WO2013089983A1 - Dicing tape for rough surface die attach film - Google Patents

Dicing tape for rough surface die attach film Download PDF

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Publication number
WO2013089983A1
WO2013089983A1 PCT/US2012/065984 US2012065984W WO2013089983A1 WO 2013089983 A1 WO2013089983 A1 WO 2013089983A1 US 2012065984 W US2012065984 W US 2012065984W WO 2013089983 A1 WO2013089983 A1 WO 2013089983A1
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Prior art keywords
dicing tape
die attach
adhesive film
dicing
meth
Prior art date
Application number
PCT/US2012/065984
Other languages
French (fr)
Inventor
Younsang Kim
Mina Chow
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Henkel Corporation
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Publication date
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Publication of WO2013089983A1 publication Critical patent/WO2013089983A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H01L2224/2743—Manufacturing methods by blanket deposition of the material of the layer connector in solid form
    • H01L2224/27436—Lamination of a preform, e.g. foil, sheet or layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83856—Pre-cured adhesive, i.e. B-stage adhesive

Definitions

  • This invention relates to a dicing tape for semiconductor wafers and conductive die attach adhesive films.
  • Integrated circuits are fabricated on the surfaces of semiconductor wafers, composed of materials such as silicon and gallium-arsenide. The wafer is then separated into individual integrated circuits by dicing the wafer with a saw or laser.
  • the individual integrated circuits are bonded to a substrate that is used in the manufacture of the circuits for the ultimate electronic device. Bonding of an individual integrated circuit to its substrate is accomplished with an adhesive, known as a die attach adhesive, which comprises an adhesive resin and up to about 90% by weight of conductive filler.
  • a die attach adhesive which comprises an adhesive resin and up to about 90% by weight of conductive filler.
  • Current fabrication operations favor applying the conductive die attach adhesive directly to the back side of the wafer before dicing, as it is more efficient than applying the die attach adhesive to each individual integrated circuit or to a bond site for the integrated circuit on the substrate.
  • the conductive die attach adhesive is provided as a film on a carrier support tape or sheet (hereinafter “carrier support”).
  • carrier support a carrier support tape or sheet
  • a die attach adhesive composition is coated onto the carrier support and heated to remove any solvent that is present, or to partially cure the adhesive. This is referred to as B-staging, and brings the adhesive into a film format (herein “adhesive film”) and to a less-tacky state than before the heating.
  • This conductive die attach adhesive film subsequently is applied to the side of the wafer opposite the side containing the integrated circuitry (the "back side") before the dicing operation.
  • the wafer dicing operation stresses the wafer.
  • the wafer is supported on a sheet or tape called a dicing tape during the dicing operation.
  • dicing tapes comprise a carrier tape or sheet and a pressure sensitive adhesive on the canier, in which the pressure sensitive adhesive layer thickness is in the range of 5 ⁇ ⁇ ⁇ .
  • the conductive die attach adhesive film and dicing tape are bundled together and provided as a single unit.
  • the conductive adhesive film is mounted onto the pressure sensitive adhesive layer of the dicing tape.
  • the pressure sensitive adhesive layer of the dicing tape and the conductive die attach adhesive film are in contact.
  • the conductive die attach adhesive film is adhered to the back side of the
  • Dicing is performed from the top side of the wafer containing the circuitry and the individual semiconductor dies and conductive die attach adhesive film are picked off the dicing tape and placed on the desired substrate.
  • the rough and uneven surface of the conductive die attach adhesive film contacts the pressure sensitive adhesive on the dicing tape, gaps are formed in those places where contact is missed due to the unevenness.
  • the semiconductor die and conductive die attach adhesive film are removed from dicing tape after dicing, some of the adhesive film is left on the dicing tape. Since not all of the conductive die attach adhesive film is transferred with the
  • bonding of the semiconductor die to its desired substrate is not uniform, leading to potential adhesive failure.
  • This invention is a dicing tape comprising a carrier layer and a pressure sensitive adhesive (PSA) layer, in which the thickness of the pressure sensitive adhesive layer is greater than 15 ⁇ .
  • the thickness ranges from 15 ⁇ to 30 ⁇ .
  • the thickness can be in any range, for example up to 50 ⁇ , needed to compensate for any surface unevenness of the conductive die attach adhesive film that will be contacted to the dicing tape adhesive.
  • the dicing tape fills in any gaps caused by the rough and uneven surface of the conductive die attach adhesive film when the adhesive film and dicing tape are contacted, and allows a more uniform layer of adhesive film to be removed from the dicing tape for later use in attaching semiconductor dies to substrates.
  • FIGURE 1 contains optical microscope pictures of dicing tapes, taken from the direction of the PSA on the dicing tape carrier, after the removal of die attach adhesive film from the PSA.
  • the elements are the same for each picture, in which 10 is a square of the dicing tape, the perimeter of the square being visible dicing incisions; 11 is a circular indentation caused by a mechanical pin that pushed the adhesive film (and individual integrated circuit die) off the dicing tape from the side of the dicing tape opposite to that on which the adhesive film was disposed; 12, the light-colored and irregular shape, is die attach adhesive film left on the dicing tape.
  • the carrier layer of the dicing tape can be prepared from polymers, metals, fibers, paper, or other suitable materials.
  • the carrier layer is a polymeric film or sheet, prepared from one or more of polyolefin resin (e.g. polyethylene, propylene copolymers, polybutene, polymethylpentene), ethylene/vinyl acetate copolymer, ethylene/(meth)acrylic acid copolymers, ethylene/(meth)acrylic ester copolymers, ethylene/butene copolymer,
  • polyolefin resin e.g. polyethylene, propylene copolymers, polybutene, polymethylpentene
  • ethylene/vinyl acetate copolymer ethylene/(meth)acrylic acid copolymers
  • ethylene/(meth)acrylic ester copolymers ethylene/butene copolymer
  • the carrier layer is a polyolefin.
  • the carrier layer may be one that transmits radiation (e.g., X-ray, ultraviolet, or electron beam) so that the pressure sensitive adhesive layer formed on the carrier layer can be cured by irradiating the pressure sensitive adhesive layer from the carrier side if it is radiation curable.
  • radiation e.g., X-ray, ultraviolet, or electron beam
  • the carrier layer can be a single layer or a multilayer construction, and in some embodiments may contain fillers, age resisting agents, antistatic agents, ultraviolet absorbers, antioxidants, plasticizers, flame retardants, or surfactants.
  • the pressure sensitive adhesive layer on the earner layer is usually prepared from acrylate and methacrylate monomers.
  • the term (meth)acrylate refers to either or both acrylate or methacrylate. No one particular pressure sensitive adhesive chemistry is preferred and any pressure sensitive adhesive known to those of skill in the art that has good adhesion to the conductive die attach adhesive during dicing and that can be easily and cleanly released afterwards is acceptable.
  • Suitable (meth)acrylate monomers include butyl(meth)acrylate, 2-ethyl- hexyl(meth)acrylate, ethyl(meth)acrylate, methyl(meth)acrylate, n-propyl(meth)-acrylate, isopropyl-(meth)acrylate, t-butyl(meth)acrylate, pentyl(meth)acrylate, n-octyl(meth)acrylate, isooctyl-(meth)acrylate, isononyl(meth)acrylate and 2-ethyl-butyl(meth)acrylate.
  • (Meth)acrylate functional monomers bearing an additional functional group include the monomers above in which the (meth)acrylate ester also bears one or more substituents selected from a carboxylic acid group, a hydroxyl group, a glycidyl group, an amide group, and an anhydride group.
  • the monomers are (meth)acrylic acid, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, glycidyl
  • the thickness of the PSA layer on the dicing tape will be from about 15 ⁇ to 30 ⁇ .
  • a thicker layer for example up to 50 ⁇ may be needed to counteract the unevenness in the conductive die attach adhesive film.
  • the conductive die attach adhesive film which comes into contact with the pressure sensitive adhesive layer of the dicing tape, can be prepared from any suitable adhesive resins used in the art for adhering semiconductor dies to substrates.
  • suitable adhesive resins include acrylates, epoxies, oxetanes, and maleimides.
  • the exact composition of the adhesive film is not critical to the invention and can be determined by the practitioner for the particular desired end use.
  • the conductive die attach adhesive film conventionally is prepared by coating the conductive die attach adhesive composition onto a carrier support and heating it to B-stage it to a film. Usually a release liner is mounted over the film to protect it.
  • the support carrier and the release liner for the conductive die attach adhesive film can be composed of the same or different materials.
  • One suitable material is product number 8322 from St. Gobain Performance Plastics, which can be used for both the support carrier and the release liner.
  • the B-staging operation causes the adhesive film to adhere more strongly to the carrier support than to the release liner.
  • This differential in release may also be accomplished by choosing a release liner and a carrier support that have a difference in release properties, such that the release liner removes more easily from the adhesive film than the adhesive film removes from the support carrier.
  • a polyolefin carrier (base tape) 80 ⁇ was coated with an acrylate pressure sensitive adhesive at four levels of thickness, namely, ⁇ , 15 ⁇ , 20 ⁇ , and 30 ⁇ to make four dicing tapes.
  • the die attach adhesive was picked off the dicing tape under the following conditions: 0.5mm needle height; 10msec delay; and at 110°C and 250g pressure for 100msec. The dicing tape was then inspected to determine if any die attach adhesive remained on the pressure sensitive adhesive of the dicing tape.
  • Figure 1 contains optical microscope pictures of the dicing tape after removal of the die attach adhesive.
  • Conductive die attach adhesive film shows as light colored areas 12.
  • the pictures show the following results.
  • the ⁇ , 15 ⁇ , and 20 ⁇ thick dicing tapes did not compensate for the uneven surface of the conductive die attach adhesive film, and adhesive film was not completely removed from the dicing tape; however, the 30 ⁇ thick dicing tape did release the conductive die attach adhesive film cleanly.
  • lamination was performed at 85°C the conductive die attach adhesive film was not completely removed from ⁇ thick dicing tape, but was removed cleanly from the 15 ⁇ , 20 ⁇ , and 30 ⁇ thick dicing tapes

Abstract

A dicing tape comprises a carrier and a pressure sensitive adhesive in which the thickness of the pressure sensitive adhesive is 15μm to 50μm. With this thickness, conductive die attach adhesive film bundled with the dicing tape removes cleanly from the dicing tape.

Description

DICING TAPE FOR ROUGH SURFACE DIE ATTACH FILM
BACKGROUND OF THE INVENTION
[0001] This invention relates to a dicing tape for semiconductor wafers and conductive die attach adhesive films.
[0002] Integrated circuits are fabricated on the surfaces of semiconductor wafers, composed of materials such as silicon and gallium-arsenide. The wafer is then separated into individual integrated circuits by dicing the wafer with a saw or laser.
[0003] After dicing and separation from the wafer, the individual integrated circuits are bonded to a substrate that is used in the manufacture of the circuits for the ultimate electronic device. Bonding of an individual integrated circuit to its substrate is accomplished with an adhesive, known as a die attach adhesive, which comprises an adhesive resin and up to about 90% by weight of conductive filler. Current fabrication operations favor applying the conductive die attach adhesive directly to the back side of the wafer before dicing, as it is more efficient than applying the die attach adhesive to each individual integrated circuit or to a bond site for the integrated circuit on the substrate.
[0004] Typically, the conductive die attach adhesive is provided as a film on a carrier support tape or sheet (hereinafter "carrier support"). To prepare the film, a die attach adhesive composition is coated onto the carrier support and heated to remove any solvent that is present, or to partially cure the adhesive. This is referred to as B-staging, and brings the adhesive into a film format (herein "adhesive film") and to a less-tacky state than before the heating. This conductive die attach adhesive film subsequently is applied to the side of the wafer opposite the side containing the integrated circuitry (the "back side") before the dicing operation.
[0005] The wafer dicing operation stresses the wafer. To counteract the stress, the wafer is supported on a sheet or tape called a dicing tape during the dicing operation. Many
commercially available dicing tapes comprise a carrier tape or sheet and a pressure sensitive adhesive on the canier, in which the pressure sensitive adhesive layer thickness is in the range of 5μηΐ ΐο ΙΟμπι.
[0006] In one delivery format, the conductive die attach adhesive film and dicing tape are bundled together and provided as a single unit. The conductive adhesive film is mounted onto the pressure sensitive adhesive layer of the dicing tape. In this configuration, the pressure sensitive adhesive layer of the dicing tape and the conductive die attach adhesive film are in contact. The conductive die attach adhesive film is adhered to the back side of the
semiconductor wafer with the dicing tape attached. Dicing is performed from the top side of the wafer containing the circuitry and the individual semiconductor dies and conductive die attach adhesive film are picked off the dicing tape and placed on the desired substrate.
[0007] A problem arises because the conductive die attach adhesive film is loaded at 80 to 90% by weight with conductive particles that make the surface of the adhesive film rough and uneven. When the rough and uneven surface of the conductive die attach adhesive film contacts the pressure sensitive adhesive on the dicing tape, gaps are formed in those places where contact is missed due to the unevenness. When the semiconductor die and conductive die attach adhesive film are removed from dicing tape after dicing, some of the adhesive film is left on the dicing tape. Since not all of the conductive die attach adhesive film is transferred with the
semiconductor die, bonding of the semiconductor die to its desired substrate is not uniform, leading to potential adhesive failure.
SUMMARY OF THE INVENTION
[0008] This invention is a dicing tape comprising a carrier layer and a pressure sensitive adhesive (PSA) layer, in which the thickness of the pressure sensitive adhesive layer is greater than 15μηι. In one embodiment, the thickness ranges from 15μιη to 30μηι. In another embodiment, the thickness can be in any range, for example up to 50μιη, needed to compensate for any surface unevenness of the conductive die attach adhesive film that will be contacted to the dicing tape adhesive. At this level of thickness, the dicing tape fills in any gaps caused by the rough and uneven surface of the conductive die attach adhesive film when the adhesive film and dicing tape are contacted, and allows a more uniform layer of adhesive film to be removed from the dicing tape for later use in attaching semiconductor dies to substrates.
BRIEF DESCRIPTION OF THE FIGURE
[0009] FIGURE 1 contains optical microscope pictures of dicing tapes, taken from the direction of the PSA on the dicing tape carrier, after the removal of die attach adhesive film from the PSA. The elements are the same for each picture, in which 10 is a square of the dicing tape, the perimeter of the square being visible dicing incisions; 11 is a circular indentation caused by a mechanical pin that pushed the adhesive film (and individual integrated circuit die) off the dicing tape from the side of the dicing tape opposite to that on which the adhesive film was disposed; 12, the light-colored and irregular shape, is die attach adhesive film left on the dicing tape.
DETAILED DESCRIPTION OF THE INVENTION
[0010] The carrier layer of the dicing tape can be prepared from polymers, metals, fibers, paper, or other suitable materials. In one embodiment, the carrier layer is a polymeric film or sheet, prepared from one or more of polyolefin resin (e.g. polyethylene, propylene copolymers, polybutene, polymethylpentene), ethylene/vinyl acetate copolymer, ethylene/(meth)acrylic acid copolymers, ethylene/(meth)acrylic ester copolymers, ethylene/butene copolymer,
ethylene/hexene copolymer, polyurethane, polyester (e.g., poly(ethylene terephthalate), poly(ethylene naphthalate), poly(butylene terephthalate), and poly(butylene naphthalate)), polyimide, polyamide, polyetherketone, polyether, polyethersulfone, polystyrene, polyvinyl chloride), poly(vinylidene chloride), poly(vinyl alcohol), poly(vinyl acetate), vinyl chloride/vinyl acetate copolymer, and polycarbonate. In one embodiment, the carrier layer is a polyolefin.
[0011] The carrier layer may be one that transmits radiation (e.g., X-ray, ultraviolet, or electron beam) so that the pressure sensitive adhesive layer formed on the carrier layer can be cured by irradiating the pressure sensitive adhesive layer from the carrier side if it is radiation curable.
[0012] The carrier layer can be a single layer or a multilayer construction, and in some embodiments may contain fillers, age resisting agents, antistatic agents, ultraviolet absorbers, antioxidants, plasticizers, flame retardants, or surfactants.
[0013] The pressure sensitive adhesive layer on the earner layer is usually prepared from acrylate and methacrylate monomers. The term (meth)acrylate refers to either or both acrylate or methacrylate. No one particular pressure sensitive adhesive chemistry is preferred and any pressure sensitive adhesive known to those of skill in the art that has good adhesion to the conductive die attach adhesive during dicing and that can be easily and cleanly released afterwards is acceptable.
[0014] Suitable (meth)acrylate monomers include butyl(meth)acrylate, 2-ethyl- hexyl(meth)acrylate, ethyl(meth)acrylate, methyl(meth)acrylate, n-propyl(meth)-acrylate, isopropyl-(meth)acrylate, t-butyl(meth)acrylate, pentyl(meth)acrylate, n-octyl(meth)acrylate, isooctyl-(meth)acrylate, isononyl(meth)acrylate and 2-ethyl-butyl(meth)acrylate.
[0015] (Meth)acrylate functional monomers bearing an additional functional group include the monomers above in which the (meth)acrylate ester also bears one or more substituents selected from a carboxylic acid group, a hydroxyl group, a glycidyl group, an amide group, and an anhydride group. In some embodiments the monomers are (meth)acrylic acid, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, glycidyl
(meth)acrylate, and N-methylol acrylamide.
[0016] For current dicing operations, the thickness of the PSA layer on the dicing tape will be from about 15μηι to 30μηι. For some operations, a thicker layer, for example up to 50μπι may be needed to counteract the unevenness in the conductive die attach adhesive film.
[0017] The conductive die attach adhesive film, which comes into contact with the pressure sensitive adhesive layer of the dicing tape, can be prepared from any suitable adhesive resins used in the art for adhering semiconductor dies to substrates. Examples of such adhesive resins include acrylates, epoxies, oxetanes, and maleimides. The exact composition of the adhesive film is not critical to the invention and can be determined by the practitioner for the particular desired end use. The conductive die attach adhesive film conventionally is prepared by coating the conductive die attach adhesive composition onto a carrier support and heating it to B-stage it to a film. Usually a release liner is mounted over the film to protect it.
[0018] The support carrier and the release liner for the conductive die attach adhesive film can be composed of the same or different materials. One suitable material is product number 8322 from St. Gobain Performance Plastics, which can be used for both the support carrier and the release liner. In general, the B-staging operation causes the adhesive film to adhere more strongly to the carrier support than to the release liner. This differential in release may also be accomplished by choosing a release liner and a carrier support that have a difference in release properties, such that the release liner removes more easily from the adhesive film than the adhesive film removes from the support carrier. EXAMPLE
[0019] A polyolefin carrier (base tape) 80 μηι was coated with an acrylate pressure sensitive adhesive at four levels of thickness, namely, ΙΟμηι, 15μιη, 20μιη, and 30μιη to make four dicing tapes.
[0020] Each of these samples was laminated to a 15μηι thick conductive die attach adhesive film containing epoxy and bismaleimide resins and 92% by weight silver particles. Lamination was performed at temperatures of 65°C and 85°C to make a total of eight laminated composites of dicing tape (PSA and carrier) and conductive die attach adhesive film (on polyolefin carrier).
[0021] Each of the laminated composites was diced (not mounted onto a semiconductor wafer) under the following conditions: spindle speed: 40mm/sec; feed speed: 40K rpm; blade: 27HCBB; cut depth: Z2=65 μιη. (The cut depth was adjusted from the commercial depth to account for the absence of the semiconductor wafer.)
[0022] The die attach adhesive was picked off the dicing tape under the following conditions: 0.5mm needle height; 10msec delay; and at 110°C and 250g pressure for 100msec. The dicing tape was then inspected to determine if any die attach adhesive remained on the pressure sensitive adhesive of the dicing tape.
[0023] The results are shown in Figure 1, which contains optical microscope pictures of the dicing tape after removal of the die attach adhesive. Conductive die attach adhesive film shows as light colored areas 12. The pictures show the following results. When lamination was performed at 65°C, the ΙΟμηι, 15 μη , and 20μιη thick dicing tapes did not compensate for the uneven surface of the conductive die attach adhesive film, and adhesive film was not completely removed from the dicing tape; however, the 30μπι thick dicing tape did release the conductive die attach adhesive film cleanly. When lamination was performed at 85°C, the conductive die attach adhesive film was not completely removed from ίΐιεΐθμιη thick dicing tape, but was removed cleanly from the 15μιη, 20μιη, and 30μπι thick dicing tapes

Claims

1. A dicing tape comprising a carrier and a pressure sensitive adhesive in which the thickness of the pressure sensitive adhesive is 15μηι to 50μηι.
2. A dicing tape comprising a carrier and a pressure sensitive adhesive in which the thickness of the pressure sensitive adhesive is 15μηι to 30μπι.
PCT/US2012/065984 2011-12-15 2012-11-20 Dicing tape for rough surface die attach film WO2013089983A1 (en)

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US201161576049P 2011-12-15 2011-12-15
US61/576,049 2011-12-15

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002235055A (en) * 2001-02-13 2002-08-23 Nitto Denko Corp Dicing pressure-sensitive adhesive sheet
US20060257651A1 (en) * 2005-05-16 2006-11-16 Toshio Shintani Pressure-sensitive adhesive sheet for use in dicing and method of processing products worked with it
US20070120271A1 (en) * 2005-11-29 2007-05-31 Shin-Etsu Chemical Co., Ltd. Dicing and die bonding adhesive tape
JP2008159998A (en) * 2006-12-26 2008-07-10 Nitta Ind Corp Dicing tape
JP2011198797A (en) * 2010-03-17 2011-10-06 Hitachi Chem Co Ltd Die bonding dicing sheet and method of manufacturing semiconductor chip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002235055A (en) * 2001-02-13 2002-08-23 Nitto Denko Corp Dicing pressure-sensitive adhesive sheet
US20060257651A1 (en) * 2005-05-16 2006-11-16 Toshio Shintani Pressure-sensitive adhesive sheet for use in dicing and method of processing products worked with it
US20070120271A1 (en) * 2005-11-29 2007-05-31 Shin-Etsu Chemical Co., Ltd. Dicing and die bonding adhesive tape
JP2008159998A (en) * 2006-12-26 2008-07-10 Nitta Ind Corp Dicing tape
JP2011198797A (en) * 2010-03-17 2011-10-06 Hitachi Chem Co Ltd Die bonding dicing sheet and method of manufacturing semiconductor chip

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