DE3681064D1 - Verfahren zur vorbehandlung eines substrats fuer die stromlose metallabscheidung. - Google Patents

Verfahren zur vorbehandlung eines substrats fuer die stromlose metallabscheidung.

Info

Publication number
DE3681064D1
DE3681064D1 DE8686105948T DE3681064T DE3681064D1 DE 3681064 D1 DE3681064 D1 DE 3681064D1 DE 8686105948 T DE8686105948 T DE 8686105948T DE 3681064 T DE3681064 T DE 3681064T DE 3681064 D1 DE3681064 D1 DE 3681064D1
Authority
DE
Germany
Prior art keywords
treating
substrate
metal deposition
electric metal
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686105948T
Other languages
English (en)
Inventor
William Joseph Amelio
David William Hume
Bride Donald Gene Mc
Robert George Rickert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24937329&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3681064(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3681064D1 publication Critical patent/DE3681064D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8686105948T 1985-05-06 1986-04-30 Verfahren zur vorbehandlung eines substrats fuer die stromlose metallabscheidung. Expired - Fee Related DE3681064D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/730,918 US4639380A (en) 1985-05-06 1985-05-06 Process for preparing a substrate for subsequent electroless deposition of a metal

Publications (1)

Publication Number Publication Date
DE3681064D1 true DE3681064D1 (de) 1991-10-02

Family

ID=24937329

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686105948T Expired - Fee Related DE3681064D1 (de) 1985-05-06 1986-04-30 Verfahren zur vorbehandlung eines substrats fuer die stromlose metallabscheidung.

Country Status (5)

Country Link
US (1) US4639380A (de)
EP (1) EP0201806B1 (de)
JP (1) JPS61256689A (de)
CA (1) CA1229266A (de)
DE (1) DE3681064D1 (de)

Families Citing this family (26)

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US4820643A (en) * 1986-03-10 1989-04-11 International Business Machines Corporation Process for determining the activity of a palladium-tin catalyst
KR900003157B1 (ko) * 1986-04-02 1990-05-09 가부시끼가이샤 히다찌세이샤꾸쇼 스루호울 도금의 전처리 방법
US4781788A (en) * 1986-12-29 1988-11-01 Delco Electronics Corporation Process for preparing printed circuit boards
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US5183795A (en) * 1989-12-13 1993-02-02 Intel Corporation Fully planar metalization process
US5213841A (en) * 1990-05-15 1993-05-25 Shipley Company Inc. Metal accelerator
US5075039A (en) * 1990-05-31 1991-12-24 Shipley Company Inc. Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
EP0460548A3 (en) * 1990-06-08 1993-03-24 Amp-Akzo Corporation Printed circuits and base materials precatalyzed for etal deposition
JPH0760821B2 (ja) * 1991-05-17 1995-06-28 インターナショナル・ビジネス・マシーンズ・コーポレイション ポリマー基材の状態調整方法
US5316803A (en) * 1992-12-10 1994-05-31 International Business Machines Corporation Method for forming electrical interconnections in laminated vias
DE69434619T2 (de) * 1993-03-18 2006-08-17 Atotech Deutschland Gmbh Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd, sowie die entsprechende Zusammensetzung
US5380559A (en) * 1993-04-30 1995-01-10 At&T Corp. Electroless metallization of optical fiber for hermetic packaging
EP0747507B1 (de) 1994-12-27 2001-02-14 Ibiden Co., Ltd. Lösung zur vorbehandlung für elektronenloses beschichten, bad und verfahren
DE69709094T2 (de) * 1996-05-30 2002-07-18 Du Pont Prozess zur herstellung eines thermisch stabilen, metallbeschichteten polymeren monofilaments
US6045680A (en) * 1996-05-30 2000-04-04 E. I. Du Pont De Nemours And Company Process for making thermally stable metal coated polymeric monofilament or yarn
US6268016B1 (en) 1996-06-28 2001-07-31 International Business Machines Corporation Manufacturing computer systems with fine line circuitized substrates
JP3693441B2 (ja) * 1996-12-27 2005-09-07 富士通株式会社 記録媒体の製造方法
US6139762A (en) * 1998-12-11 2000-10-31 Shipley Company, L.L.C. Methods for manufacture of electronic devices
US6217667B1 (en) * 1999-09-24 2001-04-17 Semitool, Inc. Method for cleaning copper surfaces
US6824666B2 (en) * 2002-01-28 2004-11-30 Applied Materials, Inc. Electroless deposition method over sub-micron apertures
US7205228B2 (en) * 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US20060091742A1 (en) * 2004-11-02 2006-05-04 General Electric Company Electroless metallic plating method for leak repair and prevention in liquid-cooled generator stator bars
ES2326513B1 (es) * 2006-02-01 2010-07-23 Gabilondo Muguerza, Andres Procedimiento para metalizar polimeros de urea y otros polimeros.
WO2007088217A1 (es) * 2006-02-01 2007-08-09 Gabilondo Muguerza, Andres Procedimiento para metalizar polímeros de urea y otros polímeros

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US2996408A (en) * 1958-03-31 1961-08-15 Gen Electric Copper plating process and solution
US3075855A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solutions
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3515649A (en) * 1967-05-02 1970-06-02 Ivan C Hepfer Pre-plating conditioning process
US3563784A (en) * 1968-09-09 1971-02-16 Macdermid Inc Pre-activation treatment in the electroless plating of synthetic resin substrates
GB1243481A (en) * 1969-01-22 1971-08-18 Hoechst Ag Metallisation of plastics
US3632388A (en) * 1969-04-14 1972-01-04 Macdermid Inc Preactivation conditioner for electroless metal plating system
US3684572A (en) * 1970-07-13 1972-08-15 Du Pont Electroless nickel plating process for nonconductors
US3959523A (en) * 1973-12-14 1976-05-25 Macdermid Incorporated Additive printed circuit boards and method of manufacture
US3844799A (en) * 1973-12-17 1974-10-29 Ibm Electroless copper plating
JPS5125771A (en) * 1974-08-27 1976-03-02 Fujitsu Ltd Tasopurintobanno kagakusenjohoho
JPS5125770A (en) * 1974-08-27 1976-03-02 Fujitsu Ltd Tasopurintobanno kagakusenjohoho
US3982045A (en) * 1974-10-11 1976-09-21 Macdermid Incorporated Method of manufacture of additive printed circuitboards using permanent resist mask
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse
US4042730A (en) * 1976-03-29 1977-08-16 Bell Telephone Laboratories, Incorporated Process for electroless plating using separate sensitization and activation steps
US4066809A (en) * 1976-06-28 1978-01-03 International Business Machines Corporation Method for preparing substrate surfaces for electroless deposition
JPS5949305B2 (ja) * 1977-10-31 1984-12-01 株式会社日立製作所 化学めつき前処理方法
US4152467A (en) * 1978-03-10 1979-05-01 International Business Machines Corporation Electroless copper plating process with dissolved oxygen maintained in bath
US4227963A (en) * 1978-09-07 1980-10-14 Standard Oil Company Chemical etching of polymers for metallizing utilizing an aqueous sulfuric-carboxylic acid etchant
US4309462A (en) * 1978-12-19 1982-01-05 Crown City Plating Co. Conditioning of caprolactam polymers for electroless plating
JPS5627593A (en) * 1979-08-14 1981-03-17 Fujitsu Ltd Check system
JPS605079B2 (ja) * 1980-09-02 1985-02-08 株式会社日立製作所 プリント基板の製造方法
JPS5952555B2 (ja) * 1981-06-12 1984-12-20 株式会社日立製作所 プリント基板の製造方法
DE3369054D1 (en) * 1983-05-19 1987-02-12 Ibm Deutschland Method of reworking the whole surface of multilayer circuits with defective outer copper conductor layers
US4537799A (en) * 1984-04-16 1985-08-27 At&T Technologies, Inc. Selective metallization process

Also Published As

Publication number Publication date
EP0201806B1 (de) 1991-08-28
CA1229266A (en) 1987-11-17
JPH0325038B2 (de) 1991-04-04
US4639380A (en) 1987-01-27
EP0201806A3 (en) 1987-09-02
JPS61256689A (ja) 1986-11-14
EP0201806A2 (de) 1986-11-20

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8339 Ceased/non-payment of the annual fee