TWI271142B - Electronic device - Google Patents

Abstract

An electronic device includes a substrate, a processor, and a cooling device. The processor is disposed on the substrate. The cooling device includes a conduction medium, a conduction plate and a protrusion. The conduction medium contacts the processor. The conducting plate contacts the conduction medium. The protrusion is disposed on the conduction plate and contacts the substrate. Thus, the processor, the conduction medium, and the conduction plate tightly contact with each other.

Description

1271142 IX. Description of the invention: [Technical field to which the invention pertains] The present invention is an electronic device, in particular, an electronic device for improving the heat dissipation effect [Prior Art] The development of the B-H electronic product, the computing power in the micro-processor is constantly The enhanced η ί power and the generated thermal energy also increase. However, consumption %^ ί ίί : to increase the portability of the product. Therefore, the volume of the electric 35 is also continuously reduced, which further increases the difficulty of heat dissipation. Lingbai technology will directly use the outer casing of the electronic product as a heat sink: _, ❿, and there will be a public student, which will make the heat dissipation and the parts have no way to completely close the joint 1:= The case of the tolerance of the two parts is illustrated with Figure 1β. In the figure, i, i L, 104, heat sink pad (10) and heat sink iG8. When the enthalpy 106 and the heat sink 108 are insufficient due to manufacturing tolerances or ii gates, the squeezing 106 and the heat sink 108 can be; the thin 3 ==g ' can also cause poor heat dissipation and even cause parts. damage. The existence of eternal existence and Figure 1B are not the case where the total thickness is too large. Due to single_component error, or

4API/0334TW 1271142 is the total tolerance of all components, so that if the height H is to be 104, the thermal pad 1〇6 and the heat sink 1〇8, there will be a distance “, the substrate (10) will be subjected to pressure, or even When the wire «曲 or zero has a plurality of wafers on the substrate, the base (4) of the problem piece will cause serious heat dissipation. The problem caused by the bending of the substrate is due to the substrate 1 () 2 Bending ^ Several wafers 104 on the substrate 102 can not get good contact. Therefore, in the trend of shrinking the volume of electronic products, it is necessary to solve the problem of heat dissipation caused by Cao Yu = Qu. Therefore, 27= The invention discloses an electronic device, the electronic device, and a heat dissipating device. The processor is disposed on the substrate, and the heat dissipating body is guided by the heat dissipation. :基基理:=接接;

The heat medium and the heat sink are in close contact. V In another embodiment, the projection has a height that is substantially the same as the projection. The electronic device further includes a "lock" to: pass through the substrate and scatter, and the heat dissipation is set to = the anti-cloth is placed in another embodiment, the protrusion includes - the side of the substrate To maintain a 'guide; quality record』

4API/0334TW 6 1271142 [Embodiment] α 12 shows an electronic device 200, a projector, and the like according to a first embodiment of the present invention. In the present embodiment, the electronic device includes a substrate 220, a processor 240, and a heat sink 260. In this case, the drawings are all schematic and not drawn to true scales, and the unnecessary features are omitted. However, those skilled in the art should: 'Electronics, set 200 to include other components to achieve their specific application power. Taking the embodiment as an example, the electronic device 200 may further include other components such as a power supply device, a light bulb, a fan, and the like. The processor 240 is disposed on the substrate 220. In this embodiment, the processor 240 is an integrated circuit chip, and the substrate 220 is a plastic circuit board. The heat sink 260 includes a heat conductive medium 262, a heat sink 264, and a protrusion 266. In this embodiment, the heat sink 260 is the outer casing of the electronic device 200. The heat sink 264 contacts the thermally conductive medium 262 and the thermally conductive medium 262 contacts the processor 240 such that the heat sink 264 and the processor 240 can be in intimate contact. The heat transfer medium 262 can be a conventional heat sink, a heat sink, or the like. As the heat sink 264, any conventional material having good thermal conductivity can be used. The protrusion 266 is disposed on the heat sink 264 and contacts the substrate 220 to bring the processor 240, the heat transfer medium 262, and the heat sink 264 into close contact. The projection 266 has a predetermined height to maintain the position of the substrate 220 substantially the south of the projection 266. Thus, the projection 266 provides a support point for the substrate 220 such that the processor 240, the thermally conductive medium 262, and the heat sink 264 can be generally held at a predetermined height to contact each other, avoiding heat dissipation problems caused by part tolerances. FIG. 3 shows an electronic device 300 in accordance with a second embodiment of the present invention. In the present embodiment, the electronic device 300 is an optical disk drive including a substrate 32A, a processor 340, a heat sink 360, and a locking device 380. Note that 4API/0334TW 7 1271142 = 'The diagrams here are all schematic diagrams and are not based on =: point' and omit unnecessary trees. "This artist knows that ΐ ΐ =, and 〇〇 contains other things. Taking the embodiment as an example, the electronic device _ may further include an optical reading (four), a stepping motor, a rotating shaft, and other components.

The processor 340 is disposed on the substrate 320. In this embodiment, the processor 340 is an integrated circuit chip, and the substrate is a plastic circuit board. The heat sink 362, the heat sink 364, and the protrusion 366 are included. In this embodiment, the heat sink 360 is the lower cover of the electronic device 300. Diffusion = 4 contacts the thermally conductive medium 362, and the thermally conductive medium 362 contacts the processor 340 such that the heat sink 364 and the processor 340 can be in intimate contact. The heat transfer medium 362 can use a conventional heat sink, a heat sink, or the like. For the fins 4, any conventional material having good thermal conductivity can be used. The protrusion 366 is disposed on the heat sink 364 and contacts the substrate 320 such that the processor 340, the heat transfer medium 362, and the heat sink 364 are in close contact. The protrusion 366 has a pre-turn-on degree, and the position of the substrate 320 is substantially equal to the protrusion 366. The locking device 380 is coupled to the projection 366 of the heat sink 360 through the substrate 320 to secure the heat sink 360 to the substrate 320 and is located adjacent one of the processors 340. The hunting device 380 can further fix the processor 340, the heat transfer medium 362 and the heat sink 364 to avoid heat dissipation caused by the plate bending phenomenon. In the present embodiment, the locking device 380 is a screw. 4 is an electronic bag set according to a third embodiment of the present invention. In the embodiment, the electronic device 400 is a CD player, including a base 42 (), processors 440 and 442, and heat dissipation. The device 460, and the locking split 48. The difference from the foregoing embodiment is that the substrate 420 of the embodiment has a plurality of processors 440 and 442. In this example, two processors are illustrated as examples. As will be appreciated by those skilled in the art, the present invention is more applicable to the 'Electric 4API/0334TW 8 1271142 sub-device having a larger number of processors. Further, similarities to the foregoing embodiments will not be described herein.

In the present embodiment, heat sink 460 includes thermally conductive media 462 and 464 in contact with processors 440 and 442, respectively, and heat sink 466 is in contact with thermally conductive media 464. The heat sink 460 further includes a protrusion 468 disposed on the heat sink 466 and contacting the substrate 420. The projection 468 has a predetermined height to maintain the position of the slab 420 substantially the same as the projection 468. The locking device 48 is threaded & the substrate 420 is engaged with the protrusion 468 of the heat sink 460 to fix the heat sink 460 to a center of the substrate 420. The processor 440, the heat transfer media 462 and 464, and the heat sink 466 can be further fixed by the locking device to avoid heat dissipation problems of the plurality of processors 440 and 442 on the substrate 420 caused by the plate bending phenomenon. In the present embodiment, the locking device 480 is a screw. Fig. 5 shows an electronic device 5 in accordance with a fourth embodiment of the present invention. In the present embodiment, the electronic device 500 is a CD player, including a base 52, processors 540 and 542, and a heat sink 560. In this example, two processors are shown in the series as an illustration. As will be appreciated by those skilled in the art, the present invention is more applicable to electronic devices having more than one processor. Further, the same as the foregoing embodiment will not be described again. In the present embodiment, the heat sink 560 includes heat transfer media 562 and 564 that are in contact with the treatment 540 and 542, respectively, and the heat sink 56β is in contact with the heat transfer medium π; The heat sink 560 preferably includes a protrusion 568 disposed opposite the second protrusion 570 on the heat sink 566 and having a recess 572 and a recess 574, respectively. The substrate 520 has a side 522 and a second side 524, and the recess and the second recess 574 respectively receive the side 522 and the second side of the substrate 520 to maintain the processors 54 and 542, and the heat conductivity is 64. The hot sheet 566 is in close contact.

4API/0334TW 1271142 It is to be noted here that the foregoing embodiments are intended to be illustrative and not limiting. For example, the invention does not limit the number of processors, heat sinks, latching devices, and protrusions. Although the above embodiments are exemplified by one, =, those skilled in the art will recognize that the present invention can be implemented in a number to describe the present invention, but the technology of the present invention can still be used. Chemical. Therefore, the present invention is not limited to the above specific wells

The scope of the patent application is intended to cover all such modifications and variations that are truly in accordance with the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B show a part error problem of the prior art; FIG. 1C shows a substrate bending problem of the prior art; FIG. 2 shows an electron according to a first embodiment of the present invention. Figure 3 is an electronic device in accordance with a second embodiment of the present invention; - Electronic money in accordance with a third embodiment of the present invention; Figure 5 is an electronic device in accordance with a fourth embodiment of the present invention. [Main component symbol description] 104 wafer 108 heat sink 220 substrate 260 heat sink 264 heat sink 300 electronic device 340 processor 362 heat transfer medium 366 protrusion 102 substrate 1 散热 6 heat sink 200 electronic device 240 processor 262 heat sink medium 266 protrusion 320 substrate 360 heat sink 364 heat sink

4API/0334TW 10 1271142 380 locking device 420 substrate 442 processor 462 heat transfer medium 466 heat sink 480 locking device 520 substrate 524 second side 542 processor 562 heat transfer medium 566 heat sink 570 second protrusion 574 second groove 400 electronic Device 440 processor 460 heat sink 464 heat transfer medium 468 protrusion 500 electronic device 522 side 540 processor 560 heat sink 564 heat transfer medium 568 protrusion 572 groove

4API/0334TW 11

Claims (1)

Γ271142 . ^ :r^ J:t\ X. Patent application scope: 1. An electronic device comprising: · a substrate; a processor disposed on the substrate; and a heat sink, 阙 理 H, the filament The system comprises: a heat-conducting medium contacting the processor; a heat sink contacting the heat-conducting medium; and a portion disposed on the heat sink and contacting the substrate; the protrusion is disposed on the heat sink and the protrusion In contrast, the flutes 1 and 2 f: the ejecting portions each include a first recess and a second recess, and the side concave cores 3 are: not to accommodate the first side and the first side of the substrate The heat treatment medium and the heat sink are in close contact with each other. 2. The electronic device of claim 2, wherein the substrate is substantially preamplified and the substrate is substantially equal to the protrusion. , the male class 3, as claimed in the second paragraph of the patent application, the substrate and the heat sink of the heat sink, the electronic device described in the third item of the patent, wherein the locking device is 3 _ 抒 抒The device is connected to the electronic device as described in claim 3, and the adjacent device is in the vicinity of the processor. %Sub-clothing is in violation of the large department and is deleted; Na π-% is revised in August; replacement page 12 Ϊ271142 :’ 7. The electronic device of claim 1, wherein the electronic device is a CD player. 8. The electronic device of claim 1, wherein the electronic device is a projector. 9. The electronic device of claim 1, wherein the heat transfer medium is a heat sink or a heat sink. 4API/0334TW; A03526_95 August 11 correction; replacement page