ATE532099T1 - Verfahren und vorrichtung zur übertragung eines musters von einem stempel auf ein substrat - Google Patents
Verfahren und vorrichtung zur übertragung eines musters von einem stempel auf ein substratInfo
- Publication number
- ATE532099T1 ATE532099T1 AT03727761T AT03727761T ATE532099T1 AT E532099 T1 ATE532099 T1 AT E532099T1 AT 03727761 T AT03727761 T AT 03727761T AT 03727761 T AT03727761 T AT 03727761T AT E532099 T1 ATE532099 T1 AT E532099T1
- Authority
- AT
- Austria
- Prior art keywords
- pattern
- receiving surface
- stamp
- transferring
- substrate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C17/00—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces
- B05C17/06—Stencils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
- B05C1/027—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Printing Methods (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Decoration By Transfer Pictures (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02077079 | 2002-05-27 | ||
EP02077087 | 2002-05-27 | ||
PCT/IB2003/002003 WO2003099463A2 (en) | 2002-05-27 | 2003-05-26 | Method and device for transferring a pattern from a stamp to a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE532099T1 true ATE532099T1 (de) | 2011-11-15 |
Family
ID=29585707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03727761T ATE532099T1 (de) | 2002-05-27 | 2003-05-26 | Verfahren und vorrichtung zur übertragung eines musters von einem stempel auf ein substrat |
Country Status (8)
Country | Link |
---|---|
US (1) | US7296519B2 (de) |
EP (1) | EP1511632B1 (de) |
JP (1) | JP4639081B2 (de) |
KR (1) | KR100981692B1 (de) |
CN (1) | CN100358728C (de) |
AT (1) | ATE532099T1 (de) |
AU (1) | AU2003232962A1 (de) |
WO (1) | WO2003099463A2 (de) |
Families Citing this family (76)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4340086B2 (ja) * | 2003-03-20 | 2009-10-07 | 株式会社日立製作所 | ナノプリント用スタンパ、及び微細構造転写方法 |
WO2004086471A1 (en) * | 2003-03-27 | 2004-10-07 | Korea Institute Of Machinery & Materials | Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization |
DE10330456B9 (de) * | 2003-07-05 | 2007-11-08 | Erich Thallner | Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer |
US7632087B2 (en) * | 2003-12-19 | 2009-12-15 | Wd Media, Inc. | Composite stamper for imprint lithography |
CN102004393B (zh) * | 2004-04-27 | 2013-05-01 | 伊利诺伊大学评议会 | 用于软光刻法的复合构图设备 |
WO2005109535A2 (en) * | 2004-05-06 | 2005-11-17 | Koninklijke Philips Electronics N.V. | A method of manufacturing a thermoelectric device |
EP1763704A2 (de) * | 2004-06-30 | 2007-03-21 | Koninklijke Philips Electronics N.V. | Weicher lithographischer stempel mit einer chemisch strukturierten oberfläche |
US20070164476A1 (en) * | 2004-09-01 | 2007-07-19 | Wei Wu | Contact lithography apparatus and method employing substrate deformation |
CN101043953A (zh) | 2004-10-22 | 2007-09-26 | 皇家飞利浦电子股份有限公司 | 带有压力控制的辊子微接触印刷机 |
JP2008523585A (ja) | 2004-12-06 | 2008-07-03 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | エッチング溶液及びその添加剤 |
DE602004014002D1 (de) * | 2004-12-10 | 2008-07-03 | Essilor Int | Stempel zum Auftragen eines Motivs, Verfahren zur Stempelherstellung und Verfahren zur Herstellung eines Objekts anhand von diesem Stempel |
US7331283B2 (en) | 2004-12-16 | 2008-02-19 | Asml Holding N.V. | Method and apparatus for imprint pattern replication |
US7410591B2 (en) | 2004-12-16 | 2008-08-12 | Asml Holding N.V. | Method and system for making a nano-plate for imprint lithography |
US7399422B2 (en) | 2005-11-29 | 2008-07-15 | Asml Holding N.V. | System and method for forming nanodisks used in imprint lithography and nanodisk and memory disk formed thereby |
US7409759B2 (en) | 2004-12-16 | 2008-08-12 | Asml Holding N.V. | Method for making a computer hard drive platen using a nano-plate |
US7363854B2 (en) | 2004-12-16 | 2008-04-29 | Asml Holding N.V. | System and method for patterning both sides of a substrate utilizing imprint lithography |
US7676088B2 (en) | 2004-12-23 | 2010-03-09 | Asml Netherlands B.V. | Imprint lithography |
EP1843884A4 (de) * | 2005-01-31 | 2008-12-17 | Molecular Imprints Inc | Aufspannsystem für die nanoherstellung |
US7636999B2 (en) * | 2005-01-31 | 2009-12-29 | Molecular Imprints, Inc. | Method of retaining a substrate to a wafer chuck |
KR101256383B1 (ko) | 2005-05-03 | 2013-04-25 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 스탬프로부터 기판으로 패턴을 전사하기 위한 방법 및디바이스 |
JP4596981B2 (ja) * | 2005-05-24 | 2010-12-15 | 株式会社日立ハイテクノロジーズ | インプリント装置、及び微細構造転写方法 |
JP4685161B2 (ja) * | 2005-06-13 | 2011-05-18 | コリア・インスティテュート・オブ・マシナリー・アンド・メタルズ | 均一圧でパターン形成可能なインプリント装置 |
US20070178237A1 (en) * | 2005-08-02 | 2007-08-02 | Shin Dong M | Method for patterning coatings |
US20070035717A1 (en) * | 2005-08-12 | 2007-02-15 | Wei Wu | Contact lithography apparatus, system and method |
US20070048448A1 (en) * | 2005-08-17 | 2007-03-01 | Kim Dae H | Patterning method using coatings containing ionic components |
EP1764648B1 (de) | 2005-09-14 | 2012-05-23 | Thallner, Erich, Dipl.-Ing. | Stempel mit einer Nanostempelstruktur sowie Vorrichtung und Verfahren zu dessen Herstellung |
US7677877B2 (en) | 2005-11-04 | 2010-03-16 | Asml Netherlands B.V. | Imprint lithography |
JP2007134368A (ja) * | 2005-11-08 | 2007-05-31 | Nikon Corp | パターン転写装置、露光装置及びパターン転写方法 |
US7906058B2 (en) * | 2005-12-01 | 2011-03-15 | Molecular Imprints, Inc. | Bifurcated contact printing technique |
CN104317161A (zh) | 2005-12-08 | 2015-01-28 | 分子制模股份有限公司 | 用于衬底双面图案形成的方法和系统 |
US7707937B2 (en) * | 2005-12-15 | 2010-05-04 | Palo Alto Research Center Incorporated | Digital impression printing system |
US7517211B2 (en) | 2005-12-21 | 2009-04-14 | Asml Netherlands B.V. | Imprint lithography |
JP4814682B2 (ja) * | 2006-04-18 | 2011-11-16 | 株式会社日立ハイテクノロジーズ | 微細構造パターンの転写方法及び転写装置 |
JP4854383B2 (ja) * | 2006-05-15 | 2012-01-18 | アピックヤマダ株式会社 | インプリント方法およびナノ・インプリント装置 |
JP4996150B2 (ja) * | 2006-07-07 | 2012-08-08 | 株式会社日立ハイテクノロジーズ | 微細構造転写装置および微細構造転写方法 |
JP4449949B2 (ja) * | 2006-07-18 | 2010-04-14 | セイコーエプソン株式会社 | 表面エネルギー差バンクの形成方法、パターンの形成方法、バンク構造、電子回路、電子デバイス、電子機器、及びスタンプ |
US7946837B2 (en) * | 2006-10-06 | 2011-05-24 | Asml Netherlands B.V. | Imprint lithography |
US9440254B2 (en) | 2006-12-04 | 2016-09-13 | Koninklijke Philips N.V. | Method and apparatus for applying a sheet to a substrate |
WO2008087573A2 (en) * | 2007-01-16 | 2008-07-24 | Koninklijke Philips Electronics N.V. | Method and system for contacting of a flexible sheet and a substrate |
GB0701909D0 (en) * | 2007-01-31 | 2007-03-14 | Imp Innovations Ltd | Deposition Of Organic Layers |
US8343779B2 (en) * | 2007-04-19 | 2013-01-01 | Basf Se | Method for forming a pattern on a substrate and electronic device formed thereby |
US20080309900A1 (en) * | 2007-06-12 | 2008-12-18 | Micron Technology, Inc. | Method of making patterning device, patterning device for making patterned structure, and method of making patterned structure |
JP5041214B2 (ja) | 2007-06-15 | 2012-10-03 | ソニー株式会社 | 金属薄膜の形成方法および電子デバイスの製造方法 |
JP5045263B2 (ja) * | 2007-06-20 | 2012-10-10 | ソニー株式会社 | 印刷装置および印刷方法 |
NL1036034A1 (nl) | 2007-10-11 | 2009-04-15 | Asml Netherlands Bv | Imprint lithography. |
GB2453766A (en) * | 2007-10-18 | 2009-04-22 | Novalia Ltd | Method of fabricating an electronic device |
KR101618589B1 (ko) | 2008-06-06 | 2016-05-09 | 코닌클리케 필립스 엔.브이. | 연성 리소그래피용 실리콘 고무 재료 |
US7927976B2 (en) * | 2008-07-23 | 2011-04-19 | Semprius, Inc. | Reinforced composite stamp for dry transfer printing of semiconductor elements |
WO2010041198A1 (en) | 2008-10-10 | 2010-04-15 | Koninklijke Philips Electronics N.V. | Light directionality sensor |
JP5261845B2 (ja) * | 2008-10-28 | 2013-08-14 | 株式会社ブイ・テクノロジー | 欠陥修正方法 |
EP2351068B1 (de) * | 2008-11-19 | 2020-11-04 | X Display Company Technology Limited | Bedruckung von halbleiterelementen durch scherungsunterstützte übertragung von elastomeren stempeln |
JP2011005773A (ja) * | 2009-06-26 | 2011-01-13 | Fuji Electric Device Technology Co Ltd | インプリント用スタンパおよびインプリント装置 |
US8261660B2 (en) * | 2009-07-22 | 2012-09-11 | Semprius, Inc. | Vacuum coupled tool apparatus for dry transfer printing semiconductor elements |
CN102666103B (zh) | 2009-12-22 | 2016-04-06 | 3M创新有限公司 | 用于使用增压辊的微接触印刷的装置及方法 |
CN101807004B (zh) * | 2010-03-08 | 2012-07-11 | 彩虹集团电子股份有限公司 | 一种用于彩色显像管网版生产的工作版的制做方法 |
JP5618588B2 (ja) * | 2010-03-24 | 2014-11-05 | キヤノン株式会社 | インプリント方法 |
US9765934B2 (en) | 2011-05-16 | 2017-09-19 | The Board Of Trustees Of The University Of Illinois | Thermally managed LED arrays assembled by printing |
DE102011054789A1 (de) * | 2011-10-25 | 2013-04-25 | Universität Kassel | Nano-Formgebungsstruktur |
JP5759348B2 (ja) | 2011-11-30 | 2015-08-05 | 株式会社Screenホールディングス | パターン形成装置およびパターン形成方法 |
JP6086675B2 (ja) * | 2011-11-30 | 2017-03-01 | 株式会社Screenホールディングス | 印刷装置および印刷方法 |
JP5925505B2 (ja) * | 2012-02-03 | 2016-05-25 | セーレン株式会社 | 微細ドットパターンの印刷方法 |
CN103373094A (zh) * | 2012-04-11 | 2013-10-30 | 得利环球有限公司 | 微接触印刷设备及方法 |
CN102866582B (zh) * | 2012-09-29 | 2014-09-10 | 兰红波 | 一种用于高亮度led图形化的纳米压印装置和方法 |
JP6207997B2 (ja) * | 2013-01-30 | 2017-10-04 | 株式会社Screenホールディングス | パターン形成装置およびパターン形成方法 |
CN106462054B (zh) * | 2014-03-31 | 2020-07-07 | 皇家飞利浦有限公司 | 压印方法、用于压印方法的计算机程序产品和装置 |
WO2016045961A1 (en) * | 2014-09-22 | 2016-03-31 | Koninklijke Philips N.V. | Transfer method and apparatus and computer program product |
WO2016070869A2 (de) * | 2014-11-03 | 2016-05-12 | Universität Osnabrück | Vorrichtung zur durchführung eines kapillar-nanodruck-verfahrens, ein verfahren zur durchführung eines kapillar-nanodrucks unter verwendung der vorrichtung, produkte erhältlich nach dem verfahren sowie die verwendung der vorrichtung |
KR102331438B1 (ko) | 2016-04-06 | 2021-11-26 | 코닌클리케 필립스 엔.브이. | 임프린트 리소그래피 스탬프, 이의 제조 방법 및 사용 방법 |
EP3455676B1 (de) | 2016-07-14 | 2019-09-11 | Morphotonics Holding B.V. | Vorrichtung zum bedrucken diskreter substrate mit einem diskreten flexiblen stempel |
US11338477B2 (en) * | 2016-07-27 | 2022-05-24 | Koninklijke Philips N.V. | Polyorganosiloxane-based stamp manufacturing method, polyorganosiloxane-based stamp, use of the same for a printing process, and an imprinting method using the same |
CN107215111B (zh) * | 2017-06-14 | 2023-03-28 | 浙江大学 | 一种磁控转印印章及磁控转移印刷方法 |
KR20210087998A (ko) | 2018-11-14 | 2021-07-13 | 코닌클리케 필립스 엔.브이. | 공압 시스템, 임프린트 장치 및 그의 용도 |
WO2020234848A1 (en) * | 2019-05-22 | 2020-11-26 | Vuereal Inc. | Systems and methods for transferring devices or patterns to a substrate |
CN111430272B (zh) * | 2020-03-09 | 2023-02-03 | 广东工业大学 | 单类和多类微小物体悬浮定向移动及自主装巨量转移方法 |
EP4123376A1 (de) * | 2021-07-21 | 2023-01-25 | Koninklijke Philips N.V. | Prägevorrichtung |
EP4374219A1 (de) | 2021-07-21 | 2024-05-29 | Koninklijke Philips N.V. | Druckvorrichtung |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE94221C (de) * | ||||
US1527921A (en) * | 1923-05-22 | 1925-02-24 | Auto Mark Corp | Printing device |
DE1103357B (de) * | 1955-01-24 | 1961-03-30 | Konrad Elsaesser | Vorrichtung zum Bedrucken oder Bestempeln von Markenetiketten |
GB1005502A (en) * | 1963-04-17 | 1965-09-22 | Ellicock & Healy Ltd | Improvements in or relating to printing blocks for printing machines |
US5352651A (en) * | 1992-12-23 | 1994-10-04 | Minnesota Mining And Manufacturing Company | Nanostructured imaging transfer element |
US5900160A (en) * | 1993-10-04 | 1999-05-04 | President And Fellows Of Harvard College | Methods of etching articles via microcontact printing |
EP0784543B1 (de) * | 1995-08-04 | 2000-04-26 | International Business Machines Corporation | Lithografie oder dünnschicht modifizierung |
WO1997006012A1 (en) * | 1995-08-04 | 1997-02-20 | International Business Machines Corporation | Stamp for a lithographic process |
JPH09263028A (ja) * | 1996-01-25 | 1997-10-07 | Hiroyuki Koike | 回転式印字器及び回転式印字器に用いる帯状体の製造方法 |
US5669303A (en) | 1996-03-04 | 1997-09-23 | Motorola | Apparatus and method for stamping a surface |
US6129016A (en) * | 1998-04-03 | 2000-10-10 | Rehkemper; Steven | Stamping toy having indexing means |
US20020043170A1 (en) * | 2000-01-10 | 2002-04-18 | Rafael Bronstein | System and method for preparing and utilizing a printing member having magnetic particles therein |
WO2001059523A1 (en) * | 2000-02-07 | 2001-08-16 | Koninklijke Philips Electronics N.V. | Stamp for use in a lithographic process, method of manufacturing a stamp, and method of manufacturing a patterned layer on a substrate |
JP2002273996A (ja) * | 2001-03-21 | 2002-09-25 | Yamahachi Chemical Co Ltd | 複数の印面を有する液浸透式スタンプ |
AU2003217184A1 (en) * | 2002-01-11 | 2003-09-02 | Massachusetts Institute Of Technology | Microcontact printing |
US7037458B2 (en) * | 2003-10-23 | 2006-05-02 | Intel Corporation | Progressive stamping apparatus and method |
KR100585951B1 (ko) * | 2004-02-18 | 2006-06-01 | 한국기계연구원 | 조합/분리형 독립구동이 가능한 복수 개의 모듈을 갖는 임프린팅 장치 |
-
2003
- 2003-05-26 CN CNB038123967A patent/CN100358728C/zh not_active Expired - Lifetime
- 2003-05-26 WO PCT/IB2003/002003 patent/WO2003099463A2/en active Application Filing
- 2003-05-26 AU AU2003232962A patent/AU2003232962A1/en not_active Abandoned
- 2003-05-26 KR KR1020047019102A patent/KR100981692B1/ko active IP Right Grant
- 2003-05-26 AT AT03727761T patent/ATE532099T1/de active
- 2003-05-26 JP JP2004506978A patent/JP4639081B2/ja not_active Expired - Lifetime
- 2003-05-26 EP EP03727761A patent/EP1511632B1/de not_active Expired - Lifetime
- 2003-05-26 US US10/515,687 patent/US7296519B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20050173049A1 (en) | 2005-08-11 |
JP4639081B2 (ja) | 2011-02-23 |
EP1511632A2 (de) | 2005-03-09 |
CN1665684A (zh) | 2005-09-07 |
CN100358728C (zh) | 2008-01-02 |
AU2003232962A8 (en) | 2003-12-12 |
KR100981692B1 (ko) | 2010-09-13 |
WO2003099463A2 (en) | 2003-12-04 |
WO2003099463A3 (en) | 2004-09-16 |
AU2003232962A1 (en) | 2003-12-12 |
KR20050016441A (ko) | 2005-02-21 |
US7296519B2 (en) | 2007-11-20 |
JP2005527406A (ja) | 2005-09-15 |
EP1511632B1 (de) | 2011-11-02 |
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