JPS53135840A - Metal coating method for non-electroconductive material - Google Patents
Metal coating method for non-electroconductive materialInfo
- Publication number
- JPS53135840A JPS53135840A JP5012377A JP5012377A JPS53135840A JP S53135840 A JPS53135840 A JP S53135840A JP 5012377 A JP5012377 A JP 5012377A JP 5012377 A JP5012377 A JP 5012377A JP S53135840 A JPS53135840 A JP S53135840A
- Authority
- JP
- Japan
- Prior art keywords
- electroconductive material
- coating method
- metal coating
- electroconductive
- degreasing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
Abstract
PURPOSE:To form a thin metal film of good adherence on a non-electroconductive material at high speed by degreasing and etching the material with an alkali soln. followed by dry plating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5012377A JPS53135840A (en) | 1977-04-30 | 1977-04-30 | Metal coating method for non-electroconductive material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5012377A JPS53135840A (en) | 1977-04-30 | 1977-04-30 | Metal coating method for non-electroconductive material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53135840A true JPS53135840A (en) | 1978-11-27 |
Family
ID=12850340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5012377A Pending JPS53135840A (en) | 1977-04-30 | 1977-04-30 | Metal coating method for non-electroconductive material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53135840A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5641640A (en) * | 1979-09-14 | 1981-04-18 | Hitachi Ltd | Manufacture of image pick-up tube |
JPS57169299A (en) * | 1981-04-09 | 1982-10-18 | Matsushita Electric Ind Co Ltd | Device for plating in vacuum through hole of printed board |
JPS61164295A (en) * | 1985-01-11 | 1986-07-24 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Metal adhesion for organic substrate |
US4725504A (en) * | 1987-02-24 | 1988-02-16 | Polyonics Corporation | Metal coated laminate products made from textured polyimide film |
JPH0232591A (en) * | 1988-07-22 | 1990-02-02 | Hitachi Cable Ltd | Manufacture of copper-organic insulating film wiring board |
JPH0298188A (en) * | 1988-10-04 | 1990-04-10 | Nitto Denko Corp | Manufacture of circuit board |
JPH05110247A (en) * | 1991-10-18 | 1993-04-30 | Shin Etsu Chem Co Ltd | Manufacture of board for flexible printed wiring |
JP2006324475A (en) * | 2005-05-19 | 2006-11-30 | Sumitomo Metal Mining Co Ltd | Method of manufacturing metal-clad polyimide substrate |
-
1977
- 1977-04-30 JP JP5012377A patent/JPS53135840A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5641640A (en) * | 1979-09-14 | 1981-04-18 | Hitachi Ltd | Manufacture of image pick-up tube |
JPS57169299A (en) * | 1981-04-09 | 1982-10-18 | Matsushita Electric Ind Co Ltd | Device for plating in vacuum through hole of printed board |
JPS61164295A (en) * | 1985-01-11 | 1986-07-24 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Metal adhesion for organic substrate |
US4725504A (en) * | 1987-02-24 | 1988-02-16 | Polyonics Corporation | Metal coated laminate products made from textured polyimide film |
JPH0232591A (en) * | 1988-07-22 | 1990-02-02 | Hitachi Cable Ltd | Manufacture of copper-organic insulating film wiring board |
JPH0298188A (en) * | 1988-10-04 | 1990-04-10 | Nitto Denko Corp | Manufacture of circuit board |
JPH05110247A (en) * | 1991-10-18 | 1993-04-30 | Shin Etsu Chem Co Ltd | Manufacture of board for flexible printed wiring |
JP2006324475A (en) * | 2005-05-19 | 2006-11-30 | Sumitomo Metal Mining Co Ltd | Method of manufacturing metal-clad polyimide substrate |
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