ATE292159T1 - Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silanmodifizierten phenolischen harzen - Google Patents

Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silanmodifizierten phenolischen harzen

Info

Publication number
ATE292159T1
ATE292159T1 AT00901954T AT00901954T ATE292159T1 AT E292159 T1 ATE292159 T1 AT E292159T1 AT 00901954 T AT00901954 T AT 00901954T AT 00901954 T AT00901954 T AT 00901954T AT E292159 T1 ATE292159 T1 AT E292159T1
Authority
AT
Austria
Prior art keywords
epoxy resin
resins
epoxy
resin composition
hardeners
Prior art date
Application number
AT00901954T
Other languages
German (de)
English (en)
Inventor
Hideki Goda
Shoji Takeda
Original Assignee
Arakawa Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34809699A external-priority patent/JP3395744B2/ja
Priority claimed from JP34965899A external-priority patent/JP3710346B2/ja
Application filed by Arakawa Chem Ind filed Critical Arakawa Chem Ind
Application granted granted Critical
Publication of ATE292159T1 publication Critical patent/ATE292159T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT00901954T 1999-01-29 2000-01-27 Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silanmodifizierten phenolischen harzen ATE292159T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2095499 1999-01-29
JP11463599 1999-04-22
JP34809699A JP3395744B2 (ja) 1999-01-29 1999-12-07 エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP34965899A JP3710346B2 (ja) 1999-04-22 1999-12-09 メトキシ基含有シラン変性フェノール樹脂の製造方法
PCT/JP2000/000440 WO2000044806A1 (fr) 1999-01-29 2000-01-27 Durcisseur de resine epoxy, composition de resine epoxy, et procede de production de resine phenolique modifiee au silane

Publications (1)

Publication Number Publication Date
ATE292159T1 true ATE292159T1 (de) 2005-04-15

Family

ID=27457485

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00901954T ATE292159T1 (de) 1999-01-29 2000-01-27 Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silanmodifizierten phenolischen harzen

Country Status (9)

Country Link
US (1) US6441106B1 (zh)
EP (1) EP1086972B1 (zh)
KR (1) KR100591698B1 (zh)
CN (1) CN1155641C (zh)
AT (1) ATE292159T1 (zh)
DE (1) DE60019046T2 (zh)
ES (1) ES2238986T3 (zh)
TW (1) TW490472B (zh)
WO (1) WO2000044806A1 (zh)

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CN1240744C (zh) 1999-07-15 2006-02-08 荒川化学工业株式会社 制备含有缩水甘油醚基团的烷氧基硅烷的部分缩合物的方法
WO2003099934A1 (en) * 2002-05-24 2003-12-04 Nippon Shokubai Co., Ltd. Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica
US6875807B2 (en) 2003-05-28 2005-04-05 Indspec Chemical Corporation Silane-modified phenolic resins and applications thereof
SG119379A1 (en) 2004-08-06 2006-02-28 Nippon Catalytic Chem Ind Resin composition method of its composition and cured formulation
ES2325867T3 (es) * 2004-10-13 2009-09-22 Luca Prezzi Composiciones polimericas con redes modificadas de siloxano, produccion correspondiente y usos de las mismas.
JP5592054B2 (ja) * 2005-02-18 2014-09-17 日立化成株式会社 新規硬化性樹脂とその製造方法、及びエポキシ樹脂組成物、電子部品装置
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP4967485B2 (ja) * 2006-06-12 2012-07-04 荒川化学工業株式会社 接着剤組成物および透明積層体
DE102008055042A1 (de) * 2008-12-19 2010-06-24 Hüttenes-Albertus Chemische Werke GmbH Modifizierte Phenolharze
FR2943068B1 (fr) 2009-03-13 2011-04-15 Markem Imaje Composition d'encre pour l'impression par jet continu devie notamment sur verre humide
KR101252063B1 (ko) 2011-08-25 2013-04-12 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도
JP2015502919A (ja) 2011-11-01 2015-01-29 コリア インスティチュート オブ インダストリアル テクノロジー アルコキシシリル基を有するイソシアヌレートエポキシ化合物、その製造方法、それを含む組成物、該組成物の硬化物及び該組成物の用途
EP2826777B1 (en) 2012-03-14 2020-08-05 Korea Institute of Industrial Technology Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group
US10689482B2 (en) 2012-04-02 2020-06-23 Korea Institute Of Industrial Technology Epoxy compound having alkoxysilyl group, composition and hardened material comprising same, use for same, and production method for epoxy compound having alkoxysilyl group
KR101863111B1 (ko) * 2012-07-06 2018-06-01 한국생산기술연구원 노볼락계 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
WO2015105379A1 (ko) * 2014-01-09 2015-07-16 한국생산기술연구원 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
KR101664948B1 (ko) * 2014-01-09 2016-10-13 한국생산기술연구원 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
KR101992003B1 (ko) * 2016-12-15 2019-06-21 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
KR102018361B1 (ko) * 2016-12-28 2019-09-04 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
CN110621708B (zh) * 2017-04-10 2022-09-02 大陆轮胎德国有限公司 具有极性连接基的官能化树脂
US10875943B2 (en) 2017-04-10 2020-12-29 Eastman Chemical Company Functionalized resin having a polar linker
EP3609937B1 (en) 2017-04-10 2023-11-22 Continental Reifen Deutschland GmbH Functionalized resin having a polar linker
US20210395513A1 (en) 2018-09-27 2021-12-23 Basf Se Epoxy resin composition
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체

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DE2900185A1 (de) * 1979-01-04 1980-07-17 Bayer Ag Siloxanmodifizierte novolake, deren herstellung und verwendung zur herstellung von reibbelaegen
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JPH0386716A (ja) * 1989-08-31 1991-04-11 Toray Dow Corning Silicone Co Ltd シリコーン樹脂で変性されたフェノール樹脂の製造方法
JPH0794533B2 (ja) * 1989-09-29 1995-10-11 日東電工株式会社 半導体装置
JP2506220B2 (ja) * 1990-06-19 1996-06-12 日東電工株式会社 半導体装置
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US5306748A (en) * 1991-07-31 1994-04-26 Shin-Etsu Chemical Co., Ltd. Fluorine-modified thermosetting resin and thermosetting resin composition
JPH0794534A (ja) * 1993-09-24 1995-04-07 Sony Corp ダイボンディング方法とダイボンディング装置
US5736619A (en) * 1995-04-21 1998-04-07 Ameron International Corporation Phenolic resin compositions with improved impact resistance
JP3479818B2 (ja) * 1995-08-31 2003-12-15 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JPH09216939A (ja) * 1996-02-09 1997-08-19 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP3174745B2 (ja) 1997-06-17 2001-06-11 住友大阪セメント株式会社 低自己収縮性セメント系材料およびセメント硬化体の自己収縮低減方法

Also Published As

Publication number Publication date
EP1086972A1 (en) 2001-03-28
WO2000044806A1 (fr) 2000-08-03
CN1155641C (zh) 2004-06-30
KR20010071125A (ko) 2001-07-28
ES2238986T3 (es) 2005-09-16
EP1086972B1 (en) 2005-03-30
KR100591698B1 (ko) 2006-06-20
DE60019046D1 (de) 2005-05-04
DE60019046T2 (de) 2006-02-02
TW490472B (en) 2002-06-11
CN1293685A (zh) 2001-05-02
EP1086972A4 (en) 2001-07-11
US6441106B1 (en) 2002-08-27

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