PL1856956T3 - Urządzenie i sposób odprowadzania ciepła z urządzeń sterujących - Google Patents

Urządzenie i sposób odprowadzania ciepła z urządzeń sterujących

Info

Publication number
PL1856956T3
PL1856956T3 PL06733731T PL06733731T PL1856956T3 PL 1856956 T3 PL1856956 T3 PL 1856956T3 PL 06733731 T PL06733731 T PL 06733731T PL 06733731 T PL06733731 T PL 06733731T PL 1856956 T3 PL1856956 T3 PL 1856956T3
Authority
PL
Poland
Prior art keywords
control devices
transferring heat
heat
enclosure
housing
Prior art date
Application number
PL06733731T
Other languages
English (en)
Inventor
Sherman Thomas
Owen Wells
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of PL1856956T3 publication Critical patent/PL1856956T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
PL06733731T 2005-01-19 2006-01-17 Urządzenie i sposób odprowadzania ciepła z urządzeń sterujących PL1856956T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/905,749 US7130196B2 (en) 2005-01-19 2005-01-19 Apparatus and method for transferring heat from control devices
PCT/US2006/001636 WO2006078665A2 (en) 2005-01-19 2006-01-17 Apparatus and method for transferring heat from control devices
EP06733731A EP1856956B1 (en) 2005-01-19 2006-01-17 Apparatus and method for transferring heat from control devices

Publications (1)

Publication Number Publication Date
PL1856956T3 true PL1856956T3 (pl) 2011-10-31

Family

ID=36683653

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06733731T PL1856956T3 (pl) 2005-01-19 2006-01-17 Urządzenie i sposób odprowadzania ciepła z urządzeń sterujących

Country Status (7)

Country Link
US (1) US7130196B2 (pl)
EP (1) EP1856956B1 (pl)
CN (1) CN101142867B (pl)
AT (1) ATE509513T1 (pl)
ES (1) ES2363536T3 (pl)
PL (1) PL1856956T3 (pl)
WO (1) WO2006078665A2 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
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US8459053B2 (en) 2007-10-08 2013-06-11 Emerson Climate Technologies, Inc. Variable speed compressor protection system and method
JP2014063930A (ja) * 2012-09-21 2014-04-10 Hitachi Automotive Systems Ltd 電子制御装置
WO2015041682A1 (en) * 2013-09-20 2015-03-26 Ge Intelligent Platforms, Inc. Variable heat conductor
US11206743B2 (en) 2019-07-25 2021-12-21 Emerson Climate Technolgies, Inc. Electronics enclosure with heat-transfer element
US11229146B2 (en) * 2020-04-27 2022-01-18 Illinois Tool Works Inc. Welding-type power supplies with expandable thermal interfaces

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Also Published As

Publication number Publication date
US20060158852A1 (en) 2006-07-20
EP1856956A2 (en) 2007-11-21
CN101142867B (zh) 2011-11-09
WO2006078665A2 (en) 2006-07-27
US7130196B2 (en) 2006-10-31
ES2363536T3 (es) 2011-08-08
EP1856956B1 (en) 2011-05-11
ATE509513T1 (de) 2011-05-15
CN101142867A (zh) 2008-03-12
WO2006078665A3 (en) 2007-01-04

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