ATE524837T1 - Verfahren zur herstellung eines lichtemittierenden bauelements - Google Patents
Verfahren zur herstellung eines lichtemittierenden bauelementsInfo
- Publication number
- ATE524837T1 ATE524837T1 AT04799734T AT04799734T ATE524837T1 AT E524837 T1 ATE524837 T1 AT E524837T1 AT 04799734 T AT04799734 T AT 04799734T AT 04799734 T AT04799734 T AT 04799734T AT E524837 T1 ATE524837 T1 AT E524837T1
- Authority
- AT
- Austria
- Prior art keywords
- light
- layer
- transfer layer
- minute unevenness
- producing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- 239000013078 crystal Substances 0.000 abstract 2
- 238000003825 pressing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003383064A JP4124102B2 (ja) | 2003-11-12 | 2003-11-12 | 多重反射防止構造を備えた発光素子とその製造方法 |
PCT/JP2004/017121 WO2005048361A2 (en) | 2003-11-12 | 2004-11-11 | A method for producing a light-emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE524837T1 true ATE524837T1 (de) | 2011-09-15 |
Family
ID=34587280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04799734T ATE524837T1 (de) | 2003-11-12 | 2004-11-11 | Verfahren zur herstellung eines lichtemittierenden bauelements |
Country Status (7)
Country | Link |
---|---|
US (1) | US7709282B2 (de) |
EP (1) | EP1683205B1 (de) |
JP (1) | JP4124102B2 (de) |
CN (1) | CN100472824C (de) |
AT (1) | ATE524837T1 (de) |
TW (1) | TWI264834B (de) |
WO (1) | WO2005048361A2 (de) |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2264798B1 (de) | 2003-04-30 | 2020-10-14 | Cree, Inc. | Hochleistungs-Lichtemitter-Verkapselungen mit kompakter Optik |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
DE112006001835T5 (de) * | 2005-07-11 | 2008-05-15 | GELcore, LLC (n.d.Ges.d. Staates Delaware), Valley View | Laserabgehobene LED mit verbesserter Lichtausbeute |
WO2007031929A1 (en) * | 2005-09-16 | 2007-03-22 | Koninklijke Philips Electronics N.V. | Method for manufacturing led wafer with light extracting layer |
JP4696836B2 (ja) * | 2005-10-19 | 2011-06-08 | セイコーエプソン株式会社 | 静電アクチュエータの製造方法および静電アクチュエータ |
JP2007142277A (ja) * | 2005-11-21 | 2007-06-07 | Matsushita Electric Works Ltd | 発光素子の製造方法 |
JP2007173579A (ja) * | 2005-12-22 | 2007-07-05 | Matsushita Electric Works Ltd | 半導体発光素子およびその製造方法 |
KR100658970B1 (ko) * | 2006-01-09 | 2006-12-19 | 주식회사 메디아나전자 | 복합 파장의 광을 발생시키는 발광 다이오드 소자 |
KR100703216B1 (ko) * | 2006-02-21 | 2007-04-09 | 삼성전기주식회사 | 발광다이오드 패키지의 제조 방법 |
JP4790481B2 (ja) * | 2006-04-26 | 2011-10-12 | 株式会社小糸製作所 | 車両用灯具ユニット |
WO2007145103A1 (en) * | 2006-06-14 | 2007-12-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
KR101257872B1 (ko) * | 2006-07-26 | 2013-04-23 | 엘지전자 주식회사 | 발광 소자 및 그 제조방법 |
SG140473A1 (en) * | 2006-08-16 | 2008-03-28 | Tinggi Tech Private Ltd | Improvements in external light efficiency of light emitting diodes |
JP2008066557A (ja) * | 2006-09-08 | 2008-03-21 | Matsushita Electric Ind Co Ltd | 半導体発光装置および半導体発光装置の製造方法 |
US20100224890A1 (en) * | 2006-09-18 | 2010-09-09 | Cree, Inc. | Light emitting diode chip with electrical insulation element |
EP2843716A3 (de) | 2006-11-15 | 2015-04-29 | The Regents of The University of California | Leuchtdiode mit strukturierter Phosphorumwandlungsschicht |
TW201448263A (zh) | 2006-12-11 | 2014-12-16 | Univ California | 透明發光二極體 |
KR101506356B1 (ko) | 2007-01-22 | 2015-03-26 | 크리, 인코포레이티드 | 외부적으로 상호연결된 발광 장치의 어레이를 사용하는 조명 장치 및 그 제조 방법 |
JP2010517273A (ja) | 2007-01-22 | 2010-05-20 | クリー レッド ライティング ソリューションズ、インコーポレイテッド | フォールト・トレラント発光体、フォールト・トレラント発光体を含むシステムおよびフォールト・トレラント発光体を作製する方法 |
JP2008181910A (ja) * | 2007-01-23 | 2008-08-07 | Mitsubishi Chemicals Corp | GaN系発光ダイオード素子の製造方法 |
US8021904B2 (en) | 2007-02-01 | 2011-09-20 | Cree, Inc. | Ohmic contacts to nitrogen polarity GaN |
JP5078488B2 (ja) * | 2007-03-05 | 2012-11-21 | 富士フイルム株式会社 | 発光素子およびその製造方法ならびに光学素子およびその製造方法 |
TWI357886B (en) | 2007-08-13 | 2012-02-11 | Epistar Corp | Stamp having nanometer scale structure and applica |
US11114594B2 (en) * | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
US8368100B2 (en) * | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
US8536584B2 (en) | 2007-11-14 | 2013-09-17 | Cree, Inc. | High voltage wire bond free LEDS |
US9634191B2 (en) | 2007-11-14 | 2017-04-25 | Cree, Inc. | Wire bond free wafer level LED |
JP4993371B2 (ja) * | 2007-11-21 | 2012-08-08 | サンケン電気株式会社 | 半導体発光素子用ウエーハの粗面化方法及び半導体発光素子 |
US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
CN101487974B (zh) * | 2008-01-17 | 2013-06-12 | 晶元光电股份有限公司 | 一种纳米级印模结构及其在发光元件上的应用 |
JP2009218569A (ja) * | 2008-02-13 | 2009-09-24 | Toyoda Gosei Co Ltd | Iii族窒化物半導体からなる発光素子とその製造方法 |
US8384115B2 (en) * | 2008-08-01 | 2013-02-26 | Cree, Inc. | Bond pad design for enhancing light extraction from LED chips |
US8633501B2 (en) | 2008-08-12 | 2014-01-21 | Epistar Corporation | Light-emitting device having a patterned surface |
JP5359154B2 (ja) * | 2008-09-26 | 2013-12-04 | 住友電気工業株式会社 | 回折格子の形成方法および分布帰還型半導体レーザの製造方法 |
JP2010109015A (ja) * | 2008-10-28 | 2010-05-13 | Panasonic Electric Works Co Ltd | 半導体発光素子の製造方法 |
DE102009008223A1 (de) * | 2009-02-10 | 2010-08-12 | Osram Opto Semiconductors Gmbh | Verfahren zur Strukturierung einer Halbleiteroberfläche und Halbleiterchip |
KR101747978B1 (ko) * | 2009-03-31 | 2017-06-15 | 도판 인사츠 가부시키가이샤 | El 패널 및 그것을 이용한 조명 장치 및 표시 장치 |
US9093293B2 (en) | 2009-04-06 | 2015-07-28 | Cree, Inc. | High voltage low current surface emitting light emitting diode |
US8476668B2 (en) * | 2009-04-06 | 2013-07-02 | Cree, Inc. | High voltage low current surface emitting LED |
US8741715B2 (en) * | 2009-04-29 | 2014-06-03 | Cree, Inc. | Gate electrodes for millimeter-wave operation and methods of fabrication |
DE102009023355A1 (de) | 2009-05-29 | 2010-12-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
JP5509840B2 (ja) * | 2009-12-22 | 2014-06-04 | 豊田合成株式会社 | 半導体発光素子の製造方法 |
US8772805B2 (en) | 2010-03-31 | 2014-07-08 | Seoul Viosys Co., Ltd. | High efficiency light emitting diode and method for fabricating the same |
DE102010020162A1 (de) * | 2010-05-11 | 2011-11-17 | Osram Opto Semiconductors Gmbh | Verfahren zur Strukturierung eines Strahlungsauskoppelelements |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
US8455882B2 (en) | 2010-10-15 | 2013-06-04 | Cree, Inc. | High efficiency LEDs |
JP2012124257A (ja) * | 2010-12-07 | 2012-06-28 | Toshiba Corp | 半導体発光素子及びその製造方法 |
JP5833325B2 (ja) * | 2011-03-23 | 2015-12-16 | スタンレー電気株式会社 | 深紫外光源 |
KR101795029B1 (ko) | 2011-04-25 | 2017-11-07 | 엘지이노텍 주식회사 | 뷰 각도를 증가시키기 위한 광소자 패키지 |
WO2012164456A1 (en) * | 2011-06-01 | 2012-12-06 | Koninklijke Philips Electronics N.V. | Method of attaching a light emitting device to a support substrate |
WO2013036589A1 (en) * | 2011-09-06 | 2013-03-14 | Sensor Electronic Technology, Inc. | Patterned substrate design for layer growth |
US10032956B2 (en) | 2011-09-06 | 2018-07-24 | Sensor Electronic Technology, Inc. | Patterned substrate design for layer growth |
CN103009845A (zh) * | 2011-09-20 | 2013-04-03 | 大亚科技股份有限公司 | 一种凹凸和压纹一次加工工艺 |
JP5250162B1 (ja) | 2011-11-21 | 2013-07-31 | パナソニック株式会社 | 発光装置及び照明装置 |
WO2013105004A1 (en) * | 2012-01-10 | 2013-07-18 | Koninklijke Philips N.V. | Controlled led light output by selective area roughening |
JP6002427B2 (ja) * | 2012-04-19 | 2016-10-05 | 旭化成株式会社 | Led用基板及びその製造方法 |
JP2014229648A (ja) * | 2013-05-20 | 2014-12-08 | シャープ株式会社 | 半導体発光素子 |
CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
US9437782B2 (en) * | 2014-06-18 | 2016-09-06 | X-Celeprint Limited | Micro assembled LED displays and lighting elements |
GR1008582B (el) * | 2014-07-31 | 2015-10-06 | Ιδρυμα Τεχνολογιας Και Ερευνας (Ιτε), | Διαμορφωσεις αποδομησης υποστρωματος sic και κατασκευη συσκευων διοδων εκπομπης φωτος |
USD826871S1 (en) | 2014-12-11 | 2018-08-28 | Cree, Inc. | Light emitting diode device |
DE102015102365A1 (de) | 2015-02-19 | 2016-08-25 | Osram Opto Semiconductors Gmbh | Strahlungskörper und Verfahren zur Herstellung eines Strahlungskörpers |
JP6034456B2 (ja) * | 2015-07-16 | 2016-11-30 | 株式会社東芝 | 半導体発光装置及び発光装置 |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
JP2018029114A (ja) * | 2016-08-17 | 2018-02-22 | 株式会社ディスコ | 発光ダイオードチップの製造方法及び発光ダイオードチップ |
JP2018029112A (ja) * | 2016-08-17 | 2018-02-22 | 株式会社ディスコ | 発光ダイオードチップの製造方法及び発光ダイオードチップ |
JP2018029113A (ja) * | 2016-08-17 | 2018-02-22 | 株式会社ディスコ | 発光ダイオードチップの製造方法 |
JP2018046067A (ja) * | 2016-09-12 | 2018-03-22 | 株式会社ディスコ | 発光ダイオードチップの製造方法及び発光ダイオードチップ |
JP2018046068A (ja) * | 2016-09-12 | 2018-03-22 | 株式会社ディスコ | 発光ダイオードチップの製造方法 |
JP2018046066A (ja) * | 2016-09-12 | 2018-03-22 | 株式会社ディスコ | 発光ダイオードチップの製造方法 |
JP2018046065A (ja) * | 2016-09-12 | 2018-03-22 | 株式会社ディスコ | 発光ダイオードチップの製造方法及び発光ダイオードチップ |
JP2018046064A (ja) * | 2016-09-12 | 2018-03-22 | 株式会社ディスコ | 発光ダイオードチップの製造方法及び発光ダイオードチップ |
CN108365028A (zh) * | 2018-01-30 | 2018-08-03 | 北京世纪金光半导体有限公司 | 一种碳化硅器件表面制绒方法 |
CN110120623B (zh) * | 2018-02-05 | 2021-06-08 | 深圳光峰科技股份有限公司 | 密封件及发光装置 |
DE102019101346A1 (de) * | 2019-01-18 | 2020-07-23 | Osram Opto Semiconductors Gmbh | Nanostempelverfahren und nanooptisches bauteil |
CN112166507B (zh) * | 2020-01-06 | 2022-07-22 | 厦门三安光电有限公司 | 一种发光二极管的制作方法 |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
Family Cites Families (22)
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JPS63283174A (ja) | 1987-05-15 | 1988-11-21 | Omron Tateisi Electronics Co | 発光ダイオ−ド |
JP2836687B2 (ja) | 1993-04-03 | 1998-12-14 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JPH09166874A (ja) | 1995-12-15 | 1997-06-24 | Hitachi Ltd | パターン形成方法及び半導体装置製造方法 |
US5779924A (en) * | 1996-03-22 | 1998-07-14 | Hewlett-Packard Company | Ordered interface texturing for a light emitting device |
JP3643225B2 (ja) | 1997-12-03 | 2005-04-27 | ローム株式会社 | 光半導体チップ |
US6504180B1 (en) * | 1998-07-28 | 2003-01-07 | Imec Vzw And Vrije Universiteit | Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom |
JP3469484B2 (ja) * | 1998-12-24 | 2003-11-25 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
JP2000232095A (ja) | 1999-02-12 | 2000-08-22 | Nippon Telegr & Teleph Corp <Ntt> | 半導体表面の微細パターン形成方法 |
TW465123B (en) * | 2000-02-02 | 2001-11-21 | Ind Tech Res Inst | High power white light LED |
TW445507B (en) * | 2000-07-20 | 2001-07-11 | United Epitaxy Co Ltd | Roughened interface of light emitting device |
US7041394B2 (en) * | 2001-03-15 | 2006-05-09 | Seagate Technology Llc | Magnetic recording media having self organized magnetic arrays |
US6987613B2 (en) * | 2001-03-30 | 2006-01-17 | Lumileds Lighting U.S., Llc | Forming an optical element on the surface of a light emitting device for improved light extraction |
JP4734770B2 (ja) | 2001-06-12 | 2011-07-27 | ソニー株式会社 | 樹脂形成素子の製造方法、画像表示装置の製造方法、および照明装置の製造方法 |
TW564584B (en) | 2001-06-25 | 2003-12-01 | Toshiba Corp | Semiconductor light emitting device |
JP4208447B2 (ja) | 2001-09-26 | 2009-01-14 | 独立行政法人科学技術振興機構 | Sogを用いた室温ナノ−インプリント−リソグラフィー |
EP2402797A3 (de) * | 2001-12-14 | 2012-08-08 | QUALCOMM MEMS Technologies, Inc. | Einförmiges Beleuchtungssystem |
TW576864B (en) * | 2001-12-28 | 2004-02-21 | Toshiba Corp | Method for manufacturing a light-emitting device |
JP3782357B2 (ja) | 2002-01-18 | 2006-06-07 | 株式会社東芝 | 半導体発光素子の製造方法 |
JP4233268B2 (ja) | 2002-04-23 | 2009-03-04 | シャープ株式会社 | 窒化物系半導体発光素子およびその製造方法 |
JP2003347586A (ja) | 2003-07-08 | 2003-12-05 | Toshiba Corp | 半導体発光素子 |
US7175966B2 (en) * | 2003-09-19 | 2007-02-13 | International Business Machines Corporation | Water and aqueous base soluble antireflective coating/hardmask materials |
US7012279B2 (en) * | 2003-10-21 | 2006-03-14 | Lumileds Lighting U.S., Llc | Photonic crystal light emitting device |
-
2003
- 2003-11-12 JP JP2003383064A patent/JP4124102B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-11 CN CNB2004800311787A patent/CN100472824C/zh not_active Expired - Fee Related
- 2004-11-11 AT AT04799734T patent/ATE524837T1/de active
- 2004-11-11 US US10/575,489 patent/US7709282B2/en not_active Expired - Fee Related
- 2004-11-11 EP EP04799734A patent/EP1683205B1/de not_active Not-in-force
- 2004-11-11 WO PCT/JP2004/017121 patent/WO2005048361A2/en active Application Filing
- 2004-11-12 TW TW093134631A patent/TWI264834B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1683205A2 (de) | 2006-07-26 |
TW200529470A (en) | 2005-09-01 |
WO2005048361A3 (en) | 2006-01-26 |
TWI264834B (en) | 2006-10-21 |
JP2005150261A (ja) | 2005-06-09 |
US20070065960A1 (en) | 2007-03-22 |
CN100472824C (zh) | 2009-03-25 |
US7709282B2 (en) | 2010-05-04 |
WO2005048361A2 (en) | 2005-05-26 |
JP4124102B2 (ja) | 2008-07-23 |
CN1871713A (zh) | 2006-11-29 |
EP1683205B1 (de) | 2011-09-14 |
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