレーザスクライブおよび分離方法
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US8887529B2 (en) 2010-10-29 2014-11-18 Corning Incorporated Method and apparatus for cutting glass ribbon
US8461480B2 (en) 2010-11-30 2013-06-11 Electro Scientific Industries, Inc. Orthogonal integrated cleaving device
US20140054348A1 (en) * 2011-06-08 2014-02-27 Yasuo Teranishi Method for cutting plate-like glass, and cutting device therefor
US9090383B2 (en) 2011-12-01 2015-07-28 Sealstrip Corporation Tape sealed reclosable bag
US20130193617A1 (en) * 2012-02-01 2013-08-01 Electro Scientific Industries, Inc. Systems and methods for separating non-metallic materials
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
CN102749746B (zh) * 2012-06-21 2015-02-18 深圳市华星光电技术有限公司 液晶基板切割装置及液晶基板切割方法
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US10017411B2 (en) 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
US9533813B1 (en) * 2015-09-27 2017-01-03 Sealstrip Corporation Re-closable, tamper-resistant, stand-up package
CN107520541B (zh) * 2016-06-20 2020-05-15 南京魔迪多维数码科技有限公司 激光切割脆性材料的方法
WO2018175193A2 (en) 2017-03-22 2018-09-27 Corning Incorporated Methods of separating a glass web
CN106938884B (zh) * 2017-04-19 2019-04-26 重庆坤秀门窗有限公司 一种用于玻璃门切割的玻璃切割机
FR3066488B1 (fr) * 2017-05-19 2022-03-04 Saint Gobain Procede de rompage d'une feuille de verre
JP7184455B2 (ja) * 2018-06-27 2022-12-06 株式会社ディスコ ウェーハの加工方法
TW202035321A (zh) * 2019-01-29 2020-10-01 美商康寧公司 用於撓性薄玻璃的自由形式切割的方法及設備
WO2021041281A1 (en) * 2019-08-23 2021-03-04 John Tyson Ii Methods, system and devices for panel marking and formability measurements, including autonomous methods and devices
WO2021107168A1 (ko) * 2019-11-26 2021-06-03 이석준 레이저 절단 장치 및 방법

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1720883A (en) 1926-11-27 1929-07-16 Bessie L Gregg Apparatus for severing glass or the like
NL299821A (https=) 1962-10-31 1900-01-01
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
US3597578A (en) 1967-03-16 1971-08-03 Nat Res Dev Thermal cutting apparatus and method
US3629545A (en) 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
GB1246481A (en) 1968-03-29 1971-09-15 Pilkington Brothers Ltd Improvements in or relating to the cutting of glass
US3589883A (en) 1968-05-28 1971-06-29 Ppg Industries Inc Method and apparatus for thermally fracturing a ribbon of glass
US3604890A (en) 1969-10-15 1971-09-14 Boeing Co Multibeam laser-jet cutting apparatus
US3610871A (en) * 1970-02-19 1971-10-05 Western Electric Co Initiation of a controlled fracture
US3695497A (en) 1970-08-26 1972-10-03 Ppg Industries Inc Method of severing glass
US3790362A (en) 1970-09-15 1974-02-05 Ppg Industries Inc Directional control for thermal severing of glass
US3800991A (en) 1972-04-10 1974-04-02 Ppg Industries Inc Method of and an apparatus for cutting glass
US3795502A (en) 1972-05-26 1974-03-05 Ppg Industries Inc Method of cutting glass
FR2202856B1 (https=) 1972-10-12 1977-03-11 Glaverbel
US4045201A (en) 1976-07-09 1977-08-30 American Atomics Corporation Method and apparatus for subdividing a gas filled glass tube
DE2813302C2 (de) 1978-03-28 1979-09-13 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V., 8000 Muenchen Verfahren und Vorrichtung zum geradlinigen Schneiden von Flachglas mit Hilfe von thermisch induzierten Spannungen
US4467168A (en) 1981-04-01 1984-08-21 Creative Glassworks International Method of cutting glass with a laser and an article made therewith
JPS5987996A (ja) 1982-11-10 1984-05-21 Ishikawajima Harima Heavy Ind Co Ltd レ−ザ・ガス切断装置
US4546231A (en) 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure
JPS6046892A (ja) 1984-07-19 1985-03-13 Toshiba Corp レ−ザ−光照射方法
SU1231813A1 (ru) 1984-10-02 1991-04-23 Организация П/Я Р-6007 Установка дл резки листовых материалов, преимущественно стекл нных пластин
JPS61229487A (ja) 1985-04-03 1986-10-13 Sasaki Glass Kk レ−ザビ−ムによるガラス切断方法
SU1430931A1 (ru) 1985-11-04 1988-10-15 Институт Машиноведения Им.А.А.Благонравова Сканатор дл лазерных технологических установок
JPS6453794A (en) 1987-08-20 1989-03-01 Sumitomo Electric Industries Optical lens for large output laser
WO1989001841A1 (fr) 1987-08-28 1989-03-09 Tsentralnoe Konstruktorskoe Bjuro Unikalnogo Pribo Procede et dispositif de traitement laser d'un objet
JPS6462294A (en) 1987-09-01 1989-03-08 Sumitomo Electric Industries Laser beam machining method
JPH0767633B2 (ja) 1987-11-30 1995-07-26 三菱重工業株式会社 同軸多焦点式レーザビーム集光装置
JP2615093B2 (ja) 1987-11-30 1997-05-28 三菱重工業株式会社 異軸多焦点式レーザビーム集光装置
JPH01306088A (ja) 1988-06-01 1989-12-11 Nippei Toyama Corp 可変ビームレーザ加工装置
JP2724192B2 (ja) 1989-02-17 1998-03-09 株式会社アマダ フィルムコーティング材のレーザ加工方法
JPH02263590A (ja) 1989-04-04 1990-10-26 Matsushita Electric Ind Co Ltd レーザ加工機
JPH02295688A (ja) 1989-05-01 1990-12-06 Amada Co Ltd フィルムコーティング材のレーザ加工方法およびその方法に用いるレーザ加工ヘッド
DE69008927T2 (de) 1989-05-08 1994-12-01 Philips Nv Verfahren zum Spalten einer Platte aus sprödem Werkstoff.
DE69013047T2 (de) 1989-05-08 1995-04-13 Philips Nv Verfahren zum Spalten einer Platte aus sprödem Werkstoff.
DE59002985D1 (de) 1989-07-14 1993-11-11 Maho Ag Verfahren und Vorrichtung zum Herstellen von Hohlräumen in Werkstücken mittels Laserstrahls.
JP2712723B2 (ja) 1990-03-07 1998-02-16 松下電器産業株式会社 レーザ切断方法
US5132505A (en) 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
DE4016199A1 (de) 1990-05-19 1991-11-21 Linde Ag Verfahren und vorrichtung zum laserstrahlschneiden
JPH04118190A (ja) 1990-09-07 1992-04-20 Nagasaki Pref Gov ウェハの割断方法
JPH0639572A (ja) 1991-01-11 1994-02-15 Souei Tsusho Kk ウェハ割断装置
US5223692A (en) 1991-09-23 1993-06-29 General Electric Company Method and apparatus for laser trepanning
JP3083320B2 (ja) 1991-11-19 2000-09-04 アドバンスド・テクニック・ゲーエムベーハー 取り除き工具に対して移動される金属被加工物から物質を取り除く装置
DE4215561C2 (de) 1991-11-19 1995-04-06 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Abtragen von Werkstoff eines relativbewegten metallenen Werkstücks
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5463200A (en) 1993-02-11 1995-10-31 Lumonics Inc. Marking of a workpiece by light energy
US5359176A (en) 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
US5571429A (en) 1994-02-25 1996-11-05 Litel Instruments Apparatus and process for high speed laminate processing with computer generated holograms
US5776220A (en) 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5622540A (en) 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
US5871134A (en) * 1994-12-27 1999-02-16 Asahi Glass Company Ltd. Method and apparatus for breaking and cutting a glass ribbon
US5742026A (en) 1995-06-26 1998-04-21 Corning Incorporated Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
DE69629704T2 (de) * 1995-08-31 2004-07-08 Corning Inc. Verfahren und vorrichtung zum zerbrechen von sprödem material
DE19609199A1 (de) 1996-03-09 1997-09-11 Vetter & Co Apotheker Verfahren zur Bearbeitung von Werkstücken aus festen Materialien sowie Vorrichtung zur Durchführung des Verfahrens
JPH1099978A (ja) 1996-09-27 1998-04-21 Hitachi Ltd レーザー加工装置
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP3498895B2 (ja) * 1997-09-25 2004-02-23 シャープ株式会社 基板の切断方法および表示パネルの製造方法
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe

Also Published As

Publication number Publication date
DE60038692D1 (de) 2008-06-05
EP1232038A1 (en) 2002-08-21
US6489588B1 (en) 2002-12-03
DE60038692T2 (de) 2009-07-02
TR200201402T2 (tr) 2003-03-21
JP2003534132A (ja) 2003-11-18
ATE392984T1 (de) 2008-05-15
WO2001038039A1 (en) 2001-05-31
US20030024909A1 (en) 2003-02-06
EP1232038B1 (en) 2008-04-23
US6660963B2 (en) 2003-12-09
KR100721391B1 (ko) 2007-05-23
JP3895179B2 (ja) 2007-03-22
ES2304987T3 (es) 2008-11-01
CN1413136A (zh) 2003-04-23
WO2001038039A9 (en) 2002-11-07
KR20020071866A (ko) 2002-09-13

Similar Documents

Publication Publication Date Title
AU1790001A (en) Method and apparatus for separating non-metallic materials
IE841438L (en) Etching and plating processes
MY121934A (en) Removal of material by polarized radiation and backside application of radiation
NO954027D0 (no) Fjerning av overflateforurensninger ved bestråling
BR8907529A (pt) Remocao de contaminantes de superficie atraves de irradiacao de uma fonte de elevada energia
ZA929725B (en) Method and apparatus for controlling the cutting and placement of components on an moving substrate, and article made therewith.
AU2716595A (en) Laser-processing head for laser processing apparatus
BR9710764A (pt) Remo-Æo de material por radia-Æo aplicada a um ngulo obliquo
AU7752798A (en) Method for cracking off glassware
CA2224248A1 (en) Laser processing of discrete sheets of material
AU6709894A (en) Improved ophthalmic surgical laser and method
TW330876B (en) Method of separating semiconductor elements formed in a wafer of semiconductor material
GB2396962B (en) Mask for sequential lateral solidification and and crystallization method using thereof
EP0633823A4 (en) Removal of surface contaminants by irradiation.
EP1199127A3 (en) Underwater laser processing apparatus and underwater laser processing method
EP0752018A4 (en) METHOD FOR SURFACE TREATMENT
GB2352324A (en) Apparatus for production and extraction of charged particles
EP1232829A3 (de) Vorrichtung zum Beschriften oder Markieren von Gegenständen mittels Laserstrahl
AU4396996A (en) Surface treatment
ES2151633T3 (es) Procedimiento y dispositivo para el decapado de un substrato metalico.
IL138662A0 (en) Wavelength conversion crystal and method for generating laser beam, and apparatus for generating laser beam
TW348161B (en) Apparatus and method of processing a semiconductor substrate
EP0801448A3 (de) Laserabordnung zur Erzeugung eines Haupt- und eines Referenzlichtstrahls
FR2689143B1 (fr) Dispositif de pulverisation cathodique utilisant un plasma engendre par des micro-ondes.
JPS5388567A (en) Laser scribing apparatus

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase