ATE477313T1 - Klebefilm für chipbondierung - Google Patents
Klebefilm für chipbondierungInfo
- Publication number
- ATE477313T1 ATE477313T1 AT07016822T AT07016822T ATE477313T1 AT E477313 T1 ATE477313 T1 AT E477313T1 AT 07016822 T AT07016822 T AT 07016822T AT 07016822 T AT07016822 T AT 07016822T AT E477313 T1 ATE477313 T1 AT E477313T1
- Authority
- AT
- Austria
- Prior art keywords
- adhesive film
- layer
- chip bonding
- dicing
- adhesive
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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- C09J2409/00—Presence of diene rubber
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- C—CHEMISTRY; METALLURGY
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/514,556 US20070003758A1 (en) | 2004-04-01 | 2006-08-31 | Dicing die bonding film |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE477313T1 true ATE477313T1 (de) | 2010-08-15 |
Family
ID=38606678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07016822T ATE477313T1 (de) | 2006-08-31 | 2007-08-28 | Klebefilm für chipbondierung |
Country Status (10)
Country | Link |
---|---|
US (1) | US20070003758A1 (de) |
EP (1) | EP1894980B1 (de) |
JP (1) | JP2008060580A (de) |
KR (1) | KR101378486B1 (de) |
CN (1) | CN101134878B (de) |
AT (1) | ATE477313T1 (de) |
DE (1) | DE602007008330D1 (de) |
PT (1) | PT1894980E (de) |
SG (1) | SG140578A1 (de) |
TW (1) | TWI414011B (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
US20060263596A1 (en) * | 2005-05-06 | 2006-11-23 | Bamborough Derek W | Pressure sensitive adhesives (PSA) laminates |
US20060251890A1 (en) * | 2005-05-06 | 2006-11-09 | Richard Lane | Pressure sensitive adhesive (PSA) laminates |
US20100019365A1 (en) * | 2006-09-12 | 2010-01-28 | Nitto Denko Corporation | Dicing/die bonding film |
US20100317155A1 (en) * | 2007-02-09 | 2010-12-16 | Byoung-Un Kang | Multifunctional die attachment film and semiconductor packaging using the same |
WO2008108131A1 (ja) | 2007-03-01 | 2008-09-12 | Nitto Denko Corporation | 熱硬化型ダイボンドフィルム |
KR100994963B1 (ko) * | 2008-01-10 | 2010-11-18 | 엘지이노텍 주식회사 | 에폭시-고무 부가 생성물을 포함한 다이 접착용 페이스트조성물 |
US20110018127A1 (en) * | 2008-03-31 | 2011-01-27 | Byoungchul Lee | Multilayer UV-Curable Adhesive Film |
FR2945151B1 (fr) * | 2009-04-30 | 2011-04-29 | Commissariat Energie Atomique | Procede de fixation d'un composant electronique sur un produit |
KR101359831B1 (ko) * | 2009-05-13 | 2014-02-07 | 히타치가세이가부시끼가이샤 | 접착 시트 |
JP2011060848A (ja) * | 2009-09-07 | 2011-03-24 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置 |
CN201504964U (zh) * | 2009-09-11 | 2010-06-16 | 王广河 | 挂钩 |
JP5143196B2 (ja) * | 2009-09-28 | 2013-02-13 | 日東電工株式会社 | 半導体装置用フィルム |
CN102198671A (zh) * | 2010-03-25 | 2011-09-28 | 毅嘉科技股份有限公司 | 按键集料治具 |
US8299187B1 (en) * | 2010-06-11 | 2012-10-30 | The United States Of America As Represented By The Secretary Of The Navy | Method for improving acoustic impedance of epoxy resins |
JP5161284B2 (ja) * | 2010-10-14 | 2013-03-13 | 電気化学工業株式会社 | 電子部品の製造方法 |
KR101351622B1 (ko) * | 2010-12-29 | 2014-01-15 | 제일모직주식회사 | 다이싱 다이 본딩 필름 |
JP5456807B2 (ja) * | 2012-02-08 | 2014-04-02 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
US9554674B2 (en) | 2013-10-08 | 2017-01-31 | Liberty Hardware Mfg. Corp. | Shower rod mounting assembly |
EP3098277A1 (de) | 2015-05-27 | 2016-11-30 | Henkel AG & Co. KGaA | Vorgeschnittene folie und herstellungsverfahren dafür |
CN107750386B (zh) * | 2015-07-03 | 2021-09-14 | 三井化学东赛璐株式会社 | 半导体晶片表面保护膜以及半导体装置的制造方法 |
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DE3581514D1 (de) * | 1984-05-29 | 1991-02-28 | Mitsui Toatsu Chemicals | Film zur behandlung von halbleiterwaffeln. |
JPH04196246A (ja) * | 1990-11-27 | 1992-07-16 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
US5762744A (en) * | 1991-12-27 | 1998-06-09 | Rohm Co., Ltd. | Method of producing a semiconductor device using an expand tape |
JPH05179211A (ja) * | 1991-12-30 | 1993-07-20 | Nitto Denko Corp | ダイシング・ダイボンドフイルム |
US6717242B2 (en) * | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
TW310481B (de) * | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
TWI332521B (en) * | 2000-03-31 | 2010-11-01 | Hitachi Chemical Co Ltd | Adhesive films for semiconductor |
KR20010097790A (ko) * | 2000-04-26 | 2001-11-08 | 안용국 | 웨이퍼 칩 제조공정 |
WO2003018703A1 (fr) * | 2001-08-27 | 2003-03-06 | Hitachi Chemical Co., Ltd. | Feuille adhesive et dispositif semi-conducteur; procede de fabrication |
JP2003142505A (ja) * | 2001-10-31 | 2003-05-16 | Lintec Corp | ウエハダイシング・接着用シートおよび半導体装置の製造方法 |
JP4067308B2 (ja) * | 2002-01-15 | 2008-03-26 | リンテック株式会社 | ウエハダイシング・接着用シートおよび半導体装置の製造方法 |
JP2004095844A (ja) | 2002-08-30 | 2004-03-25 | Lintec Corp | ウエハダイシング・接着用シートおよび半導体装置の製造方法 |
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
US20050227064A1 (en) * | 2004-04-01 | 2005-10-13 | Hwail Jin | Dicing die bonding film |
JP4597910B2 (ja) * | 2005-06-03 | 2010-12-15 | エルエス ケーブル リミテッド | 半導体用ダイシングダイ接着フィルム |
-
2006
- 2006-08-31 US US11/514,556 patent/US20070003758A1/en not_active Abandoned
-
2007
- 2007-08-28 EP EP07016822A patent/EP1894980B1/de not_active Not-in-force
- 2007-08-28 AT AT07016822T patent/ATE477313T1/de not_active IP Right Cessation
- 2007-08-28 PT PT07016822T patent/PT1894980E/pt unknown
- 2007-08-28 DE DE602007008330T patent/DE602007008330D1/de active Active
- 2007-08-29 CN CN2007101477770A patent/CN101134878B/zh not_active Expired - Fee Related
- 2007-08-30 TW TW096132166A patent/TWI414011B/zh not_active IP Right Cessation
- 2007-08-30 SG SG200706372-0A patent/SG140578A1/en unknown
- 2007-08-30 KR KR1020070087561A patent/KR101378486B1/ko active IP Right Grant
- 2007-08-30 JP JP2007223745A patent/JP2008060580A/ja active Pending
Also Published As
Publication number | Publication date |
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CN101134878B (zh) | 2013-08-14 |
KR101378486B1 (ko) | 2014-04-10 |
EP1894980A1 (de) | 2008-03-05 |
JP2008060580A (ja) | 2008-03-13 |
US20070003758A1 (en) | 2007-01-04 |
DE602007008330D1 (de) | 2010-09-23 |
KR20080021541A (ko) | 2008-03-07 |
EP1894980B1 (de) | 2010-08-11 |
CN101134878A (zh) | 2008-03-05 |
SG140578A1 (en) | 2008-03-28 |
PT1894980E (pt) | 2010-09-02 |
TW200830394A (en) | 2008-07-16 |
TWI414011B (zh) | 2013-11-01 |
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