ATE496104T1 - B-zustandsklebstoff für die chipverklebung - Google Patents

B-zustandsklebstoff für die chipverklebung

Info

Publication number
ATE496104T1
ATE496104T1 AT03786906T AT03786906T ATE496104T1 AT E496104 T1 ATE496104 T1 AT E496104T1 AT 03786906 T AT03786906 T AT 03786906T AT 03786906 T AT03786906 T AT 03786906T AT E496104 T1 ATE496104 T1 AT E496104T1
Authority
AT
Austria
Prior art keywords
chip bonding
adhesives
condition adhesive
methods
adhesive
Prior art date
Application number
AT03786906T
Other languages
English (en)
Inventor
Deborah Forray
Puwei Liu
Santos Benedicto P Delos
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Application granted granted Critical
Publication of ATE496104T1 publication Critical patent/ATE496104T1/de

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    • H01—ELECTRIC ELEMENTS
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/31504—Composite [nonstructural laminate]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dental Preparations (AREA)
AT03786906T 2002-11-25 2003-11-20 B-zustandsklebstoff für die chipverklebung ATE496104T1 (de)

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WO2005056675A1 (en) * 2003-11-21 2005-06-23 Lord Corporation Dual-stage wafer applied underfills
CN102604591A (zh) * 2004-03-19 2012-07-25 住友电木株式会社 树脂组合物及采用该树脂组合物制作的半导体装置
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US7795362B2 (en) * 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
KR101191370B1 (ko) * 2005-04-04 2012-10-15 헨켈 아게 운트 코. 카게아아 방사선 경화성 건조제-충전 접착제/밀봉제
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US7176044B2 (en) 2007-02-13
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US20040102566A1 (en) 2004-05-27

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