ATE383404T1 - Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode - Google Patents

Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode

Info

Publication number
ATE383404T1
ATE383404T1 AT03725638T AT03725638T ATE383404T1 AT E383404 T1 ATE383404 T1 AT E383404T1 AT 03725638 T AT03725638 T AT 03725638T AT 03725638 T AT03725638 T AT 03725638T AT E383404 T1 ATE383404 T1 AT E383404T1
Authority
AT
Austria
Prior art keywords
curing product
curable composition
curing
emitting diode
light emitting
Prior art date
Application number
AT03725638T
Other languages
English (en)
Inventor
Manabu Tsumura
Masahito Ide
Katsuya Ouchi
Masafumi Kuramoto
Tomohide Miki
Ikuya Nii
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Application granted granted Critical
Publication of ATE383404T1 publication Critical patent/ATE383404T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/42—Introducing metal atoms or metal-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54—Nitrogen-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
AT03725638T 2002-04-26 2003-04-23 Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode ATE383404T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002125947 2002-04-26
JP2002133412 2002-05-09
JP2002135022 2002-05-10
JP2002225189 2002-08-01
JP2003026649 2003-02-04

Publications (1)

Publication Number Publication Date
ATE383404T1 true ATE383404T1 (de) 2008-01-15

Family

ID=29273849

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03725638T ATE383404T1 (de) 2002-04-26 2003-04-23 Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode

Country Status (9)

Country Link
US (1) US7371462B2 (de)
EP (1) EP1505121B1 (de)
KR (1) KR100969175B1 (de)
CN (1) CN100338141C (de)
AT (1) ATE383404T1 (de)
CA (1) CA2483510A1 (de)
DE (1) DE60318570T2 (de)
TW (1) TW200307726A (de)
WO (1) WO2003091338A1 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100338142C (zh) * 2000-12-27 2007-09-19 钟渊化学工业株式会社 固化剂、可固化组合物、光学材料用组合物、光学材料、它们的生产方法、和使用该材料制得的液晶显示器和发光二极管
TW200502372A (en) 2003-02-25 2005-01-16 Kaneka Corp Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
JP4009581B2 (ja) * 2003-11-18 2007-11-14 オリンパス株式会社 カプセル型医療システム
DE102005009066A1 (de) * 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
JP2007091960A (ja) * 2005-09-30 2007-04-12 Nitto Denko Corp 光半導体素子封止用樹脂組成物およびそれを用いて得られる光半導体装置
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
WO2007074813A1 (ja) * 2005-12-26 2007-07-05 Kaneka Corporation 硬化性組成物
CN100448905C (zh) * 2006-03-17 2009-01-07 中国科学院广州化学研究所 含有8-羟基喹啉金属配合物的高聚物分子杂化发光材料及其制备方法
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US8084765B2 (en) * 2007-05-07 2011-12-27 Xerox Corporation Electronic device having a dielectric layer
US9024455B2 (en) 2010-05-26 2015-05-05 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
EP2216336B1 (de) 2007-11-09 2015-11-04 Kaneka Corporation Verfahren zur herstellung von zyklischem polyorganosiloxan, härtemittel, härtbare zusammensetzung und härteprodukt aus der härtbaren zusammensetzung
CN101896537B (zh) * 2007-12-10 2012-10-24 株式会社钟化 具有碱显影性的固化性组合物、使用该组合物的绝缘性薄膜以及薄膜晶体管
CN101538367B (zh) * 2008-01-28 2013-09-04 信越化学工业株式会社 二缩水甘油基异氰尿酸基改性有机聚硅氧烷以及含有该有机聚硅氧烷的组成物
GB0805495D0 (en) * 2008-03-26 2008-04-30 Sun Chemical Bv An ink jet-printable composition and a masking process
JP5471180B2 (ja) * 2008-09-11 2014-04-16 信越化学工業株式会社 シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びｌｅｄ装置
EP2343326B1 (de) * 2008-10-02 2018-08-15 Kaneka Corporation Lichthärtbare zusammensetzung und gehärtetes produkt
EP2196503B1 (de) * 2008-12-12 2015-02-18 Nitto Denko Corporation Wärmehärtende Silikonharzzusammensetzung, Silikonharz, Silikonharzfolie und Verwendung dafür
TWI579995B (zh) * 2009-08-19 2017-04-21 Xintex Inc 晶片封裝體及其製造方法
JP2011057755A (ja) * 2009-09-07 2011-03-24 Shin-Etsu Chemical Co Ltd シリコーン組成物及びその硬化物
JP5340191B2 (ja) * 2010-02-02 2013-11-13 日東電工株式会社 光半導体装置
JP5380325B2 (ja) * 2010-02-18 2014-01-08 日東電工株式会社 光半導体素子封止用熱硬化性樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置
US8785507B2 (en) 2010-03-09 2014-07-22 University Of Virginia Patent Foundation Viscoelastic silicon rubber compositions
US9051446B2 (en) * 2010-03-23 2015-06-09 Sumitomo Riko Company Limited Conductive crosslinked body and production process thereof, and transducer, flexible wiring board and electromagnetic wave shield using the conductive crosslinked body
JP5844252B2 (ja) 2010-04-02 2016-01-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
US20130037310A1 (en) * 2010-05-07 2013-02-14 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for circuit board, prepreg, laminate, resin sheet, laminated base material for printed wiring board, printed wiring board, and semiconductor device
CN102453327A (zh) * 2010-10-27 2012-05-16 3M新设资产公司 具有高折射率的聚硅氧树脂组合物
JP2012191062A (ja) * 2011-03-11 2012-10-04 Toshiba Corp 半導体装置
CN103415585B (zh) * 2011-03-16 2015-04-29 迪睿合电子材料有限公司 反光性各向异性导电粘接剂及发光装置
WO2013023174A1 (en) 2011-08-10 2013-02-14 University Of Virginia Patent Foundation Viscoelastic silicone rubber compositions
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
JP5912600B2 (ja) * 2011-09-16 2016-04-27 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP2013159671A (ja) * 2012-02-02 2013-08-19 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN104204022B (zh) * 2012-03-28 2016-08-31 株式会社大赛璐 固化性环氧树脂组合物
JP5958107B2 (ja) 2012-06-15 2016-07-27 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
CN102942895B (zh) * 2012-11-15 2016-03-02 烟台德邦科技有限公司 一种导热电子灌封胶及其制备方法
WO2015046028A1 (ja) * 2013-09-27 2015-04-02 Rimtec株式会社 ノルボルネン系架橋重合体およびその製造方法
JP6384046B2 (ja) * 2013-12-06 2018-09-05 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
KR102211608B1 (ko) * 2014-01-17 2021-02-02 헨켈 아게 운트 코. 카게아아 광학 반도체 소자용 경화성 조성물
CN111527131B (zh) * 2017-12-30 2022-09-27 美国圣戈班性能塑料公司 杂链聚合物组合物
CN109810669B (zh) * 2018-12-28 2021-07-16 广州市高士实业有限公司 一种聚硅树脂及其制备方法和应用
CN112979961B (zh) * 2019-12-17 2022-11-04 中蓝晨光化工研究设计院有限公司 一种大分子类硅橡胶增粘剂的制备方法
CN112266571A (zh) * 2020-10-26 2021-01-26 东莞市鑫聚光电科技股份有限公司 一种pdlc调光膜

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH529769A (fr) 1971-04-16 1972-10-31 Rephamac Ag Procédé de préparation d'acides désoxyribonucléiques à poids moléculaire élevé
JPS5756492B2 (de) * 1973-05-02 1982-11-30
JPS59155483A (ja) 1983-02-25 1984-09-04 Toshiba Silicone Co Ltd 表面硬化性シリコ−ンシ−リング材組成物
JPH0623256B2 (ja) * 1989-03-28 1994-03-30 信越化学工業株式会社 ゴム組成物用シリコーン変性加硫助剤及びその製造方法
US4943601A (en) * 1989-04-03 1990-07-24 General Electric Company Coating with improved adhesion
JPH07119396B2 (ja) * 1990-02-27 1995-12-20 信越化学工業株式会社 接着性オルガノポリシロキサン組成物及びその硬化物
JP3268801B2 (ja) 1991-11-22 2002-03-25 ジーイー東芝シリコーン株式会社 シリコーンゴム組成物およびシリコーンゴム加工布
JP3354973B2 (ja) 1992-10-06 2002-12-09 鐘淵化学工業株式会社 硬化性組成物
JP2875758B2 (ja) 1994-12-28 1999-03-31 東芝シリコーン株式会社 粘着シート
JPH0912892A (ja) * 1995-07-04 1997-01-14 Toray Dow Corning Silicone Co Ltd 現場成形ガスケット用シリコーンゴム組成物
JPH09291214A (ja) 1996-04-25 1997-11-11 Nippon Paint Co Ltd 硬化性樹脂組成物及びその硬化物
JP3571144B2 (ja) * 1996-05-29 2004-09-29 鐘淵化学工業株式会社 硬化性組成物
JP2000124475A (ja) * 1998-10-14 2000-04-28 Kanegafuchi Chem Ind Co Ltd 光半導体封止材用硬化性組成物及び光半導体製品の製造方法
TW526241B (en) 2000-04-21 2003-04-01 Kaneka Corp Curable composition, composition for optical material, optical material, liquid crystal display device, transparent conductive film, and method for producing the same
JP4993806B2 (ja) * 2000-04-21 2012-08-08 株式会社カネカ 光学材料用組成物、光学用材料、その製造方法およびそれを用いた液晶表示装置
JP4782279B2 (ja) * 2000-12-26 2011-09-28 株式会社カネカ 封止剤、半導体等の封止方法、半導体装置の製造方法、および半導体装置
CN100338142C (zh) * 2000-12-27 2007-09-19 钟渊化学工业株式会社 固化剂、可固化组合物、光学材料用组合物、光学材料、它们的生产方法、和使用该材料制得的液晶显示器和发光二极管
JP2002235005A (ja) * 2001-02-09 2002-08-23 Kanegafuchi Chem Ind Co Ltd 光学用材料用組成物、光学用材料およびその製造方法
JP4275889B2 (ja) * 2001-02-09 2009-06-10 株式会社カネカ 発光ダイオード及びその製造方法
JP4066229B2 (ja) * 2001-02-14 2008-03-26 株式会社カネカ 硬化剤、硬化性組成物、光学材料用組成物、光学材料、その製造方法、並びに、それを用いた液晶表示装置及びｌｅｄ
JP3910080B2 (ja) * 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
JP4037125B2 (ja) * 2001-02-23 2008-01-23 株式会社カネカ 発光ダイオード及びその製造方法
JP2003113310A (ja) 2001-10-05 2003-04-18 Kanegafuchi Chem Ind Co Ltd 光学材料用組成物、電子材料用組成物、光学材料、電子材料、発光ダイオード及びその製造方法
JP2003128921A (ja) * 2001-10-17 2003-05-08 Kanegafuchi Chem Ind Co Ltd 熱硬化性樹脂組成物及び熱硬化性樹脂フィルム、それを用いてなる金属箔積層体

Also Published As

Publication number Publication date
CN100338141C (zh) 2007-09-19
WO2003091338A1 (en) 2003-11-06
DE60318570D1 (de) 2008-02-21
US20050209400A1 (en) 2005-09-22
DE60318570T2 (de) 2009-01-08
CA2483510A1 (en) 2003-11-06
US7371462B2 (en) 2008-05-13
TW200307726A (en) 2003-12-16
EP1505121A4 (de) 2006-04-12
TWI336345B (de) 2011-01-21
EP1505121B1 (de) 2008-01-09
KR20050007343A (ko) 2005-01-17
EP1505121A1 (de) 2005-02-09
KR100969175B1 (ko) 2010-07-14
CN1649964A (zh) 2005-08-03

Similar Documents

Publication Publication Date Title
ATE383404T1 (de) Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem härtenden produkt versiegelte lichtemittierende diode
WO2007100445A3 (en) Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
EP1715016A4 (de) Haftklebemittel
TW200502372A (en) Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
ATE546492T1 (de) Härtbare zusammensetzung und katalysatorzusammensetzung
ATE522570T1 (de) Reifenzusammensetzungen und d komponenten mit silylierten polysulfiden mit cyclischem kern
DE602005010614D1 (de) Härtbare beschichtungszusammensetzung
BRPI0720985A8 (pt) Composições de pneus contendo polissulfetos com núcleo silado, e pneu que as compreende
WO2004107458A3 (en) Encapsulating composition for led
GB0606599D0 (en) Extenders for organosiloxane compositions
ATE541871T1 (de) Härtbare fluorcopolymerzusammensetzung und gehärteter gegenstand
MA32930B1 (fr) Composition intumescente
TW200641056A (en) UV-curable resin composition, UV-curable paint and coated article
BRPI0509896A (pt) processo de fotocura com diodo emissor de luz
TW200745216A (en) Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device
TW200734403A (en) Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
EP1225210A3 (de) Silicongummikleber-Zusammensetzung und gegossener Gegenstand aus Silicongummi und thermoplastischem Harz
HK1116208A1 (en) Silicone composition for encapsulating luminescent element and luminescent device
WO2009072632A1 (ja) 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法
DK1412445T3 (da) Polysilazanmodificerede polyaminhærdere til epoxyharpikser
DE602004028151D1 (de) Härtbare silikonzusammensetzung und gehärtetes produkt daraus
CR8471A (es) Metodo para formar una cubierta curable por radiacion y articulo cubierto
ATE530613T1 (de) Silanfunktionelle haftmittelzusammensetzung und verfahren zur primer-freien bindung eines fensters an ein substrat
ATE377035T1 (de) Siloxanharze mit oxetan-funktionalität
MX2007015469A (es) Metodo para unir un fluoropolimero a una capa de silicona.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties