TW200640348A - Electronic device - Google Patents

Electronic device

Info

Publication number
TW200640348A
TW200640348A TW094114876A TW94114876A TW200640348A TW 200640348 A TW200640348 A TW 200640348A TW 094114876 A TW094114876 A TW 094114876A TW 94114876 A TW94114876 A TW 94114876A TW 200640348 A TW200640348 A TW 200640348A
Authority
TW
Taiwan
Prior art keywords
conduction
processor
substrate
electronic device
contacts
Prior art date
Application number
TW094114876A
Other languages
Chinese (zh)
Other versions
TWI271142B (en
Inventor
Chung-Ping Chuang
Ming-Hsueh Tsai
Cheng-Chieh Chuang
Original Assignee
Benq Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Benq Corp filed Critical Benq Corp
Priority to TW094114876A priority Critical patent/TWI271142B/en
Priority to US11/398,315 priority patent/US20060249280A1/en
Publication of TW200640348A publication Critical patent/TW200640348A/en
Application granted granted Critical
Publication of TWI271142B publication Critical patent/TWI271142B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electronic device includes a substrate, a processor, and a cooling device. The processor is disposed on the substrate. The cooling device includes a conduction medium, a conduction plate and a protrusion. The conduction medium contacts the processor. The conducting plate contacts the conduction medium. The protrusion is disposed on the conduction plate and contacts the substrate. Thus, the processor, the conduction medium, and the conduction plate tightly contact with each other.
TW094114876A 2005-05-09 2005-05-09 Electronic device TWI271142B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094114876A TWI271142B (en) 2005-05-09 2005-05-09 Electronic device
US11/398,315 US20060249280A1 (en) 2005-05-09 2006-04-05 Electronic device with improved cooling mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094114876A TWI271142B (en) 2005-05-09 2005-05-09 Electronic device

Publications (2)

Publication Number Publication Date
TW200640348A true TW200640348A (en) 2006-11-16
TWI271142B TWI271142B (en) 2007-01-11

Family

ID=37393066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094114876A TWI271142B (en) 2005-05-09 2005-05-09 Electronic device

Country Status (2)

Country Link
US (1) US20060249280A1 (en)
TW (1) TWI271142B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477205B (en) * 2011-07-20 2015-03-11 Lite On Electronics Guangzhou Circuit board device and manufacturing method thereof and power supply having the circuit board device
TWI503656B (en) * 2012-09-07 2015-10-11 Inventec Corp Heat dissipating structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014201032A1 (en) * 2014-01-21 2015-07-23 Zf Friedrichshafen Ag Electric control unit, transmission with an electric control unit and method for producing an electrical control unit
US10319674B2 (en) * 2014-10-29 2019-06-11 Infineon Technologies Americas Corp. Packaged assembly for high density power applications

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477205B (en) * 2011-07-20 2015-03-11 Lite On Electronics Guangzhou Circuit board device and manufacturing method thereof and power supply having the circuit board device
TWI503656B (en) * 2012-09-07 2015-10-11 Inventec Corp Heat dissipating structure

Also Published As

Publication number Publication date
US20060249280A1 (en) 2006-11-09
TWI271142B (en) 2007-01-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees