JPS53135840A - Metal coating method for non-electroconductive material - Google Patents

Metal coating method for non-electroconductive material

Info

Publication number
JPS53135840A
JPS53135840A JP5012377A JP5012377A JPS53135840A JP S53135840 A JPS53135840 A JP S53135840A JP 5012377 A JP5012377 A JP 5012377A JP 5012377 A JP5012377 A JP 5012377A JP S53135840 A JPS53135840 A JP S53135840A
Authority
JP
Japan
Prior art keywords
electroconductive material
coating method
metal coating
electroconductive
degreasing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5012377A
Other languages
Japanese (ja)
Inventor
Kazuhito Murakami
Fumio Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP5012377A priority Critical patent/JPS53135840A/en
Publication of JPS53135840A publication Critical patent/JPS53135840A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated

Abstract

PURPOSE:To form a thin metal film of good adherence on a non-electroconductive material at high speed by degreasing and etching the material with an alkali soln. followed by dry plating.
JP5012377A 1977-04-30 1977-04-30 Metal coating method for non-electroconductive material Pending JPS53135840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5012377A JPS53135840A (en) 1977-04-30 1977-04-30 Metal coating method for non-electroconductive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5012377A JPS53135840A (en) 1977-04-30 1977-04-30 Metal coating method for non-electroconductive material

Publications (1)

Publication Number Publication Date
JPS53135840A true JPS53135840A (en) 1978-11-27

Family

ID=12850340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5012377A Pending JPS53135840A (en) 1977-04-30 1977-04-30 Metal coating method for non-electroconductive material

Country Status (1)

Country Link
JP (1) JPS53135840A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5641640A (en) * 1979-09-14 1981-04-18 Hitachi Ltd Manufacture of image pick-up tube
JPS57169299A (en) * 1981-04-09 1982-10-18 Matsushita Electric Ind Co Ltd Device for plating in vacuum through hole of printed board
JPS61164295A (en) * 1985-01-11 1986-07-24 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション Metal adhesion for organic substrate
US4725504A (en) * 1987-02-24 1988-02-16 Polyonics Corporation Metal coated laminate products made from textured polyimide film
JPH0232591A (en) * 1988-07-22 1990-02-02 Hitachi Cable Ltd Manufacture of copper-organic insulating film wiring board
JPH0298188A (en) * 1988-10-04 1990-04-10 Nitto Denko Corp Manufacture of circuit board
JPH05110247A (en) * 1991-10-18 1993-04-30 Shin Etsu Chem Co Ltd Manufacture of board for flexible printed wiring
JP2006324475A (en) * 2005-05-19 2006-11-30 Sumitomo Metal Mining Co Ltd Method of manufacturing metal-clad polyimide substrate

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5641640A (en) * 1979-09-14 1981-04-18 Hitachi Ltd Manufacture of image pick-up tube
JPS57169299A (en) * 1981-04-09 1982-10-18 Matsushita Electric Ind Co Ltd Device for plating in vacuum through hole of printed board
JPS61164295A (en) * 1985-01-11 1986-07-24 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション Metal adhesion for organic substrate
US4725504A (en) * 1987-02-24 1988-02-16 Polyonics Corporation Metal coated laminate products made from textured polyimide film
JPH0232591A (en) * 1988-07-22 1990-02-02 Hitachi Cable Ltd Manufacture of copper-organic insulating film wiring board
JPH0298188A (en) * 1988-10-04 1990-04-10 Nitto Denko Corp Manufacture of circuit board
JPH05110247A (en) * 1991-10-18 1993-04-30 Shin Etsu Chem Co Ltd Manufacture of board for flexible printed wiring
JP2006324475A (en) * 2005-05-19 2006-11-30 Sumitomo Metal Mining Co Ltd Method of manufacturing metal-clad polyimide substrate

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