JPH05335531A
(ja)
*
|
1992-05-27 |
1993-12-17 |
Sharp Corp |
固体撮像装置
|
US5504350A
(en)
*
|
1992-08-12 |
1996-04-02 |
Spectra-Physics Scanning Systems, Inc. |
Lens configuration
|
US5270869A
(en)
*
|
1992-12-23 |
1993-12-14 |
Eastman Kodak Company |
Passively athermalized optical assembly incorporating laminate fiber compensation ring
|
JPH0837339A
(ja)
*
|
1994-07-21 |
1996-02-06 |
Nec Corp |
反射光防止型半導体レーザダイオード装置
|
JP3318811B2
(ja)
*
|
1994-12-29 |
2002-08-26 |
ソニー株式会社 |
半導体発光素子のパッケージ及びその製造方法
|
US5650868A
(en)
*
|
1995-06-07 |
1997-07-22 |
Compaq Computer Corporation |
Data transfer system
|
JPH095510A
(ja)
*
|
1995-06-21 |
1997-01-10 |
Olympus Optical Co Ltd |
光学素子
|
US6266314B1
(en)
*
|
1996-10-01 |
2001-07-24 |
Matsushita Electric Industrial Co., Ltd. |
Optical pickup device
|
US6020632A
(en)
*
|
1997-02-26 |
2000-02-01 |
Motorola, Inc. |
Electronic component including an adjustable cap
|
US5952778A
(en)
*
|
1997-03-18 |
1999-09-14 |
International Business Machines Corporation |
Encapsulated organic light emitting device
|
US6037655A
(en)
*
|
1998-01-12 |
2000-03-14 |
Eastman Kodak Company |
Linear image sensor package assembly
|
US6134039A
(en)
*
|
1998-01-27 |
2000-10-17 |
Psc Scanning, Inc. |
Wavelength dependent thermally compensated optical system
|
DE19804059B4
(de)
*
|
1998-02-03 |
2006-02-09 |
Robert Bosch Gmbh |
Vorrichtung zur optischen Distanzmessung
|
DE19829197C2
(de)
*
|
1998-06-30 |
2002-06-20 |
Siemens Ag |
Strahlungsaussendendes und/oder -empfangendes Bauelement
|
US6274924B1
(en)
*
|
1998-11-05 |
2001-08-14 |
Lumileds Lighting, U.S. Llc |
Surface mountable LED package
|
DE19916573C2
(de)
*
|
1999-04-13 |
2003-02-13 |
Infineon Technologies Ag |
Lasereinrichtung zur Emission und Kollimation eines Laserstrahls
|
FI116918B
(fi)
*
|
2000-12-13 |
2006-03-31 |
Modines Ltd Oy |
Säteenmuokkaaja
|
CN2457740Y
(zh)
*
|
2001-01-09 |
2001-10-31 |
台湾沛晶股份有限公司 |
集成电路晶片的构装
|
AUPR245601A0
(en)
*
|
2001-01-10 |
2001-02-01 |
Silverbrook Research Pty Ltd |
An apparatus (WSM09)
|
JP2003133627A
(ja)
*
|
2001-10-19 |
2003-05-09 |
Sharp Corp |
半導体レーザ装置
|
US6903379B2
(en)
*
|
2001-11-16 |
2005-06-07 |
Gelcore Llc |
GaN based LED lighting extraction efficiency using digital diffractive phase grating
|
JP2003163405A
(ja)
*
|
2001-11-26 |
2003-06-06 |
Sony Corp |
2波長半導体レーザ素子およびそれに用いられる非点補正板ならびにその配置方法
|
KR100457380B1
(ko)
*
|
2002-05-06 |
2004-11-16 |
삼성전기주식회사 |
광마우스용 칩 온 보드 리드 패키지 및 그에 사용되는렌즈커버
|
CN1653297B
(zh)
|
2002-05-08 |
2010-09-29 |
佛森技术公司 |
高效固态光源及其使用和制造方法
|
US7246364B2
(en)
*
|
2002-10-15 |
2007-07-17 |
Sharp Kabushiki Kaisha |
Optical pickup device
|
US7524085B2
(en)
*
|
2003-10-31 |
2009-04-28 |
Phoseon Technology, Inc. |
Series wiring of highly reliable light sources
|
US7819550B2
(en)
*
|
2003-10-31 |
2010-10-26 |
Phoseon Technology, Inc. |
Collection optics for led array with offset hemispherical or faceted surfaces
|
FR2862140B1
(fr)
*
|
2003-11-07 |
2006-02-24 |
Thales Sa |
Boite a lumiere a diodes electromuminescentes pour visualisations
|
JP2005217337A
(ja)
*
|
2004-02-02 |
2005-08-11 |
Matsushita Electric Ind Co Ltd |
光学デバイス
|
EP1735844B1
(de)
*
|
2004-03-18 |
2019-06-19 |
Phoseon Technology, Inc. |
Verwendung eines hochdichten leuchtdioden-arrays mit mikro-reflektoren für aushärtungsverfahren
|
EP1754259B1
(de)
*
|
2004-03-18 |
2019-07-17 |
Phoseon Technology, Inc. |
Direktkühlung und indirektkühlung von leds
|
EP1743384B1
(de)
*
|
2004-03-30 |
2015-08-05 |
Phoseon Technology, Inc. |
Led-gruppe mit led-detektoren auf gruppenbasis
|
US6987619B2
(en)
*
|
2004-03-31 |
2006-01-17 |
General Electric Company |
Lens array package and fabrication method
|
ATE503963T1
(de)
*
|
2004-04-12 |
2011-04-15 |
Phoseon Technology Inc |
Hochdichtes led-array
|
TWI302756B
(en)
*
|
2004-04-19 |
2008-11-01 |
Phoseon Technology Inc |
Imaging semiconductor structures using solid state illumination
|
EP1622205A3
(de)
*
|
2004-07-29 |
2006-02-08 |
Schott AG |
Gehäuse für elektronische Bauteile, die kodierte optische Signale senden und/oder empfangen.
|
US9281001B2
(en)
*
|
2004-11-08 |
2016-03-08 |
Phoseon Technology, Inc. |
Methods and systems relating to light sources for use in industrial processes
|
US20060285332A1
(en)
*
|
2005-06-15 |
2006-12-21 |
Goon Wooi K |
Compact LED package with reduced field angle
|
US7642527B2
(en)
*
|
2005-12-30 |
2010-01-05 |
Phoseon Technology, Inc. |
Multi-attribute light effects for use in curing and other applications involving photoreactions and processing
|
TWI302041B
(en)
*
|
2006-01-19 |
2008-10-11 |
Everlight Electronics Co Ltd |
Light emitting diode packaging structure
|
DE102006049178A1
(de)
*
|
2006-10-18 |
2008-04-30 |
Sensopart Industriesensorik Gmbh |
Optoelektronische Sensorvorrichtung
|
DE102007048617A1
(de)
*
|
2007-10-10 |
2009-04-16 |
Robert Bosch Gmbh |
Lasermodul
|
JP5079474B2
(ja)
*
|
2007-11-29 |
2012-11-21 |
シャープ株式会社 |
キャップ部材およびそれを用いた半導体装置
|
JP2011065979A
(ja)
*
|
2009-08-18 |
2011-03-31 |
Sharp Corp |
光源装置
|
US9385285B2
(en)
|
2009-09-17 |
2016-07-05 |
Koninklijke Philips N.V. |
LED module with high index lens
|
US8613530B2
(en)
|
2010-01-11 |
2013-12-24 |
General Electric Company |
Compact light-mixing LED light engine and white LED lamp with narrow beam and high CRI using same
|
US10782187B2
(en)
*
|
2010-07-08 |
2020-09-22 |
Cvg Management Corporation |
Infrared temperature measurement and stabilization thereof
|
US9228902B2
(en)
*
|
2010-07-08 |
2016-01-05 |
Cvg Management Corporation |
Infrared temperature measurement and stabilization thereof
|
DE102010034020A1
(de)
*
|
2010-08-11 |
2012-02-16 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Oberflächenstruktur sowie Fresnel-Linse und Werkzeug zur Herstellung einer Oberflächenstruktur
|
GB201014053D0
(en)
*
|
2010-08-23 |
2010-10-06 |
St Microelectronics Res & Dev |
Optical navigation device
|
JP5528636B2
(ja)
*
|
2011-08-22 |
2014-06-25 |
京セラ株式会社 |
光半導体装置
|
WO2013080396A1
(ja)
*
|
2011-11-30 |
2013-06-06 |
パナソニック株式会社 |
窒化物半導体発光装置
|
JP6076151B2
(ja)
*
|
2012-12-06 |
2017-02-08 |
三菱電機株式会社 |
光モジュール及び光伝送方法
|
JP2014138046A
(ja)
*
|
2013-01-16 |
2014-07-28 |
Stanley Electric Co Ltd |
半導体発光素子パッケージ固定構造
|
JP6373153B2
(ja)
*
|
2014-10-09 |
2018-08-15 |
三菱電機株式会社 |
液晶表示装置
|
CA2964209C
(en)
*
|
2015-01-29 |
2020-03-24 |
Mitsubishi Electric Corporation |
Light-source device
|
JP6586656B2
(ja)
*
|
2016-08-05 |
2019-10-09 |
サンテック株式会社 |
検出装置
|
JP6789514B2
(ja)
*
|
2016-08-05 |
2020-11-25 |
サンテック株式会社 |
検出装置
|
WO2018065278A1
(en)
*
|
2016-10-04 |
2018-04-12 |
Lumileds Holding B.V. |
Reducing thermal sensitivity of a lighting arrangement
|
US9784617B1
(en)
*
|
2017-02-01 |
2017-10-10 |
United States Of America, As Represented By The Secretary Of The Navy |
Tunable ultra-compact fresnel zone plate spectrometer
|
US10969560B2
(en)
|
2017-05-04 |
2021-04-06 |
Lightpath Technologies, Inc. |
Integrated optical assembly and manufacturing the same
|
US10681288B2
(en)
*
|
2017-06-23 |
2020-06-09 |
Lite-On Technology Corporation |
Light emitting control system
|
JP6687008B2
(ja)
*
|
2017-11-30 |
2020-04-22 |
日亜化学工業株式会社 |
発光装置
|
JP7117138B2
(ja)
*
|
2018-04-23 |
2022-08-12 |
スタンレー電気株式会社 |
レーザモジュール
|
KR20210157060A
(ko)
*
|
2020-06-19 |
2021-12-28 |
휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. |
광의 진행 방향으로 열팽창을 촉진하는 광주사장치의 플랜지
|
CN114299826B
(zh)
*
|
2022-01-19 |
2023-12-26 |
深圳市奥视微科技有限公司 |
显示模组、显示设备及显示模组的光程调节方法
|