WO2023032135A1 - 熱剥離型粘着テープ - Google Patents

熱剥離型粘着テープ Download PDF

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Publication number
WO2023032135A1
WO2023032135A1 PCT/JP2021/032343 JP2021032343W WO2023032135A1 WO 2023032135 A1 WO2023032135 A1 WO 2023032135A1 JP 2021032343 W JP2021032343 W JP 2021032343W WO 2023032135 A1 WO2023032135 A1 WO 2023032135A1
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Prior art keywords
heat
sensitive adhesive
adhesive layer
adhesive tape
pressure
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PCT/JP2021/032343
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English (en)
French (fr)
Japanese (ja)
Inventor
嶺 木本
翼 森木
衛一 工藤
太郎 岩本
靖史 土屋
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株式会社寺岡製作所
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Priority to JP2022506513A priority Critical patent/JP7109698B1/ja
Priority to KR1020237022272A priority patent/KR102656756B1/ko
Priority to PCT/JP2021/032343 priority patent/WO2023032135A1/ja
Priority to CN202180093292.6A priority patent/CN116829665B/zh
Priority to TW111106271A priority patent/TWI824417B/zh
Publication of WO2023032135A1 publication Critical patent/WO2023032135A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Definitions

  • the present invention relates to a heat-peelable adhesive tape.
  • Patent Document 1 proposes the use of a porous substrate as the substrate.
  • Patent Document 1 discloses a heat-peelable double-sided pressure-sensitive adhesive sheet having a heat-peelable adhesive layer A on one side of a porous substrate and an adhesive layer B on the other side of the porous substrate, wherein the porous substrate has a density of 0.9 g/cm 3 or less and a tensile modulus of elasticity of 20 MPa or less, and is capable of processing a work piece having a surface with a maximum unevenness difference of 10 ⁇ m or more.
  • Patent Document 2 discloses a heat-peelable pressure-sensitive adhesive sheet in which a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres is laminated on at least one side of a substrate via a rubber-like organic elastic layer. ing.
  • This heat-peelable pressure-sensitive adhesive sheet is said to have excellent conformability to uneven surfaces by setting the rubber-like organic elastic layer and the heat-expandable pressure-sensitive adhesive layer to specific thicknesses and thickness ratios. Due to such followability, even if the adherend surface of the adherend is a rough surface, it exhibits sufficient adhesive strength, and even when used as a pressure-sensitive adhesive sheet for dicing semiconductor substrates having a rough surface such as sealing resin. It is said that chip flying is less likely to occur, and that it can be easily peeled off without applying stress to the adherend by heating after the completion of processing.
  • Patent Documents 1 and 2 disclose a temperature of 100 to 250° C. as a heat treatment condition for peeling after processing.
  • heat treatment is often performed in a state in which the adhesive sheet is adhered, and there is a need for a heat-peelable adhesive tape that does not peel off even at temperatures of 100°C or higher and that can be easily peeled off by heating. It has been demanded.
  • the present invention has been made in view of the above problems, and the adhesive tape used in the heating process of electronic parts and semiconductor parts can be suitably used in the heating process at high temperatures, and can be used at a higher temperature after use in the heating process.
  • a heat-peelable pressure-sensitive adhesive tape comprising a base material and a heat-peelable pressure-sensitive adhesive layer on at least one side of the base material, of the substrate, (a) a tensile strength at 100% elongation of 0.9 MPa or less; (b) the compressive stress at 50% compression is 2.0 MPa or less, (c) the value of tan ⁇ at the maximum temperature of 100°C or higher when the heat-peelable pressure-sensitive adhesive tape is used, which is obtained by dynamic viscoelasticity measurement at a frequency of 10 Hz, is 0.80 or less;
  • the heat-peelable adhesive layer is (d) A pressure-sensitive adhesive component 100 that contains thermally expandable globules having a foaming initiation temperature of +15° C.
  • thermoly expandable globules forms the thermally peelable adhesive layer. It was found that a heat-peelable pressure-sensitive adhesive tape, which is characterized by a range of 6 parts by mass or more and 50 parts by mass or less, is very effective for solving the above problems, and the present invention was completed. came to.
  • the heat-peelable pressure-sensitive adhesive tape of the present invention can be suitably used without being peeled off even in high-temperature processes in various manufacturing processes including manufacturing processes for electronic parts and semiconductor parts, and can be adhered by heating to a higher temperature after use in the same processes. It can be easily peeled off without adhesive residue, and has excellent conformability to unevenness of the adherend.
  • Patent Documents 1 and 2 show examples in which the peeling temperature of the pressure-sensitive adhesive sheet is 100 to 120° C., but the operating temperature in that case is, of course, lower than 100° C., and there is no particular description. It is believed to be at room temperature (around 25°C). Therefore, there is no sufficient disclosure regarding use at high temperatures of 100° C. or higher and peeling at even higher temperatures.
  • the base material is a soft material. sometimes Therefore, in the present invention, a material having both flexibility and heat resistance is used as the base material, so that it does not peel when used at a high temperature of 100 ° C. or higher, and can be easily peeled by heating to a higher temperature than the use temperature. Furthermore, the inventors have found that the object of the present invention can be achieved by combining a heat-peelable adhesive layer containing a predetermined amount of heat-expandable globules that start foaming at a temperature higher than the operating temperature.
  • the heat-peelable pressure-sensitive adhesive tape according to the present invention will be described in detail below.
  • the layer structure of the heat-peelable pressure-sensitive adhesive tape according to the present invention will be described with reference to the schematic cross-sectional view shown in FIG.
  • FIG. 1(A) shows a laminated structure of a base material 1 and a heat-peelable adhesive layer 2, which is the minimum layer structure
  • FIG. 1(B) further shows a heat-peelable adhesive layer 2 of the base material 1 It shows a configuration in which a support layer 3 is laminated on the opposite surface of the surface.
  • FIG. 1(C) shows an example in which an intermediate support layer 4 is provided on the surface of the substrate 1 on which the heat-peelable adhesive layer 2 is formed. 4 is added, the intermediate support layer 4 may be added to the layer structure of FIG. 1(A).
  • FIG. 1(C) shows an example in which an intermediate support layer 4 is provided on the surface of the substrate 1 on which the heat-peelable adhesive layer 2 is formed. 4 is added, the intermediate support layer 4 may be added to the layer structure of FIG. 1(A).
  • 1(D) shows the layer structure of a double-sided adhesive tape in which adhesive layers are provided on both sides of a base material 1, a heat-peelable adhesive layer 2 is provided on one side, and a second adhesive layer 5 is provided on the other side. is provided.
  • the second adhesive layer 5 can be either a normal adhesive layer or a heat-peelable adhesive layer.
  • the heating temperature for peeling may be the same as or different from that for the heat-peelable adhesive layer 2 .
  • a release film (not shown) can be provided on the adhesive surface of the heat-peelable adhesive layer and the surface of the substrate without the support layer to prevent adjacent layers from adhering when wound as a tape.
  • a resin film such as polyester (eg, polyethylene terephthalate: PET) film subjected to release treatment can be used.
  • the substrate of the heat-peelable pressure-sensitive adhesive tape according to the present invention simultaneously satisfies the following conditions (a) to (c).
  • (b) the compressive stress at 50% compression is 2.0 MPa or less,
  • (c) The value of tan ⁇ is 0.80 or less at the maximum temperature of 100° C. or higher during use of the heat-peelable pressure-sensitive adhesive tape, which is obtained by dynamic viscoelasticity measurement at a frequency of 10 Hz.
  • the tensile strength of (a) was obtained by pulling a test piece (thickness 800 ⁇ m, width 25 mm, length 100 mm) at 23 ° C. and 50% RH at a speed of 300 mm / min with a distance between grips of 30 mm. Measure the tensile strength at 100%. A commercially available tensile tester can be used for the measurement.
  • the tensile strength is 0.9 MPa or less, preferably 0.8 MPa or less.
  • the compressive stress in (b) is obtained by compressing a test piece (30 mm ⁇ 30 mm ⁇ 12 mm) at a speed of 10 mm/min in an environment of 23°C and 50% RH, and measuring the compressive stress at 50% deformation.
  • a commercially available compression tester can be used for the measurement.
  • the compressive stress is 2.0 MPa or less, preferably 1.5 MPa or less.
  • tan ⁇ (loss tangent) is a test piece (10 mm ⁇ 10 mm ⁇ 2 mm) using a dynamic viscoelasticity measuring device, while applying shear strain at a frequency of 10 Hz, at a heating rate of 10 ° C./min, - Storage modulus (G') and loss modulus (G'') are measured in the range of 50°C to 250°C. It is obtained by calculating tan ⁇ .
  • the "maximum temperature of 100°C or higher when using the heat-peelable adhesive tape” means the maximum temperature of 100°C or higher at which the heat-peelable adhesive tape is actually used. The maximum temperature is set to a temperature that is 15° C.
  • tan ⁇ is 0.80 or less, preferably 0.70 or less.
  • any material can be used as long as the above conditions (a) to (c) are satisfied.
  • the base resin (main component) any one of acrylic resin, silicone resin, and urethane resin can be used. is preferably From these resins, it is possible to satisfy the tensile strength and compressive stress specified by the above conditions (a) and (b), and the tan ⁇ value of the above condition (c) is sufficient to be 0.80 or less. Materials with heat resistance can be selected.
  • the acrylic resin mainly contains (meth)acrylic acid alkyl ester as a monomer component, and an acrylic resin composition containing an acrylic copolymer resin can be obtained by combining this with a copolymerizable vinyl monomer.
  • Examples of (meth)acrylic acid alkyl esters include those having an alkyl ester portion having 1 to 20 carbon atoms, preferably having 1 to 12 carbon atoms, and those having 1 to 8 carbon atoms. more preferred.
  • Specific examples of (meth) acrylic acid alkyl esters include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, (meth) ) Tertiary butyl acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, isohexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, ethylhexyl (meth) acrylate, ( meth) nonyl acrylate, isononyl (me
  • the (meth)acrylic acid alkyl ester accounts for 50% by mass or more, preferably 60% by mass or more, more preferably 70% by mass or more, and most preferably 80% by mass or more, in all the monomers.
  • copolymerizable vinyl-based monomers include carboxylic acid-containing (meth)acrylic monomers such as (meth)acrylic acid, ⁇ -carboxyethyl (meth)acrylate, itaconic acid, crotonic acid, maleic acid, and fumaric acid; ) 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2- (meth) acrylate Hydroxyhexyl, copolymerizable monomers containing hydroxyl group such as monoester of (meth)acrylic acid and polyethylene glycol or polypropylene glycol, (meth)acrylamide, N-alkyl-substituted (meth) such as N-isopropyl (meth)acrylamide acrylamide, N,N-dialkyl-substituted (meth)acrylamides such as N,N-dimethyl(meth
  • the acrylic resin composition is obtained, for example, by polymerizing a (meth)acrylic acid alkyl ester and acrylic acid to prepare an acrylic syrup, and then adding other monomers and additives of the acrylic syrup to obtain an acrylic resin composition. can be done.
  • This acrylic resin composition can be coated on a support having releasability and cured by UV curing or the like to prepare a base material.
  • Additives to the resin composition include hollow particles such as resin balloons and glass balloons, resin particles such as urethane beads, epoxy-based, isocyanate-based, and polyfunctional acrylate-based cross-linking agents, fillers, coloring agents, and antioxidants. , UV absorbers, surfactants, polymerization initiators, chain transfer agents, and other known additives can be added.
  • the silicone-based resin and urethane-based resin it is sufficient to combine the raw materials and materials that can be used as the base material for the tape and select those that satisfy the above conditions (a) to (c).
  • a silicone-based resin it is preferable to use a platinum-based catalyst that promotes dehydration condensation of the siloxane compound.
  • urethane-based resins it is preferable to use an epoxy-based or isocyanate-based cross-linking agent in combination.
  • the base material may be selected from commercially available tape base materials that satisfy the above conditions (a) to (c). In that case, a product manufactured as a porous body such as urethane foam can also be used.
  • the thickness of the substrate is not particularly limited as long as it is a thickness that satisfies the conformability to unevenness according to the purpose of use, but is preferably 30 ⁇ m or more, more preferably 50 ⁇ m or more. Moreover, the upper limit of the thickness is preferably 2000 ⁇ m or less, more preferably 1000 ⁇ m or less.
  • the heat-peelable adhesive layer according to the present invention contains an adhesive and heat-expandable globules, and the content of the heat-expandable globules is 6 parts per 100 parts by mass of the adhesive component forming the heat-peelable adhesive layer. It is in the range of 50 parts by mass or more and 50 parts by mass or less.
  • the foaming start temperature of the heat-expandable globules is a temperature equal to or higher than the maximum temperature during use specified in the condition (c) above +15°C.
  • the heat-expandable microspheres used in the present invention include, for example, microspheres in which a substance such as isobutane, propane, and pentane that easily gasifies and expands upon heating is enclosed in an elastic shell. .
  • the shell is often made of a hot-melt material or a material that breaks due to thermal expansion.
  • substances forming the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone, and the like.
  • Thermally expandable microspheres can be produced by conventional methods such as coacervation and interfacial polymerization.
  • the foaming start temperature can be controlled mainly by the thickness of the shell, and the thicker the shell, the higher the foaming start temperature.
  • Matsumoto Microsphere (registered trademark) F and FN series which have a shell thickness of 2 to 15 ⁇ m and an average particle size of 5 to 50 ⁇ m, are commercially available from Matsumoto Yushi Seiyaku Co., Ltd., and are preferably used. can be done.
  • the thermally expandable spheres may be selected based on their expansion initiation temperature and expansion ratio.
  • any adhesive component that has sufficient adhesive force at the temperature of use and can be detached by heating at a high temperature by foaming the thermally expandable globules can be used.
  • Specific examples include (meth)acrylic copolymers, silicone pressure-sensitive adhesives, polyester pressure-sensitive adhesives, and the like.
  • the (meth)acrylic copolymer can be used in combination with the vinyl monomer used for the base material.
  • one or more structural units derived from a (meth)acrylic acid alkyl ester are used as a main component and a structural unit derived from acrylic acid is included.
  • the structural unit derived from acrylic acid is preferably contained in an amount of 2% by mass or more, more preferably 5% by mass or more, based on 100% by mass of all monomer units. If the acrylic acid-derived structural unit is 2% by mass or more based on 100% by mass of the total monomer units, even if the operating temperature is as high as 150°C, the step followability after heating is excellent. From the point of view of increasing the adhesive strength, it is also a preferred embodiment to use a hydroxyl group-containing acrylic acid ester together.
  • the content of the heat-expandable spheres is in the range of 6 parts by mass to 50 parts by mass, preferably 6 parts by mass to 40 parts by mass, based on 100 parts by mass of the adhesive component forming the heat-peelable adhesive layer. It is below. If the content of the heat-expandable globules is less than 6 parts by mass, the heat-releasable property due to the foaming of the heat-expandable globules cannot be exhibited sufficiently. On the other hand, when the content of the heat-expandable globules exceeds 50 parts by mass, the relative amount of the pressure-sensitive adhesive component decreases, making it impossible to obtain the desired pressure-sensitive adhesive strength.
  • the spheres may peel during use with heating, or the thermal peeling property may deteriorate, resulting in a decrease in heat release. After heating to the peeling temperature, when the temperature is returned to room temperature and peeled, the adhesive strength may not be sufficiently reduced, and peeling may become difficult.
  • additives can be added to the heat-peelable adhesive layer in addition to the adhesive component and the heat-expandable globules as long as they do not impair the effects of the present invention.
  • additives include ultraviolet absorbers, antioxidants, colorants, and various fillers.
  • the thickness of the heat-peelable adhesive layer should be greater than the particle size of the heat-expandable spheres to be added, and should be within a range that does not impair the conformability of the substrate to irregularities.
  • the thickness may be selected within the range of 10 to 100 ⁇ m depending on the thickness of the substrate and the particle size of the thermally expandable globules.
  • the particle size of the thermally expandable spherules may be set by predicting the maximum particle size from the average particle size (catalog value), or by removing large particles by sieving or the like. , the mesh size of the sieve may be used as the set particle size.
  • the heat-peelable pressure-sensitive adhesive tape according to the present invention has a resin film different from that of the substrate 1 on at least one side of the substrate 1 as a support layer 3 or an intermediate layer. It can be provided as a support layer 4 .
  • the substrate used in the present invention may have tackiness, and if the thickness of the substrate is thin, sufficient strength may not be obtained. Therefore, it is preferable to provide a resin film as the support layer 3 or the intermediate support layer 4 .
  • the resin contained in this resin film preferably has lower tackiness than the substrate, has heat resistance, and is excellent in strength. and polycycloolefin resin. Among them, polyimide resin and polyethylene terephthalate (PET) are preferred.
  • the thickness of the support layer 3 is preferably 20 ⁇ m or more, more preferably 40 ⁇ m or more, from the viewpoint of imparting moderate strength.
  • the upper limit may be set in consideration of the thickness of the substrate and the thickness of the entire heat-peelable pressure-sensitive adhesive tape.
  • the thickness of the intermediate support layer 4 is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, because the thicker the intermediate support layer 4 , the more difficult it is to obtain the step followability of the base material. Although there are no particular restrictions on the thickness, the thickness is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, in consideration of the provision of the intermediate support layer 4 .
  • the heat-peelable pressure-sensitive adhesive tape according to the present invention as shown in FIG. can do.
  • the thermally releasable adhesive layer 2 may be called the first adhesive layer as opposed to the second adhesive layer 5 .
  • the first adhesive layer is the heat-releasable adhesive layer according to the present invention, but the second adhesive layer may be either the heat-releasable adhesive layer or a normal adhesive layer.
  • the second adhesive layer is a heat-peelable adhesive layer, it may be the same as or different from the heat-peelable adhesive layer of the first adhesive layer.
  • it may be a heat-peelable adhesive layer that is thermally peeled off at a higher temperature or lower temperature than the first adhesive layer. By doing so, it is possible to set the temperature for peeling off the members attached to the respective surfaces of the double-sided adhesive tape.
  • the heat-peelable pressure-sensitive adhesive tape according to the present invention is used for the manufacturing process of a member having an uneven surface.
  • a semiconductor substrate, an electronic component, or the like can be given as examples of the member having an uneven surface.
  • the adherend targeted by the present invention is a member used in manufacturing that requires a temperature of 100° C. or higher.
  • a temperature of about 150 to 200° C. may be applied in processes such as solder reflow.
  • the maximum temperature reached in such a manufacturing process is defined as the maximum temperature during use of the heat-peelable pressure-sensitive adhesive tape (usage temperature).
  • the thermally expandable globules contained in the thermally releasable adhesive layer have a foaming start temperature in a temperature range 15°C or more higher than the usage temperature, they do not foam at the usage temperature and maintain adhesive strength. can be done.
  • heating to a temperature equal to or higher than the foaming start temperature causes the thermally expandable globules to expand and foam, resulting in the action of separating the thermally peelable pressure-sensitive adhesive layer from the adherend.
  • the heating temperature at this time is called the thermal peeling temperature, and as described above, it is sufficient if the temperature is equal to or higher than the foaming start temperature. Therefore, the thermal peeling temperature is preferably 30° C. or higher, more preferably 40° C.
  • the time for thermal detachment can be appropriately set depending on the temperature difference between the thermal detachment temperature and the foaming start temperature, the shell material and shell thickness of the thermally expandable spherules, and the type of the contained vapor.
  • the peeling temperature is lower than the working temperature, preferably 100° C. or lower, more preferably 50° C. or lower, and the peeling may be performed after cooling to room temperature (around 25° C.).
  • [Substrate preparation method] -Acrylic syrup preparation method
  • the composition shown in Table 1 is put into a flask equipped with a stirrer, a reflux condenser, a thermometer, and a nitrogen gas inlet, and an ultraviolet irradiation device (manufactured by Panasonic Corporation: product name "Aicure UP50”) is placed in a nitrogen atmosphere. ”), the acrylic syrup is obtained by irradiating with ultraviolet rays for 8 to 12 minutes at an irradiation intensity of 800 to 1,200 mW/cm 2 (manufactured by Itec System Co., Ltd.: measured using a photometer UVM-100) for photopolymerization. rice field.
  • a fluorescent lamp manufactured by Toshiba: FL20S W
  • an irradiation intensity of 3.0 to 5.0 mW/cm 2 is irradiated from both sides for 30 seconds to 2 minutes depending on the coating thickness to cure the base composition, and the acrylic base material. got The thickness of the acrylic base material was adjusted to 50 ⁇ m to 800 ⁇ m.
  • a laminate having a thickness of 12 mm was formed by stacking base materials of 30 mm square. This laminate was compressed using a compression tester (manufactured by Shimadzu Corporation: AG-50kNX Plus) under the conditions of 23° C., 50% RH, and a test speed of 10 mm/min, and the compressive stress at 50% deformation was measured.
  • a compression tester manufactured by Shimadzu Corporation: AG-50kNX Plus
  • the substrate names in Table 3 are as follows. Si: silicone base material, trade name "Unicon UT-30", manufactured by Kotec PU: urethane base material, trade name "PureCell (registered trademark) UC150PR” manufactured by INOAC Corporation
  • Si silicone base material
  • trade name "Unicon UT-30" manufactured by Kotec PU urethane base material
  • the base material AS9 does not satisfy the conditions (a) and (b) according to the present invention
  • the base material AS10 does not satisfy the condition (c) according to the present invention.
  • the remaining AS1 to AS8, Si, and PU substrates are substrates that can be used at any operating temperature of 100 to 180°C.
  • this weight average molecular weight (Mw) is a value measured by the GPC method, and the weight average molecular weight of the acrylic copolymer converted to standard polystyrene was measured using the following measuring apparatus and conditions.
  • ⁇ Apparatus LC-2000 series (manufactured by JASCO Corporation) ⁇ Column: ShodexKF-806M ⁇ 2, ShodexKF-802 ⁇ 1 ⁇ Eluent: Tetrahydrofuran (THF) ⁇ Flow rate: 10 mL/min ⁇ Column temperature: 40°C ⁇ Injection volume: 100 ⁇ L ⁇ Detector: Refractometer (RI) ⁇ Measurement sample: A solution obtained by dissolving an acrylic polymer in THF to prepare a solution having an acrylic polymer concentration of 0.5%, and filtering the solution with a filter to remove dust.
  • the weight average molecular weight (Mw) is determined by the type and amount of the polymerization initiator (for example, 0.1 part of lauryl peroxide per 100 parts of the acrylic monomer) and the type and amount of the chain transfer agent when the acrylic copolymer is polymerized. (eg, 0.1 part of n-dodecanethiol with respect to 100 parts of acrylic monomer), polymerization initiation concentration (eg, 50%), etc. can be adjusted as appropriate.
  • FN-100MD Trade name “Matsumoto Microsphere (registered trademark) FN-100MD” manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd., foaming start temperature 119 ° C.
  • F-50D Trade name “Matsumoto Microsphere (registered trademark) F-50D”, manufactured by Matsumoto Yushi Seiyaku Co., Ltd., foaming start temperature 112 ° C.
  • ⁇ E-5CM trade name, manufactured by Soken Chemical Co., Ltd., epoxy-based cross-linking agent, solid content 5% ⁇ L-45E: trade name, manufactured by Tosoh Corporation, isocyanate cross-linking agent, solid content 45% ⁇ CAT-PL-50T: trade name, manufactured by Shin-Etsu Chemical Co., Ltd., platinum-based catalyst ⁇ Irganox 1010: trade name, manufactured by BASF, hindered phenolic antioxidant
  • Examples 1-22, Comparative Examples 1-4 Adhesive tape production method
  • the pressure-sensitive adhesive composition obtained above is coated on a PET release film having a thickness of 50 ⁇ m (manufactured by Fujimori Kogyo Co., Ltd., product name “Film Biner (registered trademark) KF #50”) that has been subjected to silicone release treatment. was applied so as to have a thickness of 50 ⁇ m. Next, it was placed in a dryer (PHH-201, manufactured by Espec Co., Ltd.) to dry the diluted solvent at 50 to 110° C. and to carry out a cross-linking reaction to form a thermally expandable adhesive layer.
  • a dryer PH-201, manufactured by Espec Co., Ltd.
  • the expansion start temperature of thermally expandable microspheres can be obtained by using a thermal analyzer TMA (manufactured by Hitachi High-Tech Science Co., Ltd.: TMA7100).
  • TMA thermal analyzer
  • the foaming start temperature of the thermally expandable spheres was analyzed by putting the thermally expandable spheres into a 5 mm ⁇ aluminum pan, covering it with an inner lid, and using compression mode (L assembly control, heating rate: 10°C/min).
  • the temperature at which the displacement in the vertical direction of the measuring terminal began to rise was defined as the temperature.
  • the step followability was evaluated for the example in which the test temperature was 150°C.
  • Level difference followability A polyimide tape (manufactured by Teraoka Seisakusho Co., Ltd., product name "No. 6544") having a thickness of 90 ⁇ m and a size of 5 mm x 30 mm was attached to a glass plate to prepare glass with a step difference having a pseudo step for testing.
  • the heat-expandable adhesive layer side of a 20 mm square adhesive tape was placed on a stepped glass, and a 5 kg rubber roller was reciprocated once at 300 mm/min to prepare an adhesive test piece.
  • the width of bubbles generated around the step was measured at three points at intervals of 5 mm, and the average value was calculated.
  • the test piece was placed in a dryer and heated at a test temperature of 150° C. for 30 minutes, and then the cell width was similarly calculated.
  • the step followability was evaluated according to the following criteria. A: Bubble width less than 1 mm B: Bubble width 1 mm or more and less than 5 mm C: Bubbles were connected or the adhesive tape was peeled off from the test piece.
  • Comparative Example 1 it was confirmed that the AS9 base material, which does not satisfy the above conditions (a) and (b) of the present invention, is used as the base material, so that the flexibility is low and the step followability is poor. As shown in Examples 2 to 4, it can be seen that the thickness of the base material has almost no effect.
  • the influence of the substrate tan ⁇ under the condition (c) was evaluated. Specifically, in an example of an acrylic base material with a base thickness of 200 ⁇ m, the adhesive tape is cut into 20 mm squares, and the thickness (manufactured by Peacock: dial thickness gauge G-6), dimensions (manufactured by Keyence: VHX-6000 ) was measured. A 20 mm square adhesive tape is placed on an aluminum plate (A1050P) with a thickness of 1.0 mm and 50 mm x 125 mm, and a float glass plate (R 3202) with a weight of 20 g (thickness of 2.8 mm and 50 mm x 60 mm) is placed on the adhesive tape. put it on top.
  • A1050P aluminum plate
  • R 3202 float glass plate
  • Example 11 using a silicone base material and Example 12 using a urethane base material, tan ⁇ was 0.80 or less, and deformation during processing was suppressed.
  • Adhesive strength after heating The adhesive tape was laminated and pressure-bonded in the same manner as the measurement of the initial adhesive strength, and then placed in a dryer and heated at the test temperature shown in Table 6 for 30 minutes. Removed from the dryer and left at 23°C, 50% RH for 20 to 40 minutes, then using a tensile tester, measure the peel strength of the tape at 23°C, 50% RH, test speed of 300 mm/min, and peel angle of 90°. bottom.
  • Example 23 On the surface opposite to the surface on which the thermally expandable adhesive layer of the base material is formed, a PET release film with a thickness of 50 ⁇ m that has been subjected to silicone release treatment instead of the PET film as the support layer (manufactured by Fujimori Kogyo Co., Ltd., product name “Film Binner A pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that it was changed to (registered trademark) KF#50"). The layer structure excluding the PET release film is shown in FIG. 1(A). In the step followability test, the PET release film was peeled off and heated. ”) was pasted and measured.
  • Example 24 An adhesive tape was obtained in the same manner as in Example 1 except that the PET film on the opposite side of the thermally expandable adhesive layer was changed to a 50 ⁇ m thick PI film (manufactured by Toray DuPont, product name “Kapton 100H”).
  • Example 25 The pressure-sensitive adhesive composition AD1 was applied onto an intermediate support layer made of a 12 ⁇ m-thick PET film (manufactured by Toray Industries, Inc., product name “Lumirror #12-S10”) so that the thickness of the pressure-sensitive adhesive layer was 50 ⁇ m. Then, it was placed in a dryer to dry the diluent solvent at 50 to 110° C. and to cause a cross-linking reaction to form a thermally expandable adhesive layer. The PET release film on one side of the acrylic base material 1 was peeled off, and the base material was attached to the PET film surface of the PET film coated with the thermally expandable adhesive layer.
  • an intermediate support layer made of a 12 ⁇ m-thick PET film (manufactured by Toray Industries, Inc., product name “Lumirror #12-S10”) so that the thickness of the pressure-sensitive adhesive layer was 50 ⁇ m. Then, it was placed in a dryer to dry the diluent solvent at 50 to 110° C.
  • the PET film on the other side of the substrate was peeled off, a PET film with a thickness of 50 ⁇ m was attached, and the substrate was cured at 40° C. for 3 days to obtain an adhesive tape having a layer structure shown in FIG. 1(C).
  • Example 26 The pressure-sensitive adhesive composition AD1 is applied to a PET release film having a thickness of 50 ⁇ m (manufactured by Fujimori Kogyo Co., Ltd., product name “Film Biner (registered trademark) KF#50”) that has been subjected to silicone release treatment, and the adhesive layer is coated so that the thickness of the adhesive layer is 50 ⁇ m. was applied to Then, it was placed in a drier to dry the diluted solvent at 50 to 110° C., and cross-linking reaction was performed to prepare two films each having a heat-expandable adhesive layer. The PET release film on one side of the substrate was peeled off, and the first thermally expandable adhesive layer was transferred to form the first adhesive layer.
  • a PET release film having a thickness of 50 ⁇ m manufactured by Fujimori Kogyo Co., Ltd., product name “Film Biner (registered trademark) KF#50”
  • the adhesive layer is coated so that the thickness of the adhesive layer is 50 ⁇
  • the above-described PET release film was laminated on the release-treated surface side. Furthermore, the PET release film on the other side of the substrate is peeled off, the second thermally expandable adhesive layer is transferred to form the second adhesive layer, and the PET release film is released on the second adhesive layer. It was pasted together on the mold-processed surface side. After that, it was cured at 40° C. for 3 days to obtain an adhesive tape. In the step followability test, the PET release film on the surface opposite to the adhesive surface was also peeled off and heated, and when measuring the adhesive force, the PET release film on the surface opposite the adhesive surface was peeled off. (manufactured by Toray Industries, Inc., product name “Lumirror #50-S10”) was attached and measured. Table 10 shows the results of Examples 23 to 26 above.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2021/032343 2021-09-02 2021-09-02 熱剥離型粘着テープ WO2023032135A1 (ja)

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PCT/JP2021/032343 WO2023032135A1 (ja) 2021-09-02 2021-09-02 熱剥離型粘着テープ
CN202180093292.6A CN116829665B (zh) 2021-09-02 2021-09-02 热剥离型粘合带
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JP2008115272A (ja) 2006-11-04 2008-05-22 Nitto Denko Corp 熱剥離性両面粘着シート及び被加工体の加工方法
JP6054208B2 (ja) * 2013-03-04 2016-12-27 日東電工株式会社 熱剥離型粘着シート
JP2015021082A (ja) * 2013-07-19 2015-02-02 日東電工株式会社 電子部品切断用熱剥離型粘着テープおよび電子部品の切断方法
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CN111808541A (zh) * 2014-09-25 2020-10-23 日东电工株式会社 热剥离型粘合片
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JP7396837B2 (ja) * 2019-09-06 2023-12-12 日東電工株式会社 粘着シート
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JP2012167178A (ja) * 2011-02-14 2012-09-06 Nitto Denko Corp 加熱剥離型粘着シート
WO2013114956A1 (ja) * 2012-01-30 2013-08-08 日東電工株式会社 伸長性加熱剥離型粘着シート
JP3228693U (ja) * 2020-07-30 2020-11-05 株式会社Ａｊ 高温型熱剥離テープ

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