ATE384335T1 - Chipbefestigung - Google Patents

Chipbefestigung

Info

Publication number
ATE384335T1
ATE384335T1 AT04740528T AT04740528T ATE384335T1 AT E384335 T1 ATE384335 T1 AT E384335T1 AT 04740528 T AT04740528 T AT 04740528T AT 04740528 T AT04740528 T AT 04740528T AT E384335 T1 ATE384335 T1 AT E384335T1
Authority
AT
Austria
Prior art keywords
adhesive layer
carrier tape
die
singulated
cured
Prior art date
Application number
AT04740528T
Other languages
English (en)
Inventor
Adrian Boyle
David Gillen
Maria Farsari
Original Assignee
Xsil Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xsil Technology Ltd filed Critical Xsil Technology Ltd
Application granted granted Critical
Publication of ATE384335T1 publication Critical patent/ATE384335T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/11—Separation of active layers from substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Dicing (AREA)
  • Die Bonding (AREA)
  • Laser Beam Processing (AREA)
  • Light Receiving Elements (AREA)
AT04740528T 2003-07-03 2004-07-01 Chipbefestigung ATE384335T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0315623A GB2404280B (en) 2003-07-03 2003-07-03 Die bonding

Publications (1)

Publication Number Publication Date
ATE384335T1 true ATE384335T1 (de) 2008-02-15

Family

ID=27741543

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04740528T ATE384335T1 (de) 2003-07-03 2004-07-01 Chipbefestigung

Country Status (11)

Country Link
US (1) US7989320B2 (de)
EP (1) EP1642332B1 (de)
JP (1) JP4625804B2 (de)
KR (1) KR101167894B1 (de)
CN (1) CN1816908B (de)
AT (1) ATE384335T1 (de)
DE (1) DE602004011343T2 (de)
GB (1) GB2404280B (de)
MY (1) MY141475A (de)
TW (1) TWI245376B (de)
WO (1) WO2005004226A1 (de)

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AU2003211763A1 (en) 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method for dicing substrate
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US10607861B2 (en) 2017-11-28 2020-03-31 Nxp B.V. Die separation using adhesive-layer laser scribing
US10727219B2 (en) 2018-02-15 2020-07-28 Invensas Bonding Technologies, Inc. Techniques for processing devices
US11742314B2 (en) 2020-03-31 2023-08-29 Adeia Semiconductor Bonding Technologies Inc. Reliable hybrid bonded apparatus
US12550799B2 (en) 2021-03-31 2026-02-10 Adeia Semiconductor Bonding Technologies Inc. Direct bonding methods and structures
CN113784513A (zh) * 2021-08-10 2021-12-10 信维通信（江苏）有限公司 一种线路板成型方法
US12604771B2 (en) 2021-10-28 2026-04-14 Adeia Semiconductor Bonding Technologies Inc. Direct bonding methods and structures

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Also Published As

Publication number Publication date
DE602004011343T2 (de) 2008-12-24
CN1816908B (zh) 2010-06-16
KR20060023196A (ko) 2006-03-13
WO2005004226A1 (en) 2005-01-13
WO2005004226B1 (en) 2005-03-03
TW200504948A (en) 2005-02-01
KR101167894B1 (ko) 2012-07-30
EP1642332A1 (de) 2006-04-05
TWI245376B (en) 2005-12-11
DE602004011343D1 (de) 2008-03-06
GB0315623D0 (en) 2003-08-13
GB2404280B (en) 2006-09-27
MY141475A (en) 2010-04-30
CN1816908A (zh) 2006-08-09
JP4625804B2 (ja) 2011-02-02
US20070224733A1 (en) 2007-09-27
US7989320B2 (en) 2011-08-02
JP2009514185A (ja) 2009-04-02
GB2404280A (en) 2005-01-26
EP1642332B1 (de) 2008-01-16

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