ATE383404T1 - Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode - Google Patents

Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode

Info

Publication number
ATE383404T1
ATE383404T1 AT03725638T AT03725638T ATE383404T1 AT E383404 T1 ATE383404 T1 AT E383404T1 AT 03725638 T AT03725638 T AT 03725638T AT 03725638 T AT03725638 T AT 03725638T AT E383404 T1 ATE383404 T1 AT E383404T1
Authority
AT
Austria
Prior art keywords
curing product
curable composition
curing
emitting diode
light emitting
Prior art date
Application number
AT03725638T
Other languages
German (de)
English (en)
Inventor
Manabu Tsumura
Masahito Ide
Katsuya Ouchi
Masafumi Kuramoto
Tomohide Miki
Ikuya Nii
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Application granted granted Critical
Publication of ATE383404T1 publication Critical patent/ATE383404T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/42Introducing metal atoms or metal-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54Nitrogen-containing linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10Block- or graft-copolymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT03725638T 2002-04-26 2003-04-23 Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode ATE383404T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002125947 2002-04-26
JP2002133412 2002-05-09
JP2002135022 2002-05-10
JP2002225189 2002-08-01
JP2003026649 2003-02-04

Publications (1)

Publication Number Publication Date
ATE383404T1 true ATE383404T1 (de) 2008-01-15

Family

ID=29273849

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03725638T ATE383404T1 (de) 2002-04-26 2003-04-23 Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode

Country Status (9)

Country Link
US (1) US7371462B2 (enExample)
EP (1) EP1505121B1 (enExample)
KR (1) KR100969175B1 (enExample)
CN (1) CN100338141C (enExample)
AT (1) ATE383404T1 (enExample)
CA (1) CA2483510A1 (enExample)
DE (1) DE60318570T2 (enExample)
TW (1) TW200307726A (enExample)
WO (1) WO2003091338A1 (enExample)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100806553B1 (ko) * 2000-12-27 2008-02-27 카네카 코포레이션 경화제, 경화성 조성물, 광학 소재용 조성물, 광학 소재, 이의 제조 방법 및 이를 사용하여 만들어진 액정표시장치 및 led
MY151065A (en) * 2003-02-25 2014-03-31 Kaneka Corp Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
JP4009581B2 (ja) * 2003-11-18 2007-11-14 オリンパス株式会社 カプセル型医療システム
DE102005009066A1 (de) 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
JP2007091960A (ja) * 2005-09-30 2007-04-12 Nitto Denko Corp 光半導体素子封止用樹脂組成物およびそれを用いて得られる光半導体装置
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
KR101017188B1 (ko) * 2005-12-26 2011-02-25 가부시키가이샤 가네카 경화성 조성물
CN100448905C (zh) * 2006-03-17 2009-01-07 中国科学院广州化学研究所 含有8-羟基喹啉金属配合物的高聚物分子杂化发光材料及其制备方法
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
US8084765B2 (en) * 2007-05-07 2011-12-27 Xerox Corporation Electronic device having a dielectric layer
US9024455B2 (en) 2010-05-26 2015-05-05 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
CN103145751B (zh) * 2007-11-09 2016-06-08 株式会社钟化 环状聚有机硅氧烷的制备方法、固化剂、固化性组合物及其固化物
US9464172B2 (en) * 2007-12-10 2016-10-11 Kaneka Corporation Alkali-developable curable composition, insulating thin film using the same, and thin film transistor
CN101538367B (zh) * 2008-01-28 2013-09-04 信越化学工业株式会社 二缩水甘油基异氰尿酸基改性有机聚硅氧烷以及含有该有机聚硅氧烷的组成物
GB0805495D0 (en) * 2008-03-26 2008-04-30 Sun Chemical Bv An ink jet-printable composition and a masking process
JP5471180B2 (ja) * 2008-09-11 2014-04-16 信越化学工業株式会社 シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びled装置
JP5555170B2 (ja) * 2008-10-02 2014-07-23 株式会社カネカ 光硬化性組成物および硬化物
EP2196503B1 (en) * 2008-12-12 2015-02-18 Nitto Denko Corporation Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereof
TWI579995B (zh) * 2009-08-19 2017-04-21 精材科技股份有限公司 晶片封裝體及其製造方法
JP2011057755A (ja) * 2009-09-07 2011-03-24 Shin-Etsu Chemical Co Ltd シリコーン組成物及びその硬化物
JP5340191B2 (ja) * 2010-02-02 2013-11-13 日東電工株式会社 光半導体装置
JP5380325B2 (ja) * 2010-02-18 2014-01-08 日東電工株式会社 光半導体素子封止用熱硬化性樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置
EP2545103B1 (en) 2010-03-09 2016-09-14 University Of Virginia Patent Foundation Viscoelastic silicone rubber compositions
KR101411814B1 (ko) * 2010-03-23 2014-06-24 도카이 고무 고교 가부시키가이샤 도전성 가교체, 및 그 제조 방법, 그리고 그것을 사용한 트랜스듀서, 플렉시블 배선판, 전자파 시일드
JP5844252B2 (ja) 2010-04-02 2016-01-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
KR101763975B1 (ko) * 2010-05-07 2017-08-01 스미토모 베이클리트 컴퍼니 리미티드 회로 기판용 에폭시 수지 조성물, 프리프레그, 적층판, 수지 시트, 프린트 배선판용 적층기재, 프린트 배선판, 및 반도체 장치
CN102453327A (zh) * 2010-10-27 2012-05-16 3M新设资产公司 具有高折射率的聚硅氧树脂组合物
JP2012191062A (ja) * 2011-03-11 2012-10-04 Toshiba Corp 半導体装置
CN103415585B (zh) * 2011-03-16 2015-04-29 迪睿合电子材料有限公司 反光性各向异性导电粘接剂及发光装置
WO2013023174A1 (en) 2011-08-10 2013-02-14 University Of Virginia Patent Foundation Viscoelastic silicone rubber compositions
JP5912600B2 (ja) * 2011-09-16 2016-04-27 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
JP2013159671A (ja) * 2012-02-02 2013-08-19 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
US20150041846A1 (en) * 2012-03-28 2015-02-12 Daicel Corporation Curable epoxy resin composition
JP5958107B2 (ja) * 2012-06-15 2016-07-27 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
CN102942895B (zh) * 2012-11-15 2016-03-02 烟台德邦科技有限公司 一种导热电子灌封胶及其制备方法
US20160244540A1 (en) * 2013-09-27 2016-08-25 Rimtec Corporation Norbornene cross-linked polymer and method for producing same
JP6384046B2 (ja) * 2013-12-06 2018-09-05 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
WO2015106438A1 (en) * 2014-01-17 2015-07-23 Henkel (China) Company Limited Curable composition for optical semiconductor devices
US10968318B2 (en) * 2017-12-30 2021-04-06 Saint-Gobain Performance Plastics Corporation Heterochain polymer composition
CN109810669B (zh) * 2018-12-28 2021-07-16 广州市高士实业有限公司 一种聚硅树脂及其制备方法和应用
CN114616282A (zh) 2019-10-30 2022-06-10 三键有限公司 树脂组合物
CN112979961B (zh) * 2019-12-17 2022-11-04 中蓝晨光化工研究设计院有限公司 一种大分子类硅橡胶增粘剂的制备方法
US12415923B2 (en) * 2020-08-06 2025-09-16 Dow Tray Co., Ltd. Curable silicone composition and cured product of same
CN112266571A (zh) * 2020-10-26 2021-01-26 东莞市鑫聚光电科技股份有限公司 一种pdlc调光膜
EP4696726A1 (en) * 2023-09-22 2026-02-18 Kolon Industries, Inc. Curing composition and curable composition comprising same
CN121248943B (zh) * 2025-12-03 2026-03-27 宁波聚力新材料科技有限公司 一种硅橡胶增粘剂及其制备方法和应用

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH529769A (fr) 1971-04-16 1972-10-31 Rephamac Ag Procédé de préparation d'acides désoxyribonucléiques à poids moléculaire élevé
JPS5756492B2 (enExample) * 1973-05-02 1982-11-30
JPS59155483A (ja) 1983-02-25 1984-09-04 Toshiba Silicone Co Ltd 表面硬化性シリコ−ンシ−リング材組成物
JPH0623256B2 (ja) * 1989-03-28 1994-03-30 信越化学工業株式会社 ゴム組成物用シリコーン変性加硫助剤及びその製造方法
US4943601A (en) * 1989-04-03 1990-07-24 General Electric Company Coating with improved adhesion
JPH07119396B2 (ja) 1990-02-27 1995-12-20 信越化学工業株式会社 接着性オルガノポリシロキサン組成物及びその硬化物
JP3268801B2 (ja) 1991-11-22 2002-03-25 ジーイー東芝シリコーン株式会社 シリコーンゴム組成物およびシリコーンゴム加工布
JP3354973B2 (ja) 1992-10-06 2002-12-09 鐘淵化学工業株式会社 硬化性組成物
JP2875758B2 (ja) 1994-12-28 1999-03-31 東芝シリコーン株式会社 粘着シート
JPH0912892A (ja) * 1995-07-04 1997-01-14 Toray Dow Corning Silicone Co Ltd 現場成形ガスケット用シリコーンゴム組成物
JPH09291214A (ja) * 1996-04-25 1997-11-11 Nippon Paint Co Ltd 硬化性樹脂組成物及びその硬化物
JP3571144B2 (ja) * 1996-05-29 2004-09-29 鐘淵化学工業株式会社 硬化性組成物
JP2000124475A (ja) * 1998-10-14 2000-04-28 Kanegafuchi Chem Ind Co Ltd 光半導体封止材用硬化性組成物及び光半導体製品の製造方法
JP4993806B2 (ja) * 2000-04-21 2012-08-08 株式会社カネカ 光学材料用組成物、光学用材料、その製造方法およびそれを用いた液晶表示装置
CN1192061C (zh) 2000-04-21 2005-03-09 钟渊化学工业株式会社 固化性组合物、光学材料用组合物、光学材料、液晶显示装置、透明导电性膜及其制造方法
JP4782279B2 (ja) 2000-12-26 2011-09-28 株式会社カネカ 封止剤、半導体等の封止方法、半導体装置の製造方法、および半導体装置
KR100806553B1 (ko) * 2000-12-27 2008-02-27 카네카 코포레이션 경화제, 경화성 조성물, 광학 소재용 조성물, 광학 소재, 이의 제조 방법 및 이를 사용하여 만들어진 액정표시장치 및 led
JP2002235005A (ja) 2001-02-09 2002-08-23 Kanegafuchi Chem Ind Co Ltd 光学用材料用組成物、光学用材料およびその製造方法
JP4275889B2 (ja) * 2001-02-09 2009-06-10 株式会社カネカ 発光ダイオード及びその製造方法
JP4066229B2 (ja) 2001-02-14 2008-03-26 株式会社カネカ 硬化剤、硬化性組成物、光学材料用組成物、光学材料、その製造方法、並びに、それを用いた液晶表示装置及びled
JP4037125B2 (ja) 2001-02-23 2008-01-23 株式会社カネカ 発光ダイオード及びその製造方法
JP3910080B2 (ja) * 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
JP2003113310A (ja) 2001-10-05 2003-04-18 Kanegafuchi Chem Ind Co Ltd 光学材料用組成物、電子材料用組成物、光学材料、電子材料、発光ダイオード及びその製造方法
JP2003128921A (ja) 2001-10-17 2003-05-08 Kanegafuchi Chem Ind Co Ltd 熱硬化性樹脂組成物及び熱硬化性樹脂フィルム、それを用いてなる金属箔積層体

Also Published As

Publication number Publication date
CA2483510A1 (en) 2003-11-06
DE60318570D1 (de) 2008-02-21
CN1649964A (zh) 2005-08-03
US7371462B2 (en) 2008-05-13
WO2003091338A1 (fr) 2003-11-06
CN100338141C (zh) 2007-09-19
DE60318570T2 (de) 2009-01-08
KR20050007343A (ko) 2005-01-17
EP1505121A4 (en) 2006-04-12
TWI336345B (enExample) 2011-01-21
US20050209400A1 (en) 2005-09-22
EP1505121A1 (en) 2005-02-09
EP1505121B1 (en) 2008-01-09
KR100969175B1 (ko) 2010-07-14
TW200307726A (en) 2003-12-16

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