ATE486715T1 - Psa-folie zum zerschneiden und verarbeitungsverfahren von daraus hergestellten produkten - Google Patents

Psa-folie zum zerschneiden und verarbeitungsverfahren von daraus hergestellten produkten

Info

Publication number
ATE486715T1
ATE486715T1 AT06006556T AT06006556T ATE486715T1 AT E486715 T1 ATE486715 T1 AT E486715T1 AT 06006556 T AT06006556 T AT 06006556T AT 06006556 T AT06006556 T AT 06006556T AT E486715 T1 ATE486715 T1 AT E486715T1
Authority
AT
Austria
Prior art keywords
pressure
sensitive adhesive
cutting
products made
processing products
Prior art date
Application number
AT06006556T
Other languages
English (en)
Inventor
Toshio Shintani
Tomokazu Takahashi
Syouji Yamamoto
Kazuyuki Kiuchi
Fumiteru Asai
Kouji Akazawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE486715T1 publication Critical patent/ATE486715T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Cutting Processes (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
AT06006556T 2005-05-16 2006-03-29 Psa-folie zum zerschneiden und verarbeitungsverfahren von daraus hergestellten produkten ATE486715T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005142417 2005-05-16
JP2006008484 2006-01-17
JP2006021027A JP4800778B2 (ja) 2005-05-16 2006-01-30 ダイシング用粘着シート及びそれを用いた被加工物の加工方法

Publications (1)

Publication Number Publication Date
ATE486715T1 true ATE486715T1 (de) 2010-11-15

Family

ID=36840915

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06006556T ATE486715T1 (de) 2005-05-16 2006-03-29 Psa-folie zum zerschneiden und verarbeitungsverfahren von daraus hergestellten produkten

Country Status (8)

Country Link
US (1) US20060257651A1 (de)
EP (2) EP1724106B1 (de)
JP (1) JP4800778B2 (de)
KR (1) KR101350045B1 (de)
CN (1) CN1865376B (de)
AT (1) ATE486715T1 (de)
DE (1) DE602006017920D1 (de)
TW (1) TWI398501B (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107417B2 (ja) 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
JP4283596B2 (ja) * 2003-05-29 2009-06-24 日東電工株式会社 チップ状ワークの固定方法
JP4275522B2 (ja) * 2003-12-26 2009-06-10 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4799205B2 (ja) * 2006-02-16 2011-10-26 日東電工株式会社 活性面貼付ダイシング用粘着テープ又はシートおよび被加工物の切断片のピックアップ方法
US7935424B2 (en) * 2006-04-06 2011-05-03 Lintec Corporation Adhesive sheet
JP5049612B2 (ja) * 2007-02-28 2012-10-17 リンテック株式会社 粘着シート
JP4991348B2 (ja) * 2006-04-06 2012-08-01 リンテック株式会社 粘着シート
JP4970863B2 (ja) * 2006-07-13 2012-07-11 日東電工株式会社 被加工物の加工方法
JP4781185B2 (ja) * 2006-07-18 2011-09-28 日東電工株式会社 耐熱ダイシングテープ又はシート
JP4837490B2 (ja) * 2006-08-22 2011-12-14 日東電工株式会社 加工用粘着シート
JP4931519B2 (ja) * 2006-09-01 2012-05-16 日東電工株式会社 活性面貼付ダイシング用粘着テープ又はシートおよび被加工物の切断片のピックアップ方法
JP5408640B2 (ja) * 2006-09-04 2014-02-05 日東電工株式会社 紫外線硬化型粘着剤組成物、紫外線硬化型粘着シート及びその製造方法
KR100943799B1 (ko) * 2006-09-12 2010-02-23 닛토덴코 가부시키가이샤 다이싱·다이본드 필름
KR100867183B1 (ko) 2006-12-05 2008-11-06 주식회사 엘지화학 다이싱·다이 본딩용 접착 필름, 이를 사용한 반도체 장치및 그의 제조 방법
JP4493643B2 (ja) * 2006-12-06 2010-06-30 日東電工株式会社 再剥離型粘着剤組成物、及び粘着テープ又はシート
JP5101111B2 (ja) 2007-01-05 2012-12-19 日東電工株式会社 半導体基板加工用粘着シート
JP2008163276A (ja) * 2007-01-05 2008-07-17 Nitto Denko Corp 半導体基板加工用粘着シート
JP5000370B2 (ja) * 2007-04-20 2012-08-15 日東電工株式会社 ウォータージェットレーザダイシング用粘着シート
KR101454183B1 (ko) * 2007-11-12 2014-10-27 린텍 코포레이션 점착 시트
JP5087414B2 (ja) 2008-01-22 2012-12-05 日東電工株式会社 光硬化型アクリル系粘弾性体組成物、アクリル系粘弾性体、アクリル系粘弾性体層テープ又はシート、及びそれらの製造方法
JP4718629B2 (ja) * 2008-08-04 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP5153597B2 (ja) * 2008-12-05 2013-02-27 リンテック株式会社 チップ用保護膜形成用シートおよび保護膜付半導体チップ
KR101353331B1 (ko) * 2009-03-03 2014-01-17 히다치 막셀 가부시키가이샤 방사선 경화성 점착제 조성물, 그것을 사용한 다이싱용 점착 필름 및 절단편의 제조방법
WO2011077922A1 (ja) * 2009-12-24 2011-06-30 株式会社スリーボンド 仮固定組成物
JP2011216734A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウエハ加工用粘着シート
KR20120092694A (ko) * 2010-03-31 2012-08-21 후루카와 덴키 고교 가부시키가이샤 반도체 웨이퍼 가공용 점착시트
JP5461292B2 (ja) * 2010-04-28 2014-04-02 日立マクセル株式会社 ダイシング用粘着フィルム、及び切断片の製造方法
EP2412739A1 (de) * 2010-07-27 2012-02-01 Cytec Surface Specialties, S.A. Strahlungshärtbare wässrige Zusammensetzungen
JP5653675B2 (ja) * 2010-07-30 2015-01-14 古河電気工業株式会社 ウエハ加工用テープ
JP5687897B2 (ja) 2010-12-28 2015-03-25 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
JP5781302B2 (ja) 2010-12-28 2015-09-16 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
JP5907472B2 (ja) * 2011-05-26 2016-04-26 住友ベークライト株式会社 半導体ウエハ加工用粘着テープ
JP5410644B2 (ja) * 2011-09-16 2014-02-05 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP5361092B2 (ja) * 2011-09-16 2013-12-04 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
WO2013089983A1 (en) * 2011-12-15 2013-06-20 Henkel Corporation Dicing tape for rough surface die attach film
JP5809685B2 (ja) * 2013-12-12 2015-11-11 リンテック株式会社 粘着シートおよび半導体装置の製造方法
WO2015133420A1 (ja) * 2014-03-03 2015-09-11 リンテック株式会社 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法
JP6545454B2 (ja) * 2014-12-09 2019-07-17 日東電工株式会社 半導体の製造に用いられる粘着シート
JP6418360B1 (ja) * 2017-03-17 2018-11-07 住友ベークライト株式会社 粘着テープセットおよび半導体素子移送用粘着テープ
CN111149191B (zh) * 2017-12-07 2023-08-29 琳得科株式会社 工件加工用片及已加工工件的制造方法
JP7086102B2 (ja) * 2017-12-07 2022-06-17 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法
CN111164737B (zh) * 2017-12-07 2023-08-29 琳得科株式会社 工件加工用片及已加工工件的制造方法
JP7373268B2 (ja) 2018-03-29 2023-11-02 リンテック株式会社 個片体形成装置および個片体形成方法
WO2020053981A1 (ja) * 2018-09-12 2020-03-19 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法
JP2021050319A (ja) * 2019-09-19 2021-04-01 日東電工株式会社 粘着テープ
JP7547498B2 (ja) * 2020-11-09 2024-09-09 デンカ株式会社 粘着テープ及び加工方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264533A (en) * 1988-06-16 1993-11-23 Basf Aktiengesellschaft Benzophenone derivatives and their preparation
DE69033712T2 (de) 1989-12-06 2001-09-06 Canon K.K., Tokio/Tokyo Druckempfindliches klebeband, tintenstrahlaufzeichnungskopf und speicherverfahren
AU1441692A (en) * 1991-02-12 1992-09-07 Landec Corporation Temperature zone specific pressure-sensitive adhesive compositions, and adhesive assemblies and methods of use associated therewith
US5538771A (en) * 1991-06-28 1996-07-23 Furukawa Electric Co., Ltd. Semiconductor wafer-securing adhesive tape
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5476566A (en) * 1992-09-02 1995-12-19 Motorola, Inc. Method for thinning a semiconductor wafer
IT1270356B (it) * 1993-05-17 1997-05-05 P & G Spa Composizione adesiva, relativi procedimenti ed impiego
KR100390687B1 (ko) * 1995-02-10 2005-05-31 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 가교된압력민감성접착제로피복된제품의생산방법
JPH10176152A (ja) * 1996-10-14 1998-06-30 Nitto Denko Corp 塗膜保護用シート
JP4256481B2 (ja) * 1997-02-14 2009-04-22 リンテック株式会社 粘着剤組成物およびその利用方法
JP4053656B2 (ja) * 1998-05-22 2008-02-27 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
US6165563A (en) * 1998-11-12 2000-12-26 National Starch And Chemical Investment Holding Corporation Radiation curable free radically polymerized star-branched polymers
CN1137028C (zh) * 1998-11-20 2004-02-04 琳得科株式会社 压敏粘合片及其使用方法
US6261675B1 (en) * 1999-03-23 2001-07-17 Hexcel Corporation Core-crush resistant fabric and prepreg for fiber reinforced composite sandwich structures
CN1073150C (zh) * 1999-04-06 2001-10-17 覃桂军 一种机榨植物毛油消泡的方法
JP3340979B2 (ja) * 1999-09-06 2002-11-05 日東電工株式会社 ダイシング用粘着シート
JP3862489B2 (ja) * 1999-12-14 2006-12-27 日東電工株式会社 再剥離用粘着シート
WO2001052823A2 (en) * 2000-01-20 2001-07-26 Noven Pharmaceuticals, Inc. Compositions to effect the release profile in the transdermal administration of drugs
JP2001226650A (ja) * 2000-02-16 2001-08-21 Nitto Denko Corp 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート
JP4651799B2 (ja) * 2000-10-18 2011-03-16 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP4703833B2 (ja) * 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
WO2002054420A1 (en) * 2000-12-28 2002-07-11 Tdk Corporation Laminated circuit board and production method for electronic part, and laminated electronic part
JP4247956B2 (ja) * 2001-07-04 2009-04-02 古河電気工業株式会社 帯電防止ダイシングテープ
US20030064579A1 (en) * 2001-09-27 2003-04-03 Masafumi Miyakawa Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive film
KR20040105546A (ko) * 2002-01-15 2004-12-16 세키스이가가쿠 고교가부시키가이샤 Ｉｃ칩의 제조 방법
JP3853247B2 (ja) * 2002-04-16 2006-12-06 日東電工株式会社 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品
DE10218570B4 (de) * 2002-04-26 2007-10-18 Lohmann Gmbh & Co Kg Acrylatcopolymere und daraus erhältliche Haftklebemassen zum Verkleben von niederenergetischen Oberflächen sowie ihre Verwendung
JP3884995B2 (ja) 2002-05-29 2007-02-21 日東電工株式会社 皮膚貼着用粘着シート
JP3838637B2 (ja) * 2002-06-10 2006-10-25 日東電工株式会社 ガラス基板ダイシング用粘着シートおよびガラス基板ダイシング方法
TWI288438B (en) * 2002-06-12 2007-10-11 Furukawa Electric Co Ltd Method for producing wafer and adhesive tape
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
JP2004253625A (ja) * 2003-02-20 2004-09-09 Mitsui Chemicals Inc 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハの保護方法
JP2004300231A (ja) * 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP4234630B2 (ja) * 2003-05-29 2009-03-04 古河電気工業株式会社 貫通構造を有する薄膜化回路基板の製造方法と保護用粘着テープ
JP4614416B2 (ja) * 2003-05-29 2011-01-19 日東電工株式会社 半導体チップの製造方法およびダイシング用シート貼付け装置
JP4566527B2 (ja) * 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
JP2005072140A (ja) * 2003-08-21 2005-03-17 Lintec Corp 半導体装置の製造方法および半導体ウエハ加工装置
JP4381860B2 (ja) * 2004-03-24 2009-12-09 日東電工株式会社 補強半導体ウエハに固定された補強板の分離方法およびその装置
JP2005281510A (ja) * 2004-03-30 2005-10-13 Denki Kagaku Kogyo Kk 粘着剤組成物及び粘着シート
JP2005325180A (ja) * 2004-05-12 2005-11-24 Denki Kagaku Kogyo Kk 粘着剤組成物及び粘着シート
JP2005101628A (ja) * 2004-10-25 2005-04-14 Nitto Denko Corp 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品
JP4592535B2 (ja) * 2005-02-23 2010-12-01 日東電工株式会社 多層シートとその製造方法及びこの多層シートを用いた粘着シート
JP4970863B2 (ja) * 2006-07-13 2012-07-11 日東電工株式会社 被加工物の加工方法
JP4781185B2 (ja) * 2006-07-18 2011-09-28 日東電工株式会社 耐熱ダイシングテープ又はシート

Also Published As

Publication number Publication date
JP4800778B2 (ja) 2011-10-26
EP1724106A1 (de) 2006-11-22
EP1880843A1 (de) 2008-01-23
CN1865376B (zh) 2013-08-21
US20060257651A1 (en) 2006-11-16
JP2007220694A (ja) 2007-08-30
DE602006017920D1 (de) 2010-12-16
EP1724106B1 (de) 2010-11-03
CN1865376A (zh) 2006-11-22
TWI398501B (zh) 2013-06-11
KR101350045B1 (ko) 2014-01-13
EP1880843B1 (de) 2014-11-19
KR20060118329A (ko) 2006-11-23
TW200641085A (en) 2006-12-01

Similar Documents

Publication Publication Date Title
ATE486715T1 (de) Psa-folie zum zerschneiden und verarbeitungsverfahren von daraus hergestellten produkten
ATE461256T1 (de) Oberflächenschutzfolie
ATE424362T1 (de) Verfahren und vorrichtung zum entpalletieren von gestapelten gebinden
DE602005000905D1 (de) Druckempfindliche Klebstoffzusammensetzung, druckempfindliche Klebefolien, und Oberflächenschutzfilm
WO2009060566A1 (ja) 裁断機のコンベアテーブル
DE502006009115D1 (de) Vorrichtung zur aufnahme von plattenförmigen materialien
BRPI0607405A2 (pt) material de embalagem termoformável com propriedades contrativas
EP1775041A4 (de) Werkstückmaterial, flächenschutz-flächengebilde und bearbeitungsverfahren
ATE484542T1 (de) Hydrophobe fluorierte polymeroberflächen
ATE454344T1 (de) Vorrichtung zum transportieren und stützen tafelförmiger gegenstände, insbesondere glastafeln
DE602004009749D1 (de) Vorrichtung zum Stapeln von Signaturen
EP4232279A4 (de) Multifunktionale folien und laminate, artikel und verfahren
BRPI0509973B1 (pt) arranjo em um aparelho de manipulaÇço de madeira.
DE50302216D1 (de) Sägevorrichtung zum Aufteilen von plattenförmigen Werkstücken
ITTO20020131U1 (it) ,,macchina cordonatrice-piegatrice di fogli di cartoncino,,
DE60302480D1 (de) System zur automatischen Rückstellung der Seitenführung der Schalen zum Stapeln von Bögen
DE602004011701D1 (de) Vorrichtung zum Stapeln von Bögen
DE602006009594D1 (de) Vorrichtung zum Stapeln von Bögen
AT500528B8 (de) Vorrichtung zum sanieren und herstellen von tragfähigen oberflächen
ATE508967T1 (de) Förderband
ATE385991T1 (de) Treibscheibenschutz
DE602004021019D1 (de) Scheibensägenblatt
ITMI20020033A0 (it) Macchina per carteggiare manufatti iano sagomati
NL1026520A1 (nl) Diefstalbestendige constructie voor uitneembare schijfeenheid.
ATE535336T1 (de) Sägeblatt zum schneiden eines zementbrettes

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties