TW200724276A - Laser cutting apparatus - Google Patents

Laser cutting apparatus

Info

Publication number
TW200724276A
TW200724276A TW094146459A TW94146459A TW200724276A TW 200724276 A TW200724276 A TW 200724276A TW 094146459 A TW094146459 A TW 094146459A TW 94146459 A TW94146459 A TW 94146459A TW 200724276 A TW200724276 A TW 200724276A
Authority
TW
Taiwan
Prior art keywords
laser
cutting
brittle object
laser cutting
cutting apparatus
Prior art date
Application number
TW094146459A
Other languages
Chinese (zh)
Inventor
Chen-Tsu Fu
Chun-Kai Huang
Hsien-Tang Chen
Ming-Hui Chang
Tsung-Fu Hsu
Fang Shiuan Kuo
Original Assignee
Foxsemicon Integrated Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxsemicon Integrated Tech Inc filed Critical Foxsemicon Integrated Tech Inc
Priority to TW094146459A priority Critical patent/TW200724276A/en
Priority to KR1020060092922A priority patent/KR20070068248A/en
Priority to JP2006348075A priority patent/JP2007175773A/en
Publication of TW200724276A publication Critical patent/TW200724276A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Robotics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

A laser cutting apparatus for cutting a brittle object comprises a scriber, a laser cutting system and a coolant. The scriber is used to produce a predetermined cutting line on the brittle object. The laser cutting system generates a laser to heat the brittle object along the predetermined cutting line and the coolant cools the brittle object along the predetermined cutting line after heated. The laser cutting system comprises a laser generator which generates the laser and an adjuster disposed on a track of the laser to adjust a distance of the laser between the laser generator and the brittle object. Thus, adjusting the diameter of the laser to satisfy different cutting requirements.
TW094146459A 2005-12-26 2005-12-26 Laser cutting apparatus TW200724276A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094146459A TW200724276A (en) 2005-12-26 2005-12-26 Laser cutting apparatus
KR1020060092922A KR20070068248A (en) 2005-12-26 2006-09-25 Laser cutting apparatus
JP2006348075A JP2007175773A (en) 2005-12-26 2006-12-25 Laser cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094146459A TW200724276A (en) 2005-12-26 2005-12-26 Laser cutting apparatus

Publications (1)

Publication Number Publication Date
TW200724276A true TW200724276A (en) 2007-07-01

Family

ID=38301474

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146459A TW200724276A (en) 2005-12-26 2005-12-26 Laser cutting apparatus

Country Status (3)

Country Link
JP (1) JP2007175773A (en)
KR (1) KR20070068248A (en)
TW (1) TW200724276A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418434B (en) * 2007-10-19 2013-12-11 Shibuya Kogyo Co Ltd Laser cutting device
TWI741448B (en) * 2019-12-13 2021-10-01 上儀股份有限公司 Laser device with synchronous optical path delay

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009256151A (en) * 2008-04-18 2009-11-05 Toshiba Mobile Display Co Ltd Method of dividing glass substrate and method of manufacturing display panel
KR101225783B1 (en) * 2009-03-26 2013-01-23 현대제철 주식회사 Laser cutter
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
CN114193005B (en) * 2022-01-23 2023-11-21 阳江市皓殷智造科技有限公司 Stabilizer for laser cutting

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60199586A (en) * 1984-03-22 1985-10-09 Mitsubishi Electric Corp Laser working device
JP3745810B2 (en) * 1996-01-19 2006-02-15 本田技研工業株式会社 Laser processing method and apparatus
AU1790001A (en) * 1999-11-24 2001-06-04 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
JP3594579B2 (en) * 2001-11-19 2004-12-02 住友重機械工業株式会社 Laser machining data acquisition start time judgment method and apparatus
JP2004122173A (en) * 2002-10-02 2004-04-22 Nippon Sharyo Seizo Kaisha Ltd Laser microjet working apparatus
TWI284580B (en) * 2002-11-05 2007-08-01 New Wave Res Method and apparatus for cutting devices from substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418434B (en) * 2007-10-19 2013-12-11 Shibuya Kogyo Co Ltd Laser cutting device
TWI741448B (en) * 2019-12-13 2021-10-01 上儀股份有限公司 Laser device with synchronous optical path delay

Also Published As

Publication number Publication date
JP2007175773A (en) 2007-07-12
KR20070068248A (en) 2007-06-29

Similar Documents

Publication Publication Date Title
TW200722218A (en) Laser cutting apparatus
TW200728219A (en) Laser cutting device and cutting method
TW200724276A (en) Laser cutting apparatus
DE50100628D1 (en) Apparatus and method for sintering a powder with a laser beam
WO2007096460A3 (en) Surface treatment technique and surface treatment apparatus associated with ablation technology
BRPI0605973B8 (en) method for cutting c-mn steel with a laser filament
EP1629934A3 (en) Process and apparatus for manufacturing of a cut or embossing roll by laser buildup welding
WO2009016645A3 (en) Method and apparatus for sheet metal cutting by fiber laser with liner motor
MX2009004286A (en) Device for laser-optical eye surgery.
TWI268272B (en) Glass-plate cutting machine using a laser beam to solve problems, such as uneven glass section and slanting cutting
TW200606641A (en) Method, system, and apparatus for an hierarchical cache line replacement
TW200505805A (en) Brittle board dividing system and brittle board dividing method
DE602007002986D1 (en) COOLING SYSTEM
TW200613228A (en) Device, system and method for cutting, cleaving or separating a substrate material
MY157824A (en) Laser beam machining method, laser beam machining apparatus, and laser beam machined product
MX360043B (en) Device and process for marking an ophthalmic lens with a pulsed laser of wavelength and energy selected per pulse.
SG127819A1 (en) Improved feeding tube
MX2007003742A (en) Brittle material scribing method and scribing apparatus.
HK1116738A1 (en) Laser marking method
MX2009007091A (en) Cutting device and method for producing an absorbent article.
TW200727353A (en) Laser dicing equipment and laser dicing method
GB2465739A (en) Laser beam pattern projector
RS52234B (en) 3-(1,3-benzodioxol-5-yl)-6-(4-cyclopropylpiperazin-1-yl)pyridazine, its salts and solvates and its use as histamine h3 receptor antagonist
TW200942992A (en) Lithographic apparatus, plasma source, and reflecting method
MX370391B (en) System and method for hot stamping of components.