ATE41682T1 - Verfahren zur oberflaechenbehandlung von kupferprodukten. - Google Patents

Verfahren zur oberflaechenbehandlung von kupferprodukten.

Info

Publication number
ATE41682T1
ATE41682T1 AT85114142T AT85114142T ATE41682T1 AT E41682 T1 ATE41682 T1 AT E41682T1 AT 85114142 T AT85114142 T AT 85114142T AT 85114142 T AT85114142 T AT 85114142T AT E41682 T1 ATE41682 T1 AT E41682T1
Authority
AT
Austria
Prior art keywords
copper
base material
copper product
nickel
zinc
Prior art date
Application number
AT85114142T
Other languages
English (en)
Inventor
Kuniki Ueno
Naotomi Takahashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE41682T1 publication Critical patent/ATE41682T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Laminated Bodies (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Golf Clubs (AREA)
  • Dental Preparations (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT85114142T 1984-11-06 1985-11-06 Verfahren zur oberflaechenbehandlung von kupferprodukten. ATE41682T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59233572A JPS61110794A (ja) 1984-11-06 1984-11-06 銅箔の表面処理方法
EP85114142A EP0180981B1 (de) 1984-11-06 1985-11-06 Verfahren zur Oberflächenbehandlung von Kupferprodukten

Publications (1)

Publication Number Publication Date
ATE41682T1 true ATE41682T1 (de) 1989-04-15

Family

ID=16957172

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85114142T ATE41682T1 (de) 1984-11-06 1985-11-06 Verfahren zur oberflaechenbehandlung von kupferprodukten.

Country Status (8)

Country Link
US (1) US4640747A (de)
EP (1) EP0180981B1 (de)
JP (1) JPS61110794A (de)
AT (1) ATE41682T1 (de)
DE (1) DE3569001D1 (de)
ES (1) ES8701857A1 (de)
FI (1) FI81130C (de)
NO (1) NO166729C (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5063117A (en) * 1988-12-27 1991-11-05 The Furukawa Electric Co., Ltd. Copper fin material for heat-exchanger and method of producing the same
JPH02228495A (ja) * 1989-03-01 1990-09-11 Furukawa Electric Co Ltd:The 銅製熱交換器用フィン材とその製造方法
JPH0713319B2 (ja) * 1989-01-30 1995-02-15 古河電気工業株式会社 銅製熱交換器用フィン材とその製造方法
JPH0660435B2 (ja) * 1989-03-01 1994-08-10 古河電気工業株式会社 銅製熱交換器用フィン材とその製造方法
US5022968A (en) * 1990-09-20 1991-06-11 Olin Corporation Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil
US5098796A (en) * 1989-10-13 1992-03-24 Olin Corporation Chromium-zinc anti-tarnish coating on copper foil
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5230932A (en) * 1989-10-13 1993-07-27 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil
JPH0819550B2 (ja) * 1990-06-05 1996-02-28 福田金属箔粉工業株式会社 印刷回路用銅箔の表面処理方法
TW230290B (de) * 1991-11-15 1994-09-11 Nikko Guruder Foreer Kk
JP3292774B2 (ja) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 プリント配線板用銅箔およびその製造方法
US5945010A (en) * 1997-09-02 1999-08-31 Composite Concepts Company, Inc. Electrode wire for use in electric discharge machining and process for preparing same
US6015482A (en) * 1997-12-18 2000-01-18 Circuit Research Corp. Printed circuit manufacturing process using tin-nickel plating
JP3142259B2 (ja) 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP3743702B2 (ja) * 2000-04-28 2006-02-08 三井金属鉱業株式会社 プリント配線板のセミアディティブ製造法
JP2003051673A (ja) * 2001-08-06 2003-02-21 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板
JP4178415B2 (ja) * 2002-07-04 2008-11-12 三井金属鉱業株式会社 キャリア箔付電解銅箔
JP2005344174A (ja) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ
JP2006024902A (ja) * 2004-06-07 2006-01-26 Shinko Electric Ind Co Ltd 極細線パターンを有する配線基板の製造方法および配線基板
ES2811229T3 (es) * 2005-12-01 2021-03-11 Thermocompact Sa Alambre para EDM
KR101318871B1 (ko) * 2008-07-22 2013-10-17 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박 및 동장 적층판
KR101426038B1 (ko) * 2008-11-13 2014-08-01 주식회사 엠디에스 인쇄회로기판 및 그 제조방법
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板
CN102884228B (zh) 2010-05-07 2015-11-25 吉坤日矿日石金属株式会社 印刷电路用铜箔
US9138964B2 (en) * 2010-11-22 2015-09-22 Mitsui Mining & Smelting Co., Ltd Surface-treated copper foil
JP5654416B2 (ja) * 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377259A (en) * 1965-03-15 1968-04-09 Gen Dynamics Corp Method for preventing oxidation degradation of copper by interposing barrier betweencopper and polypropylene
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same
US3857681A (en) * 1971-08-03 1974-12-31 Yates Industries Copper foil treatment and products produced therefrom
JPS5856758B2 (ja) * 1975-12-17 1983-12-16 ミツイアナコンダドウハク カブシキガイシヤ ドウハクヒヨウメンシヨリホウホウ
US4104134A (en) * 1977-08-31 1978-08-01 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for making an aluminum or copper substrate panel for selective absorption of solar energy
US4189331A (en) * 1978-06-22 1980-02-19 Canada Wire And Cable Limited Oxidation resistant barrier coated copper based substrate and method for producing the same
JPS55145396A (en) * 1979-04-27 1980-11-12 Furukawa Circuit Foil Copper foil for printed circuit and method of fabricating same
US4388160A (en) * 1980-02-20 1983-06-14 Rynne George B Zinc-nickel alloy electroplating process
US4268364A (en) * 1980-03-18 1981-05-19 Inco Research & Development Center Inc. Nickel-zinc alloy deposition from a sulfamate bath
US4456508A (en) * 1981-02-26 1984-06-26 Torday & Carlisle Plc Treatment of copper foil
JPS6012434B2 (ja) * 1981-08-21 1985-04-01 荏原ユ−ジライト株式会社 亜鉛−ニツケル合金電気めつき液
WO1983002538A1 (en) * 1982-01-04 1983-07-21 Gen Electric Electroplated augmentative replacement processed conductors and manufacture thereof
EP0100777A1 (de) * 1982-08-10 1984-02-22 The Dow Chemical Company Verfahren zum Elektroplattieren von Metallteilen
EP0112635B1 (de) * 1982-12-01 1987-04-22 Electrofoils Technology Limited Behandlung einer Kupferfolie
US4572768A (en) * 1985-06-28 1986-02-25 Square D Company Treatment for copper foil

Also Published As

Publication number Publication date
ES548541A0 (es) 1986-12-01
JPH0447038B2 (de) 1992-07-31
DE3569001D1 (en) 1989-04-27
EP0180981A1 (de) 1986-05-14
NO166729B (no) 1991-05-21
FI854281A0 (fi) 1985-10-31
FI854281A (fi) 1986-05-07
NO854402L (no) 1986-05-07
ES8701857A1 (es) 1986-12-01
JPS61110794A (ja) 1986-05-29
EP0180981B1 (de) 1989-03-22
NO166729C (no) 1991-08-28
US4640747A (en) 1987-02-03
FI81130B (fi) 1990-05-31
FI81130C (fi) 1990-09-10

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee