ATE538631T1 - Gehäuse mit elektronischer steuerung - Google Patents

Gehäuse mit elektronischer steuerung

Info

Publication number
ATE538631T1
ATE538631T1 AT05742159T AT05742159T ATE538631T1 AT E538631 T1 ATE538631 T1 AT E538631T1 AT 05742159 T AT05742159 T AT 05742159T AT 05742159 T AT05742159 T AT 05742159T AT E538631 T1 ATE538631 T1 AT E538631T1
Authority
AT
Austria
Prior art keywords
components
enclosure housing
electronic control
heat
housing
Prior art date
Application number
AT05742159T
Other languages
English (en)
Inventor
Arturo Caines
Bratislav Kostic
Thaddeus Rachwalski
Original Assignee
Cinch Connectors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cinch Connectors Inc filed Critical Cinch Connectors Inc
Application granted granted Critical
Publication of ATE538631T1 publication Critical patent/ATE538631T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT05742159T 2004-10-19 2005-04-29 Gehäuse mit elektronischer steuerung ATE538631T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/968,438 US7190589B2 (en) 2004-10-19 2004-10-19 Electronic control enclosure
PCT/US2005/014859 WO2006043980A1 (en) 2004-10-19 2005-04-29 Electronic control enclosure

Publications (1)

Publication Number Publication Date
ATE538631T1 true ATE538631T1 (de) 2012-01-15

Family

ID=34967710

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05742159T ATE538631T1 (de) 2004-10-19 2005-04-29 Gehäuse mit elektronischer steuerung

Country Status (8)

Country Link
US (4) US7190589B2 (de)
EP (4) EP2367413B1 (de)
AT (1) ATE538631T1 (de)
CA (1) CA2579426A1 (de)
ES (2) ES2409708T3 (de)
MX (1) MX2007003261A (de)
PL (1) PL2367413T3 (de)
WO (1) WO2006043980A1 (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881077B2 (en) * 2002-07-22 2005-04-19 Siemens Vdo Automotive Corporation Automotive control module housing
US7672450B2 (en) * 2004-09-09 2010-03-02 Calix Networks, Inc. Network interface device enclosure
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
US7336491B2 (en) * 2005-09-06 2008-02-26 Lear Corporation Heat sink
KR100646404B1 (ko) * 2005-10-26 2006-11-14 주식회사 만도 전자 제어 장치 및 이를 구비한 자동차의 전기식 동력 보조조향장치
JP2007157568A (ja) * 2005-12-07 2007-06-21 Mitsubishi Electric Corp 電子装置
DE102006018716A1 (de) * 2006-04-20 2007-10-25 Ebm-Papst Mulfingen Gmbh & Co. Kg Anordnung zur Kontaktierung von Leistungshalbleitern an einer Kühlfläche
DE102006062711B4 (de) * 2006-06-09 2008-10-09 Fpe Fischer Gmbh Verfahren zur Überwachung und zum Schutz von einzelnen Solar-Panels vor Überhitzung
US7720334B1 (en) 2006-07-07 2010-05-18 Mossberg Thomas W Laterally-confined holographic spectral filters
JP4034330B1 (ja) * 2006-09-20 2008-01-16 タイコエレクトロニクスアンプ株式会社 回路ユニット収容ボックス
JP4278680B2 (ja) 2006-12-27 2009-06-17 三菱電機株式会社 電子制御装置
US8115305B2 (en) * 2007-05-17 2012-02-14 Stats Chippac Ltd. Integrated circuit package system with thin profile
TW200846881A (en) * 2007-05-18 2008-12-01 Acbel Polytech Inc Mounting device for chips and heat dissipating fins
WO2008144856A2 (en) * 2007-05-30 2008-12-04 Techinvest Ltda Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances
DE102007025957A1 (de) * 2007-06-04 2008-12-11 Robert Bosch Gmbh Verfahren und Vorrichtung zum Festlegen eines eine elektrische Schaltung oder dergleichen aufweisenden Flächensubstrats in einer Einbauposition
US7503790B2 (en) 2007-07-03 2009-03-17 Rockwell Automation Technologies, Inc. Industrial automation input output module with elastomeric sealing
US20090091889A1 (en) * 2007-10-09 2009-04-09 Oman Todd P Power electronic module having improved heat dissipation capability
US7773379B2 (en) * 2007-10-23 2010-08-10 Tyco Electronics Corporation Module assembly having heat transfer plate
EP2071911B1 (de) * 2007-12-11 2011-12-21 Denso Corporation Elektrische Steuervorrichtung und Herstellungsverfahren dafür
DE102008054384A1 (de) * 2008-12-08 2010-06-10 Robert Bosch Gmbh Elektrische Schaltungsanordnung sowie Verfahren zum Herstellen einer elektrischen Schaltungsanordnung
JP5500718B2 (ja) * 2010-03-05 2014-05-21 株式会社ケーヒン 半導体装置
JP5077837B2 (ja) * 2010-03-19 2012-11-21 株式会社安川電機 電子機器
ITTO20100161U1 (it) * 2010-10-05 2012-04-06 Menber S Spa Interruttore generale per impianti elettrici di veicoli
KR101841520B1 (ko) 2010-12-07 2018-03-23 알리손 트랜스미션, 인크. 하이브리드 전기 자동차를 위한 에너지 저장 시스템
CN102760707B (zh) * 2011-04-29 2017-04-12 博世汽车部件(苏州)有限公司 电子控制单元组件以及包括所述电子控制单元组件的车辆
US8760872B2 (en) * 2011-09-28 2014-06-24 Texas Instruments Incorporated DC-DC converter vertically integrated with load inductor structured as heat sink
US8844953B2 (en) 2011-09-30 2014-09-30 Accelerated Systems Inc. Mechanical steering linkage for battery powered mower with zero turning radius
US8966870B2 (en) 2011-10-26 2015-03-03 Accelerated Systems Inc. Methods of controlling a lawn mower having electric drive and blade motors
DE102012218307A1 (de) * 2012-10-08 2014-04-10 Robert Bosch Gmbh Verfahren zur Herstellung eines Steuergerätes
JP6073637B2 (ja) * 2012-10-18 2017-02-01 株式会社小糸製作所 電子ユニット
CN103809708A (zh) * 2012-11-07 2014-05-21 辉达公司 平板电子设备及其辅助散热装置、以及两者的组件
US8911244B2 (en) 2012-12-13 2014-12-16 International Business Machines Corporation Receptacle with heat management for electronic and optical systems
CN203243595U (zh) * 2013-03-07 2013-10-16 杭州华三通信技术有限公司 一种pcb结构
CN103237412B (zh) * 2013-03-27 2016-03-23 苏州远创达科技有限公司 一种电子件安装结构及制作方法、电子件产品
WO2014200459A1 (en) * 2013-06-10 2014-12-18 Schneider Electric Solar Inverters Usa, Inc. An electronics system and method of forming same
KR101460898B1 (ko) * 2013-06-11 2014-11-14 현대오트론 주식회사 경사 구조물을 이용한 차량의 전자 제어 장치 및 그 제조 방법
US9305874B2 (en) 2014-04-13 2016-04-05 Infineon Technologies Ag Baseplate for an electronic module and method of manufacturing the same
JP5975062B2 (ja) * 2014-05-09 2016-08-23 株式会社オートネットワーク技術研究所 電気接続箱
CN203839574U (zh) * 2014-05-21 2014-09-17 泰科电子(上海)有限公司 连接器、连接器组件和设备
JP2017521821A (ja) 2014-05-30 2017-08-03 モレックス エルエルシー 端子ホルダを備える電気コネクタ
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
JP6401534B2 (ja) * 2014-07-29 2018-10-10 株式会社デンソーテン 制御装置
JP6366413B2 (ja) * 2014-08-06 2018-08-01 アルパイン株式会社 電子回路ユニット
JP6094548B2 (ja) * 2014-08-29 2017-03-15 株式会社デンソー 電子装置収容筐体
KR101575268B1 (ko) * 2014-09-30 2015-12-07 현대오트론 주식회사 고정 부재를 이용한 차량의 전자 제어 장치 및 그 제조 방법
KR101575265B1 (ko) * 2014-09-30 2015-12-07 현대오트론 주식회사 고정 부재를 이용한 차량의 전자 제어 장치 및 그 제조 방법
JP5901725B1 (ja) * 2014-10-17 2016-04-13 三菱電機株式会社 防水型制御ユニットとその組立方法
JP6520325B2 (ja) * 2015-04-06 2019-05-29 株式会社デンソー 電子制御装置
AT518126B1 (de) * 2015-12-01 2020-01-15 Melecs Ews Gmbh Elektronisches Gerät mit Kühlvorrichtung und ein zugehöriges Montageverfahren
FR3047865B1 (fr) * 2016-02-12 2021-03-05 Continental Automotive France Boitier de protection d'un calculateur et procede de fabrication d'un tel boitier
JP2017162854A (ja) * 2016-03-07 2017-09-14 富士通テン株式会社 電子制御装置
KR101836969B1 (ko) 2016-07-06 2018-03-09 현대오트론 주식회사 열전도 매체 충진 모듈을 구비한 전자 제어 장치 및 그 제조 방법
USD821446S1 (en) * 2016-08-31 2018-06-26 Sevcon Limited Electric motor controller
USD827575S1 (en) 2016-11-04 2018-09-04 Phoenix Contact Development and Manufacturing, Inc. Electrical enclosure
US9967993B1 (en) 2016-11-07 2018-05-08 Phoenix Contact Development and Manufacturing, Inc. Printed circuit board enclosure assembly
AT519371B1 (de) 2016-12-20 2018-06-15 Melecs Ews Gmbh Gehäuse für eine elektrische Maschine mit einer Kühlvorrichtung
CN108415525B (zh) * 2018-03-23 2019-12-31 温岭市志创网络科技有限公司 改良结构的计算机机壳
US11079659B2 (en) * 2018-05-16 2021-08-03 Arlo Technologies, Inc. Sliding cover with inclined-plane seal for weather sealed consumer electronics device
US11705786B1 (en) * 2018-07-23 2023-07-18 Hydro-Gear Limited Partnership Power and control assembly for an electric drive apparatus
US10687433B1 (en) 2019-06-12 2020-06-16 Phoenix Contact Development and Manufacturing, Inc. Electrical component enclosure assembly and method of use
US11624880B2 (en) * 2019-10-08 2023-04-11 Infinera Corporation Communication module engagement
US11529636B2 (en) 2020-10-09 2022-12-20 Cláudio Henrique Teixeira Ribeiro Magnetic matrices and methods of using the same

Family Cites Families (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3542381A (en) * 1966-10-24 1970-11-24 Varian Associates Sealed joint formed with aromatic polyimide
DE1755665B1 (de) * 1968-06-06 1971-07-08 Daimler Benz Ag Dichtleiste an Tueren von Kraftwagen
US3818419A (en) 1973-01-15 1974-06-18 Deutsch Co Elec Comp Zero insertion force electrical connector
DE2530157A1 (de) 1975-07-05 1977-02-03 Bosch Gmbh Robert Elektronisches steuergeraet
US4296905A (en) * 1977-09-23 1981-10-27 Powell Charles R Building scaffold support
US4298905A (en) 1980-02-19 1981-11-03 The United States Of America As Represented By The Secretary Of The Navy Cooling apparatus for electronic modules
US4442450A (en) 1981-03-30 1984-04-10 International Business Machines Corporation Cooling element for solder bonded semiconductor devices
ATE39788T1 (de) 1982-09-09 1989-01-15 Siemens Ag Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen.
US4546407A (en) 1983-10-31 1985-10-08 Salvatore Benenati Heat exchanging electronic module housing
US4557225A (en) * 1984-01-18 1985-12-10 Mikuni Kogyo Kabushiki Kaisha Combined housing and heat sink for electronic engine control system components
DE3440334A1 (de) 1984-11-05 1986-05-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum befestigen eines halbleiterbauelementes an einem kuehlkoerper
FR2578710B1 (fr) * 1985-03-07 1988-03-04 Bendix Electronics Sa Agrafe multiple de fixation et dispositif de montage collectif de composants electroniques de puissance
US4707726A (en) 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US4853828A (en) 1985-08-22 1989-08-01 Dart Controls, Inc. Solid state device package mounting apparatus
EP0216090A1 (de) * 1985-08-30 1987-04-01 Siemens Aktiengesellschaft Gehäuse für ein im Betrieb Verlustwärme abgebendes Schaltungsbauteil
EP0213426A1 (de) 1985-08-30 1987-03-11 Siemens Aktiengesellschaft Gehäuse mit Bodenwanne und Aussendeckel für ein elektrisches Schaltungsbauteil
JPS62252157A (ja) 1986-04-24 1987-11-02 Elco- Kk 半導体装置
US5060113A (en) * 1987-04-09 1991-10-22 Raychem Corporation Connector assembly
US4923179A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Spring panel heat sink for electrical components
US4785379A (en) 1987-12-04 1988-11-15 Gte Government Systems Corporation Printed circuit module retainer
US4853829A (en) 1988-11-09 1989-08-01 Eaton Corporation Electronic module locking mechanism
US4972294A (en) 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
DE3918056C1 (de) 1989-06-02 1990-10-25 Kabelwerke Reinshagen Gmbh, 5600 Wuppertal, De
US4994937A (en) 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
DE4002060A1 (de) 1990-01-25 1991-08-01 Bosch Gmbh Robert Halterung fuer zu kuehlende elektronische bauelemente
US5060112A (en) 1990-04-02 1991-10-22 Cocconi Alan G Electrical component assembly with heat sink
DE4012182A1 (de) 1990-04-14 1991-10-17 Bosch Gmbh Robert Elektrisches schalt- und steuergeraet, insbesondere fuer kraftfahrzeuge
US5031028A (en) 1990-04-30 1991-07-09 Motorola, Inc. Heat sink assembly
DE9007236U1 (de) 1990-06-29 1991-10-31 Robert Bosch Gmbh, 70469 Stuttgart Gehäuse für eine elektronische Schaltung
US5406483A (en) 1991-05-15 1995-04-11 Phoenix International Corporation Engine variable transmission control system
US5305215A (en) 1991-05-15 1994-04-19 Phoenix International Corporation Expandable, mobile, modular microcomputer system for an off-road vehicle
ES2095486T5 (es) 1991-09-21 2010-07-09 Robert Bosch Gmbh Aparato electrico, en especial aparato de conmutacion y control para vehiculos de motor.
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
US5225965A (en) 1992-04-24 1993-07-06 Chrysler Corporation Heat sink load spring assembly
EP0608418B1 (de) * 1992-05-20 1998-11-04 Seiko Epson Corporation Kassette für eine elektronische vorrichtung
US5305185A (en) * 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
DE4242944C2 (de) 1992-12-18 2002-04-25 Bosch Gmbh Robert Elektrisches Steuergerät
DE4344629A1 (de) 1993-01-13 1994-07-14 Volkswagen Ag Elektrische Baueinheit mit einem Gehäuse und einer zu kühlenden Leiterplatte
US5402313A (en) * 1993-05-21 1995-03-28 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
US5309979A (en) 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
DE4342978A1 (de) 1993-12-16 1995-06-22 Bosch Gmbh Robert Steuergerät
US5454767A (en) 1993-12-30 1995-10-03 Agco Corporation Powershift transmission control system with turbo boost monitor
US5778329A (en) 1993-12-30 1998-07-07 Agco Corporation Powershift transmission system with torque-mapped shifts
US5450284A (en) * 1994-02-17 1995-09-12 Spacelabs Medical, Inc. Heat sink and transistor retaining assembly
US5461541A (en) * 1994-02-22 1995-10-24 Dana Corporation Enclosure for an electronic circuit module
DE4422113C2 (de) * 1994-06-24 2003-07-31 Wabco Gmbh & Co Ohg Elektronikmodul
US5511990A (en) * 1994-11-14 1996-04-30 General Motors Corporation Electrical interface connector assembly
US5550324A (en) * 1995-02-23 1996-08-27 Fluke Corporation Environmental sealing system for electronic instruments
DE19543260C2 (de) 1995-11-20 2001-09-20 Robert Seuffer Gmbh & Co Elektrische Bauelementeanordnung mit mehreren in einem Gehäuse angeordneten elektrischen Bauelementen
DE19600619A1 (de) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
US5742478A (en) * 1996-09-25 1998-04-21 Wu; Chih-Hsien Radiating structure of a power converter
ES2150728T3 (es) * 1996-11-21 2000-12-01 Rxs Schrumpftech Garnituren Manguito para cable.
JP2885736B2 (ja) 1996-11-22 1999-04-26 宮城日本電気株式会社 電子装置の冷却構造
JP3416450B2 (ja) * 1997-03-21 2003-06-16 三菱電機株式会社 パワートランジスタモジュールの実装構造
US5812376A (en) * 1997-04-21 1998-09-22 Chrysler Corporation Mounting assembly for electrical components and heat sinks
US5857054A (en) 1997-04-22 1999-01-05 Phoenix International Corporation Apparatus and method for removably positioning optical fiber to circuit board component in enclosure
DE19734110C1 (de) 1997-08-07 1998-11-19 Bosch Gmbh Robert Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
DE19803358C2 (de) 1998-01-29 2000-02-24 Telefunken Microelectron Gehäuse zur Aufnahme von Bauelementen
US6191943B1 (en) 1998-11-12 2001-02-20 Compaq Computer Corporation Docking station with thermoelectric heat dissipation system for docked portable computer
BR9907717A (pt) * 1998-11-18 2001-10-02 Rxs Schrumpftech Garnituren Luva de cabo consistindo de um corpo de cobertura e pelo menos um corpo de selagem de frente única
DE19855389C2 (de) 1998-12-01 2002-10-31 Siemens Ag Elektronische Vorrichtung
US6055158A (en) 1999-03-16 2000-04-25 Framatome Connectors Interlock, Inc. Electronic component heat sink assembly
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge
US6324057B1 (en) * 1999-12-07 2001-11-27 Rockwell Automation Technologies, Inc. Terminal block supported printed circuit cards for compact programmable logic controller
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
JP4366863B2 (ja) 2000-02-02 2009-11-18 株式会社デンソー 電子制御装置
JP4060510B2 (ja) * 2000-03-02 2008-03-12 カルソニックカンセイ株式会社 パワー素子の放熱部材への取付構造
JP2001267000A (ja) * 2000-03-21 2001-09-28 Sumitomo Wiring Syst Ltd 防水コネクタ
JP4218184B2 (ja) * 2000-05-19 2009-02-04 株式会社デンソー 半導体装置の実装構造
US6515858B2 (en) 2000-06-06 2003-02-04 Unipower Corporation Thermal distribution system
JP2002058134A (ja) * 2000-08-09 2002-02-22 Auto Network Gijutsu Kenkyusho:Kk 電子制御ユニットの搭載構造
US6527422B1 (en) 2000-08-17 2003-03-04 Power Signal Technologies, Inc. Solid state light with solar shielded heatsink
US6411514B1 (en) * 2001-03-08 2002-06-25 Rally Manufacturing, Inc. Power inverter with heat dissipating assembly
JP2002327724A (ja) 2001-04-27 2002-11-15 Omron Corp 締結構造
US6583986B1 (en) 2001-05-21 2003-06-24 General Instrument Corp. Method and apparatus for managing thermal energy emissions
DE20112594U1 (de) * 2001-07-31 2002-01-17 Trw Automotive Electron & Comp Elektronisches Steuergerät in Fahrzeugen
US6578984B2 (en) * 2001-09-26 2003-06-17 Lite-On Electronics, Inc. Circuit board indicator
DE10151413B4 (de) 2001-10-18 2005-05-19 Siemens Ag Dichtung zum Abdichten eines Spaltes zwischen zwei abzudichtenden Gehäuseteilen, sowie ein Gehäuse eines Steuergerätes eines Kraftfahrzeugs
JP3958589B2 (ja) * 2002-01-23 2007-08-15 株式会社オートネットワーク技術研究所 電気接続箱
US6881077B2 (en) * 2002-07-22 2005-04-19 Siemens Vdo Automotive Corporation Automotive control module housing
JP2004172224A (ja) * 2002-11-18 2004-06-17 Advics:Kk 電子制御装置における電子部品の放熱構造
US6678159B1 (en) 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
US7175313B2 (en) * 2004-03-08 2007-02-13 Hubbell Incorporated Locking assembly for ballast housing
JP2006108791A (ja) * 2004-09-30 2006-04-20 Toshiba Corp 電子機器
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure

Also Published As

Publication number Publication date
EP2582219A2 (de) 2013-04-17
EP2367413A1 (de) 2011-09-21
MX2007003261A (es) 2007-05-24
ES2409708T3 (es) 2013-06-27
CA2579426A1 (en) 2006-04-27
US20070153484A1 (en) 2007-07-05
US7190589B2 (en) 2007-03-13
ES2379570T3 (es) 2012-04-27
EP1810556B1 (de) 2011-12-21
US20070153485A1 (en) 2007-07-05
US20070147004A1 (en) 2007-06-28
EP2367413B1 (de) 2013-03-06
EP1810556A1 (de) 2007-07-25
US7369413B2 (en) 2008-05-06
PL2367413T3 (pl) 2013-07-31
US20060082975A1 (en) 2006-04-20
US7542294B2 (en) 2009-06-02
EP2582220A2 (de) 2013-04-17
WO2006043980A1 (en) 2006-04-27

Similar Documents

Publication Publication Date Title
ATE538631T1 (de) Gehäuse mit elektronischer steuerung
DE602008003166D1 (de) Abschirmungs- und wärmeableitungsvorrichtung
TW200419752A (en) Semiconductor package with heat sink
RU2009109007A (ru) Электрические силовые инструменты
WO2006133429A3 (en) High performance cooling assembly for electronics
TW200635144A (en) Electrical power connector
ATE539481T1 (de) Wechselrichter mit einem gehäuse mit kühlkörper aufweisenden elektrischen und/oder elektronischen komponenten
TWI268526B (en) Plasma display
ATE464656T1 (de) Halbleiterstruktur mit einem oder mehreren durchgangslöchern
WO2006080971A3 (en) Integral molded heat sinks on dc-dc converters and power supplies
WO2008060509A3 (en) Junction box for solar cells with bypass diodes and heat sink
AU2003250103A1 (en) Electronics housing with integrated thermal dissipater
DE602006014387D1 (de) Batteriebetriebene geräte
TWI267173B (en) Circuit device and method for manufacturing thereof
MY194783A (en) Protective circuit module case of battery and electronic device including the same
WO2010117570A3 (en) Thermal-electrical assembly for a portable communication device
EP1445799A3 (de) Kühleinrichtung für Halbleiter auf Leiterplatte
WO2008021219A3 (en) Semiconductor device having improved heat dissipation capabilities
JP2006286757A (ja) 電子機器の放熱構造
WO2008048462A3 (en) Integrated thermal management of a fuel cell and a fuel cell powered device
PL1856956T3 (pl) Urządzenie i sposób odprowadzania ciepła z urządzeń sterujących
CN2678236Y (zh) 电源装置
ATE445910T1 (de) Leistungshalbleitermodul mit wannenförmigem grundkörper
WO2008021220A3 (en) Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
ATE322743T1 (de) Elektronikmodul