DE69008927T2 - Verfahren zum Spalten einer Platte aus sprödem Werkstoff. - Google Patents

Verfahren zum Spalten einer Platte aus sprödem Werkstoff.

Info

Publication number
DE69008927T2
DE69008927T2 DE69008927T DE69008927T DE69008927T2 DE 69008927 T2 DE69008927 T2 DE 69008927T2 DE 69008927 T DE69008927 T DE 69008927T DE 69008927 T DE69008927 T DE 69008927T DE 69008927 T2 DE69008927 T2 DE 69008927T2
Authority
DE
Germany
Prior art keywords
splitting
plate made
brittle material
brittle
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69008927T
Other languages
English (en)
Other versions
DE69008927D1 (de
Inventor
Jacobus Nicolaas Dekker
Maarten Harm Zonneveld
Hans Galenkamp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE69008927D1 publication Critical patent/DE69008927D1/de
Application granted granted Critical
Publication of DE69008927T2 publication Critical patent/DE69008927T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/06—Severing by using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
DE69008927T 1989-05-08 1990-05-02 Verfahren zum Spalten einer Platte aus sprödem Werkstoff. Expired - Fee Related DE69008927T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8901144 1989-05-08

Publications (2)

Publication Number Publication Date
DE69008927D1 DE69008927D1 (de) 1994-06-23
DE69008927T2 true DE69008927T2 (de) 1994-12-01

Family

ID=19854609

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69008927T Expired - Fee Related DE69008927T2 (de) 1989-05-08 1990-05-02 Verfahren zum Spalten einer Platte aus sprödem Werkstoff.

Country Status (4)

Country Link
US (1) US5154334A (de)
EP (1) EP0397237B1 (de)
JP (1) JP2835348B2 (de)
DE (1) DE69008927T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
FR2706347B1 (fr) * 1993-06-09 1995-08-04 Puntous Rene Procédé et dispositif pour obtenir la rupture fragile d'éléments en acier.
US5622540A (en) * 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
DE69629704T2 (de) * 1995-08-31 2004-07-08 Corning Inc. Verfahren und vorrichtung zum zerbrechen von sprödem material
JPH10128567A (ja) * 1996-10-30 1998-05-19 Nec Kansai Ltd レーザ割断方法
AU7685198A (en) * 1997-05-12 1998-12-08 Silicon Genesis Corporation A controlled cleavage process
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
EP1232038B1 (de) * 1999-11-24 2008-04-23 Applied Photonics, Inc. Verfahren und vorrichtung zum trennen nichtmetallischer materialien
KR20070005604A (ko) * 2004-04-27 2007-01-10 미쓰보시 다이야몬도 고교 가부시키가이샤 취성기판의 수직크랙 형성방법 및 수직크랙 형성장치
DE102004035342B4 (de) * 2004-07-21 2007-12-27 Schott Ag Verfahren zum Durchtrennen von Platten aus nichtmetallischen Werkstoffen
JP3887394B2 (ja) 2004-10-08 2007-02-28 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
US8051681B2 (en) * 2007-05-09 2011-11-08 Corning Incorporated Constant force scoring device and method for using same
US7895861B2 (en) * 2007-05-09 2011-03-01 Corning Incorporated Conformable nosing device for reducing motion and stress within a glass sheet while manufacturing the glass sheet
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
ES2450520T5 (es) 2010-03-05 2017-08-07 Sage Electrochromics, Inc. Laminado de un dispositivo electrocrómico a sustratos de vidrio
FR2962682B1 (fr) 2010-07-16 2015-02-27 Saint Gobain Vitrage electrochimique a proprietes optiques et/ou energetiques electrocommandables
US9272941B2 (en) * 2012-04-05 2016-03-01 Sage Electrochromics, Inc. Method of cutting a panel using a starter crack and a glass panel including a starter crack
US10029941B2 (en) * 2014-03-31 2018-07-24 Corning Incorporated Machining methods of forming laminated glass structures

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL103324C (de) * 1956-10-12
US3050906A (en) * 1960-03-21 1962-08-28 Glaces De Boussois Method of manufacturing matching sheets of glass
ES362930A1 (es) * 1968-02-28 1970-11-16 Ppg Industries Inc Un metodo de cortar una hoja de vidrio.
US3554722A (en) * 1968-08-30 1971-01-12 Ford Motor Co Method of making a glass window structure
US3739963A (en) * 1971-10-07 1973-06-19 Ppg Industries Inc Method of and an apparatus for controlling edge flare in thermal cutting
FR2319589A1 (fr) * 1975-08-01 1977-02-25 Saint Gobain Obtention d'un vitrage par brisure, suivant une ligne de decoupe, des bordures d'une plaque de verre
US4113162A (en) * 1977-02-09 1978-09-12 Libbey-Owens-Ford Company Method of and apparatus for thermally severing glass
DE2813302C2 (de) * 1978-03-28 1979-09-13 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V., 8000 Muenchen Verfahren und Vorrichtung zum geradlinigen Schneiden von Flachglas mit Hilfe von thermisch induzierten Spannungen
US4670636A (en) * 1984-09-19 1987-06-02 General Electric Company Heat assisted parting of amorphous alloys

Also Published As

Publication number Publication date
DE69008927D1 (de) 1994-06-23
EP0397237B1 (de) 1994-05-18
US5154334A (en) 1992-10-13
JPH02296745A (ja) 1990-12-07
JP2835348B2 (ja) 1998-12-14
EP0397237A1 (de) 1990-11-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL

8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee