WO2008033297A3 - Heat transfer plate with retainer assembly - Google Patents

Heat transfer plate with retainer assembly Download PDF

Info

Publication number
WO2008033297A3
WO2008033297A3 PCT/US2007/019648 US2007019648W WO2008033297A3 WO 2008033297 A3 WO2008033297 A3 WO 2008033297A3 US 2007019648 W US2007019648 W US 2007019648W WO 2008033297 A3 WO2008033297 A3 WO 2008033297A3
Authority
WO
WIPO (PCT)
Prior art keywords
plate
heat transfer
retainer assembly
transfer plate
direct
Prior art date
Application number
PCT/US2007/019648
Other languages
French (fr)
Other versions
WO2008033297A2 (en
Inventor
Chang Sob Lee
Original Assignee
Cts Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cts Corp filed Critical Cts Corp
Publication of WO2008033297A2 publication Critical patent/WO2008033297A2/en
Publication of WO2008033297A3 publication Critical patent/WO2008033297A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Abstract

A heat transfer plate adapted for direct contact with heat-generating electronic devices on a circuit board and including a pair of retainer assemblies (40) adapted to releasably retain the plate (20) within an electronic enclosure structuren (92) in a relationship wherein the edges of the plate are positioned in a direct, compressive, surface-to-surface relationship with the cold wall (90) of the electronic enclosure structure to allow the direct transfer, via conduction, of the heat generated by the electronic devices on the circuit board from the edges of the plate into the cold wall. The retainer assembly comprises, among other elements, a rotatable rod (50) with a head defining an interior cavity adapted to receive the head of a standard tool for rotating the rod.
PCT/US2007/019648 2006-09-12 2007-09-10 Heat transfer plate with retainer assembly WO2008033297A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84398106P 2006-09-12 2006-09-12
US60/843,981 2006-09-12

Publications (2)

Publication Number Publication Date
WO2008033297A2 WO2008033297A2 (en) 2008-03-20
WO2008033297A3 true WO2008033297A3 (en) 2008-05-08

Family

ID=39031075

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/019648 WO2008033297A2 (en) 2006-09-12 2007-09-10 Heat transfer plate with retainer assembly

Country Status (1)

Country Link
WO (1) WO2008033297A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7796384B2 (en) * 2008-08-27 2010-09-14 Honeywell International Inc. Hybrid chassis cooling system
US8023267B2 (en) 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8222541B2 (en) 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US8059409B2 (en) 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3982807A (en) * 1975-03-27 1976-09-28 International Telephone And Telegraph Corporation Zero force printed circuit board connector
GB2128417A (en) * 1982-10-18 1984-04-26 Int Electronic Res Corp Low insertion force retainer for printed circuit boards
US5200882A (en) * 1992-01-17 1993-04-06 International Electronic Research Corporation Circuit board retainer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3982807A (en) * 1975-03-27 1976-09-28 International Telephone And Telegraph Corporation Zero force printed circuit board connector
GB2128417A (en) * 1982-10-18 1984-04-26 Int Electronic Res Corp Low insertion force retainer for printed circuit boards
US5200882A (en) * 1992-01-17 1993-04-06 International Electronic Research Corporation Circuit board retainer

Also Published As

Publication number Publication date
WO2008033297A2 (en) 2008-03-20

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