DE60008100D1 - Verfahren zur herstellung von phenol-dikarbonylkondensaten die erhöhte fluoreszenz aufweisen, epoxydharze, epoxydharzsysteme und daraus hergestellte laminate - Google Patents

Verfahren zur herstellung von phenol-dikarbonylkondensaten die erhöhte fluoreszenz aufweisen, epoxydharze, epoxydharzsysteme und daraus hergestellte laminate

Info

Publication number
DE60008100D1
DE60008100D1 DE60008100T DE60008100T DE60008100D1 DE 60008100 D1 DE60008100 D1 DE 60008100D1 DE 60008100 T DE60008100 T DE 60008100T DE 60008100 T DE60008100 T DE 60008100T DE 60008100 D1 DE60008100 D1 DE 60008100D1
Authority
DE
Germany
Prior art keywords
condensates
dikarbonyl
resin systems
epoxy resin
epoxy resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60008100T
Other languages
English (en)
Other versions
DE60008100T2 (de
Inventor
Steven Corley
Michael Pigneri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resolution Research Nederland BV
Original Assignee
Resolution Research Nederland BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resolution Research Nederland BV filed Critical Resolution Research Nederland BV
Publication of DE60008100D1 publication Critical patent/DE60008100D1/de
Application granted granted Critical
Publication of DE60008100T2 publication Critical patent/DE60008100T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/02—Condensation polymers of aldehydes or ketones with phenols only of ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/259—Coating or impregnation provides protection from radiation [e.g., U.V., visible light, I.R., micscheme-change-itemave, high energy particle, etc.] or heat retention thru radiation absorption
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2926—Coated or impregnated inorganic fiber fabric
    • Y10T442/2992—Coated or impregnated glass fiber fabric

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Laminated Bodies (AREA)
DE60008100T 1999-02-16 2000-02-15 Verfahren zur herstellung von phenol-dikarbonylkondensaten die erhöhte fluoreszenz aufweisen, epoxydharze, epoxydharzsysteme und daraus hergestellte laminate Expired - Lifetime DE60008100T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12024799P 1999-02-16 1999-02-16
US120247P 1999-02-16
PCT/EP2000/001288 WO2000049061A1 (en) 1999-02-16 2000-02-15 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same

Publications (2)

Publication Number Publication Date
DE60008100D1 true DE60008100D1 (de) 2004-03-11
DE60008100T2 DE60008100T2 (de) 2004-11-18

Family

ID=22389107

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60008100T Expired - Lifetime DE60008100T2 (de) 1999-02-16 2000-02-15 Verfahren zur herstellung von phenol-dikarbonylkondensaten die erhöhte fluoreszenz aufweisen, epoxydharze, epoxydharzsysteme und daraus hergestellte laminate

Country Status (12)

Country Link
US (1) US6608161B1 (de)
EP (1) EP1183294B1 (de)
KR (1) KR100469199B1 (de)
CN (1) CN1156504C (de)
AT (1) ATE258942T1 (de)
AU (1) AU2805200A (de)
BR (1) BR0008263A (de)
DE (1) DE60008100T2 (de)
ES (1) ES2215026T3 (de)
MY (1) MY121469A (de)
TW (1) TWI262932B (de)
WO (1) WO2000049061A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6201094B1 (en) * 1998-09-22 2001-03-13 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
JP6069047B2 (ja) * 2012-04-27 2017-01-25 花王株式会社 鋳型造型用硬化剤組成物
US10138325B2 (en) * 2016-05-12 2018-11-27 Chang Chun Plastics Co., Ltd. Polyphenolic condensates and epoxy resins thereof
US10600664B2 (en) * 2017-05-03 2020-03-24 Applied Materials, Inc. Fluorescence based thermometry for packaging applications
CN110423203B (zh) * 2019-07-31 2022-11-01 湘潭大学 一种具有聚集诱导发光性质的荧光胺类化合物及其制备方法和应用
CN110343081B (zh) * 2019-07-31 2022-09-27 湘潭大学 一种具有聚集诱导发光性质的荧光酸酐类化合物及其制备方法和应用
CN110526820B (zh) * 2019-07-31 2022-11-01 湘潭大学 一种具有聚集诱导发光性质的荧光羧酸类化合物及其制备方法和应用

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3005797A (en) * 1958-01-13 1961-10-24 Koppers Co Inc Resins of controlled properties
BE576372A (de) * 1958-03-07
GB1314183A (en) * 1969-08-07 1973-04-18 Courtaulds Ltd Synthetic tanning agent
US3738862A (en) * 1971-11-08 1973-06-12 Shell Oil Co Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates
JPH01132654A (ja) * 1987-11-18 1989-05-25 Hitachi Chem Co Ltd 耐荷重性耐熱巻線体の製造法
US5134204A (en) * 1989-05-12 1992-07-28 Mitsui Toatsu Chemicals, Inc. Resin composition for sealing semiconductors
JPH0676973B2 (ja) * 1989-05-30 1994-09-28 松下電工株式会社 回路パターンの検査法
US5012016A (en) 1990-03-20 1991-04-30 Shell Oil Company Process for preparing tetraphenolic compounds
JP2501154B2 (ja) * 1990-11-26 1996-05-29 三井東圧化学株式会社 テトラキスキシレノ―ルエタンの製造方法
JPH05323604A (ja) * 1992-05-27 1993-12-07 Sumitomo Chem Co Ltd ポジ型レジスト組成物
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
AU717795B2 (en) * 1996-05-24 2000-03-30 Rohm And Haas Company Fluorescent polymers and coating compositions
JPH10130189A (ja) * 1996-10-25 1998-05-19 Sumitomo Chem Co Ltd 多価フェノール化合物、およびそれを用いた樹脂組成物
US6001950A (en) * 1998-09-22 1999-12-14 Borden Chemical, Inc. Phenol-novolacs with improved optical properties

Also Published As

Publication number Publication date
ES2215026T3 (es) 2004-10-01
BR0008263A (pt) 2001-11-06
MY121469A (en) 2006-01-28
WO2000049061A1 (en) 2000-08-24
ATE258942T1 (de) 2004-02-15
KR100469199B1 (ko) 2005-01-31
TWI262932B (en) 2006-10-01
AU2805200A (en) 2000-09-04
CN1156504C (zh) 2004-07-07
EP1183294A1 (de) 2002-03-06
KR20020000761A (ko) 2002-01-05
DE60008100T2 (de) 2004-11-18
EP1183294B1 (de) 2004-02-04
CN1340067A (zh) 2002-03-13
US6608161B1 (en) 2003-08-19

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