DE3667498D1 - Verfahren zur metallbeschichtung eines organischen substrates. - Google Patents

Verfahren zur metallbeschichtung eines organischen substrates.

Info

Publication number
DE3667498D1
DE3667498D1 DE8686300070T DE3667498T DE3667498D1 DE 3667498 D1 DE3667498 D1 DE 3667498D1 DE 8686300070 T DE8686300070 T DE 8686300070T DE 3667498 T DE3667498 T DE 3667498T DE 3667498 D1 DE3667498 D1 DE 3667498D1
Authority
DE
Germany
Prior art keywords
metal coating
organic substrate
organic
substrate
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686300070T
Other languages
English (en)
Inventor
Paul Siu-Chung Ho
Peter Otto Hahn
Harry Lefakis
Gary Wayne Rubloff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3667498D1 publication Critical patent/DE3667498D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2063—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 mixed adhesion layer containing metallic/inorganic and polymeric materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8686300070T 1985-01-11 1986-01-07 Verfahren zur metallbeschichtung eines organischen substrates. Expired - Fee Related DE3667498D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69056785A 1985-01-11 1985-01-11

Publications (1)

Publication Number Publication Date
DE3667498D1 true DE3667498D1 (de) 1990-01-18

Family

ID=24772994

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686300070T Expired - Fee Related DE3667498D1 (de) 1985-01-11 1986-01-07 Verfahren zur metallbeschichtung eines organischen substrates.

Country Status (4)

Country Link
EP (1) EP0187706B1 (de)
JP (1) JP2605010B2 (de)
CA (1) CA1276088C (de)
DE (1) DE3667498D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0337445A3 (de) * 1988-04-13 1991-01-16 Hitachi, Ltd. Laminare Struktur bestehend aus einem organischen Material und aus einem anorganischen Material, Methoden zu ihrer Herstellung und ihrer Benutzung
US5104734A (en) * 1988-06-03 1992-04-14 International Business Machines Corporation Method for improving adhesion between a polyimide layer and a metal and the article obtained
IT1229221B (it) * 1989-03-31 1991-07-26 Tecnopart Srl Articoli formati di materiale polimerico aventi migliorata bagnabilita' e adesivita' e processo per la loro produzione.
US5178957A (en) * 1989-05-02 1993-01-12 Minnesota Mining And Manufacturing Company Noble metal-polymer composites and flexible thin-film conductors prepared therefrom
AU636339B2 (en) * 1989-05-02 1993-04-29 Minnesota Mining And Manufacturing Company Noble metal-polymer composites and flexible thin-film conductors prepared therefrom
US4975327A (en) * 1989-07-11 1990-12-04 Minnesota Mining And Manufacturing Company Polyimide substrate having a textured surface and metallizing such a substrate
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
DE4211956C1 (de) * 1992-04-09 1993-05-06 Multi-Arc Oberflaechentechnik Gmbh, 5060 Bergisch Gladbach, De
JPH08330728A (ja) * 1995-05-26 1996-12-13 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
SE508280C2 (sv) * 1997-01-31 1998-09-21 Cuptronic Ab Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial
US6303278B1 (en) 1997-01-31 2001-10-16 Cuptronic Ab Method of applying metal layers in distinct patterns
DE10026540A1 (de) * 2000-05-27 2001-11-29 Gfe Met & Mat Gmbh Gegenstand, insbesondere Implantat
JP4605454B2 (ja) * 2005-03-23 2011-01-05 住友金属鉱山株式会社 フレキシブル基板の製造方法
DK2004907T3 (da) * 2006-04-10 2009-10-19 Linea Tergi Ltd Fremgangsmåde til påföring af et metal på papir
US20090205853A1 (en) * 2006-04-10 2009-08-20 Linea Tergi Ltd. Method for applying a metal on a substrate
JP2016159606A (ja) * 2015-03-05 2016-09-05 住友電気工業株式会社 積層構造体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2812270A (en) * 1954-01-28 1957-11-05 Continental Can Co Method and apparatus for depositing metal coatings on metal bases
US2859130A (en) * 1954-06-16 1958-11-04 Ohio Commw Eng Co Method for gas plating synthetic fibers
US2897091A (en) * 1954-10-27 1959-07-28 Ohio Commw Eng Co Method of high speed gas plating of synthetic resins
GB1370893A (en) * 1971-02-09 1974-10-16 Ici Ltd Metallised thermoplastic films
DE2234510A1 (de) * 1972-07-13 1974-01-24 Siemens Ag Verfahren zum metallisieren einer zur herstellung von elektrischen kondensatoren dienenden isolierstoffolie
JPS538376A (en) * 1976-07-12 1978-01-25 Ulvac Corp Preparation of magnetic recording material by evaporation process with oblique incidence
FR2378815A1 (fr) * 1977-01-28 1978-08-25 Paris Haute Lunette Procede d'application d'un produit de traitement sur des objets en verre organique, tels que des verres de lunette
JPS53135840A (en) * 1977-04-30 1978-11-27 Sumitomo Electric Ind Ltd Metal coating method for non-electroconductive material
DE3136283C1 (de) * 1981-09-12 1983-02-03 Nukem Gmbh, 6450 Hanau Verfahren zum Metallisieren kohlefaserverstaerkter Kunststoffteile
DE3233087A1 (de) * 1982-09-07 1984-03-08 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum herstellen von duennen metallschichten mittels aufdampfens
US4466875A (en) * 1983-11-30 1984-08-21 Ppg Industries, Inc. Auxiliary heater for magnetron sputtering

Also Published As

Publication number Publication date
EP0187706A3 (en) 1987-09-02
JP2605010B2 (ja) 1997-04-30
EP0187706B1 (de) 1989-12-13
EP0187706A2 (de) 1986-07-16
JPS61164295A (ja) 1986-07-24
CA1276088C (en) 1990-11-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee