WO2022095140A1 - 可拉伸显示模组及其制备方法 - Google Patents

可拉伸显示模组及其制备方法 Download PDF

Info

Publication number
WO2022095140A1
WO2022095140A1 PCT/CN2020/130510 CN2020130510W WO2022095140A1 WO 2022095140 A1 WO2022095140 A1 WO 2022095140A1 CN 2020130510 W CN2020130510 W CN 2020130510W WO 2022095140 A1 WO2022095140 A1 WO 2022095140A1
Authority
WO
WIPO (PCT)
Prior art keywords
islands
layer
display
stretchable
island
Prior art date
Application number
PCT/CN2020/130510
Other languages
English (en)
French (fr)
Inventor
胡丽
尹炳坤
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US17/280,868 priority Critical patent/US11916052B2/en
Publication of WO2022095140A1 publication Critical patent/WO2022095140A1/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386Geometry or layout of the interconnection structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/18Tiled displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/29198Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199Material of the matrix
    • H01L2224/2929Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32135Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32137Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331Disposition
    • H01L2224/3318Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181On opposite sides of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/83005Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909Post-treatment of the layer connector or bonding area
    • H01L2224/83951Forming additional members, e.g. for reinforcing, fillet sealant
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95001Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/0715Polysiloxane
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/005Processes relating to semiconductor body packages relating to encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the invention relates to the field of display technology, in particular to a stretchable display module and a preparation method thereof.
  • the present invention provides a stretchable display module and a preparation method.
  • the stretchable display module has both high stretch ratio and strength.
  • the present invention provides a stretchable display module, the stretchable display module includes:
  • the display layer includes a plurality of display islands, the plurality of display islands are arranged in an array and are arranged at intervals from each other, and the two adjacent display islands are electrically connected by connecting wires;
  • a transparent adhesive layer including a filling adhesive layer filled in the spaced regions between the plurality of display islands, a first adhesive layer disposed on the surface of the display layer away from the light-emitting direction of the display layer, and a first adhesive layer disposed on the display layer
  • a second adhesive layer on the surface in the light-emitting direction, the transparent adhesive layer makes a plurality of the display islands bond as a whole.
  • the stretchable display module further includes:
  • the second stretchable layer is attached to the second adhesive layer.
  • each of the display islands independently includes a flexible substrate island, and the array driving islands arranged on the flexible substrate island are arranged on the flexible substrate island.
  • the connecting wires are curved wires.
  • the stretchable display module is divided into:
  • the stretching area includes a display area and a gate driving circuit area arranged outside the display area, wherein a plurality of the display islands are arranged in the display area, and the gate driving circuit area includes A plurality of gate driving circuit islands are arranged spaced apart from each other, and two adjacent gate driving circuit islands, and adjacent gate driving circuit islands and display islands are electrically connected through the connecting wires; and
  • the non-stretching area is connected to one side of the stretching area, and the non-stretching area includes a frame wiring and a binding area.
  • materials of the first stretchable layer and the second stretchable layer include polydimethylsiloxane.
  • the material of the transparent adhesive layer is an adhesive adhesive material including polydimethylsiloxane.
  • each of the display islands includes a plurality of sub-pixels arranged in an array.
  • the Young's modulus of the first stretchable layer is greater than or equal to 80% of the Young's modulus of the transparent adhesive layer, and less than or equal to the 120% of the Young's modulus of the transparent adhesive layer
  • the Young's modulus of the second stretchable layer is greater than or equal to 80% of the Young's modulus of the transparent adhesive layer, and less than or equal to the 120% of Young's modulus.
  • the connecting wires and the array driving islands are disposed on the same layer.
  • the display device island includes an OLED display device or a Micro LED display device.
  • the curved wiring is formed by connecting wiring portions that are bent and extended in at least two different directions.
  • the gate driving circuit island includes a second flexible substrate island and a gate driving circuit disposed on the second flexible substrate island.
  • the frame wiring is electrically connected to the adjacent display island and the gate driving circuit island through the connection wiring.
  • the present invention also provides a preparation method of a stretchable display module, the preparation method comprising the following steps:
  • S101 provide a rigid substrate, and form a flexible substrate on the rigid substrate;
  • S102 Forming a plurality of array driving islands and connecting lines electrically connected between the adjacent array driving islands on the flexible substrate, the plurality of array driving islands are arranged in an array and spaced apart from each other ;
  • S103 correspondingly form a plurality of display device islands on a plurality of the array drive islands;
  • S104 correspondingly form a plurality of package islands on a plurality of the display device islands;
  • S107 Perform a patterning process on the flexible substrate, remove a plurality of flexible substrates corresponding to the spaced regions of the array driving islands, to form a plurality of flexible substrate islands corresponding to the plurality of the array driving islands, and then obtain a plurality of display islands arranged in an array and spaced apart from each other, each of the display islands including the flexible substrate island, the array drive island, the display device island and the package island which are stacked in sequence;
  • S108 providing a first stretchable layer, forming a first adhesive layer on the first stretchable layer, and adhering the first adhesive layer to a plurality of the flexible substrate islands to drive away from the array the surface of the island;
  • S111 Provide a second stretchable layer and attach it to the second adhesive layer.
  • the patterning process is completed by an exposure etching process or a laser cutting process.
  • the filling glue layer and the second glue layer are simultaneously formed through a process.
  • the present invention also provides a preparation method of a stretchable display module, the preparation method comprising the following steps:
  • S201 provide a rigid substrate, and form a flexible substrate on the rigid substrate;
  • S202 forming a plurality of array driving islands and connecting wires electrically connected between adjacent array driving islands on the flexible substrate, the plurality of array driving islands are arranged in an array and arranged at intervals from each other ;
  • S203 correspondingly form a plurality of display device islands on a plurality of the array drive islands;
  • S204 correspondingly form a plurality of package islands on a plurality of the display device islands;
  • a first filling glue layer is formed in the spaced regions of a plurality of stacked structures formed by the display device island and the packaging island, and a second filling layer is formed on the surfaces of the plurality of packaging islands away from the display device island an adhesive layer, which provides a first stretchable layer and is attached to the second adhesive layer;
  • S208 Perform a patterning process on the flexible substrate, remove a plurality of flexible substrates corresponding to the spaced regions of the array driving islands, to form a plurality of flexible substrate islands corresponding to the plurality of the array driving islands, and then obtain a plurality of display islands arranged in an array and spaced apart from each other, each of the display islands including the flexible substrate island, the array drive island, the display device island and the package island which are stacked in sequence;
  • S209 forming a second filling glue layer on the spaced regions of the plurality of flexible substrate islands, and forming a first glue layer on the surfaces of the plurality of flexible substrate islands facing away from the array driving islands;
  • the present invention provides a stretchable display module and a preparation method thereof.
  • the stretchable display module includes a display layer, and the display layer consists of display islands spaced apart from each other, and The connection traces connecting adjacent display islands are formed.
  • the Young's modulus of the overall display layer is reduced to obtain a greater stretch ratio, and a transparent adhesive is arranged at the same time.
  • the layer bonds the separated display islands to each other to form a whole, thereby improving the strength of the display layer composed of the independent display islands, and has the effect of suppressing the distortion and deformation of the panel display during stretching.
  • FIG. 1 is a schematic cross-sectional structure diagram of a stretchable display module provided by an embodiment of the present invention
  • FIG. 2 is a schematic plan view of a stretchable display module provided by an embodiment of the present invention.
  • 3a-3h are schematic structural flow diagrams of a method for preparing a stretchable display module provided by an embodiment of the present invention.
  • FIG. 4 is a schematic flow chart of a text flow diagram of a method for preparing a stretchable display module provided by an embodiment of the present invention
  • FIG. 5a-5h are schematic structural flow diagrams of another method for preparing a stretchable display module provided by an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a text flow of another method for preparing a stretchable display module provided by an embodiment of the present invention.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as “first”, “second” may expressly or implicitly include one or more of said features. In the description of the present invention, “plurality” means two or more, unless otherwise expressly and specifically defined.
  • An embodiment of the present invention provides a stretchable display module, which is described in detail below with reference to the schematic cross-sectional structure provided in FIG. 1 and the schematic plan structure provided in FIG. 2 :
  • the stretchable display module includes:
  • the display layer includes a plurality of display islands A111 (only 3 are exemplarily shown in the figure), the plurality of display islands A111 are arranged in an array and are spaced apart from each other, and two adjacent display islands A111
  • the electrical connection is realized by connecting the wiring L1, and the connecting wiring L1 usually includes a data line and a signal line as a signal transmission path between the display islands A111 arranged at intervals;
  • the transparent glue layer 120 includes a filling glue layer 121 filled in the spaced regions between the plurality of display islands A111, and a filling glue layer 121 disposed on the display layer away from the light-emitting direction of the display layer (the light-emitting direction of the display layer is defined as FIG. 2 ).
  • the first adhesive layer 122 on the surface of the display layer, the second adhesive layer 123, the filling adhesive layer 121, the first adhesive layer 122 and the The two adhesive layers 123 are bonded to each other to form an integral transparent adhesive layer, and a plurality of the display islands are bonded as a whole.
  • the display layers are set as display islands arranged at intervals from each other, and then the electrical conduction between the adjacent display islands is realized by arranging connecting wires.
  • the Young's modulus of the overall display layer is reduced to obtain a larger elongation ratio.
  • a transparent adhesive layer is arranged to bond the separated display islands to each other to form a whole, thereby improving the performance of the independent display islands.
  • the strength of the constituted display layer has the effect of suppressing distortion of the panel display when stretched.
  • the stretchable display module further includes: a first stretchable layer 130 attached to the first adhesive layer 122; and a second stretchable layer 140 attached to the on the second adhesive layer 123 .
  • each of the display islands A111 independently includes a flexible substrate island 111 and an array drive island 112 disposed on the flexible substrate island 111. It is added that the connection is The lines are disposed on the same layer as the array driving island 112 , the display device island 113 disposed on the array driving island 112 , and the package island 114 disposed on the display device island 113 . That is, each structural layer in the display layer is separated into independent islands.
  • the conventional flexible substrate formed on the entire surface is patterned into a plurality of independently spaced flexible substrate islands 111, which can avoid the flexibility of the flexible substrate due to the material of the flexible substrate. The large Young's modulus itself causes the problem of low elongation.
  • the conventionally formed encapsulation layer is also patterned into a plurality of independently spaced encapsulation islands 114, and each encapsulation island corresponds to each display.
  • the display device islands 113 in the island A111 are independently packaged, thereby avoiding the risk of package failure due to cracks in the package layer caused by stretching, and improving the reliability of the stretchable display module.
  • the flexible substrate island is the flexible substrate usually provided in the flexible display panel, which can be a polyimide film, or a silicon nitride/oxide sandwich sandwiched in the middle layer.
  • the flexible substrate of the display area is patterned into several islands arranged at intervals, so it is defined as a flexible substrate island;
  • the array drive island includes a drive circuit for driving the upper display device island, and specifically includes a plurality of thin film transistors arranged in an array;
  • the display device island includes a plurality of display devices that are arranged in a one-to-one correspondence with a plurality of arrayed thin film transistors in the array drive island and are electrically connected to each other, and the display devices may be OLED display devices, Micro LED display devices or other display devices that can be driven by thin film transistors;
  • the encapsulation island is a structural layer for encapsulating the display device island. As a barrier layer, water and oxygen in the external environment are inhibited from entering and invading the display device in the display device island, so as to avoid the occurrence of display device failure.
  • the encapsulation form of the encapsulation island is usually thin-film encapsulation, including a stacked inorganic film layer/organic film layer/inorganic film layer;
  • the above-mentioned flexible substrate island, array driving island, display device island and package island are correspondingly stacked and arranged, that is, the display island is formed.
  • connection lines and the array drive islands are disposed on the same layer, that is, the connection lines are electrically connected to the adjacent array drive islands to realize the adjacent display islands A telecommunication connection between them to transmit electrical signals.
  • connection trace L1 is a curved trace, for example, the connection trace L1 can be a wave trace, more specifically, a trace extending along at least two different directions.
  • the wire connection is formed, that is, an S-shaped wire as shown in FIG. 2 is formed, so as to reduce the risk of breakage of the connection wire when stretching.
  • connection line L1 may be any other line type, and it only needs to ensure that the actual length of the connection line L1 is greater than the interval width between the connected adjacent display islands A111 , which is not specifically limited in the present invention.
  • the stretchable display module is divided into:
  • the stretching area A1 includes a display area A11 and a gate driving circuit area A12 arranged outside the display area, wherein a plurality of the display islands A111 are arranged in the display area A11, the
  • the gate drive circuit area A12 includes a plurality of gate drive circuit islands A121 spaced apart from each other, and the gate drive circuit islands A121 generally include a second flexible substrate island (arranged at the same layer as the flexible substrate island of the display island A111) and a second flexible substrate island.
  • the gate drive circuit disposed on the second flexible substrate island, the adjacent two gate drive circuit islands A121, and the adjacent gate drive circuit island A121 and the display island A111 are also connected through the connection
  • the trace L1 is electrically connected; and
  • the non-stretching area A2 is connected to one side of the stretching area A1, and the non-stretching area A2 includes the frame wiring and the binding area (not specifically shown in the figure, usually including the The binding terminal for the FPC flexible circuit board to be bound), similarly, the frame wiring is electrically connected to the adjacent display island A111 and the gate driving circuit island A121 through the connection wiring L1, wherein , the non-stretching area A2 includes a flexible substrate disposed on the same layer as the flexible substrate island 111, but the flexible substrate in the non-stretching area A2 is not patterned and is a complete film layer, which inhibits the Stretching in non-stretching zone A2.
  • the glue filling layer 120 is of course also filled in the adjacent two display islands, gate driving circuit islands A121, adjacent gate driving circuit islands A121 and display islands A111, and non- The space between the stretching area A2 and the gate driving circuit island A121 and the display island A111, that is, all the gaps between the first stretchable layer 130 and the second stretchable layer 140 are filled with the glue Layer 120 is filled to bond to form the finished monolith.
  • the material of the first stretchable layer and the second stretchable layer is a stretchable transparent material, for example, the first stretchable layer and the second stretchable layer are
  • the material of the stretchable layer includes polydimethylsiloxane having a lower Young's modulus.
  • the material of the transparent adhesive layer is selected from a stretchable transparent adhesive adhesive.
  • the material of the transparent adhesive layer is an adhesive adhesive comprising polydimethylsiloxane.
  • the material of the transparent adhesive layer can also be an optically transparent adhesive or an optically transparent resin commonly used in the art for bonding the film layer structure.
  • the Young's modulus of the first stretchable layer, the second stretchable layer and the transparent adhesive layer generally need to be relatively close to avoid the first stretchable layer, The difference between the second stretchable layer and the transparent adhesive layer is too large, resulting in poor interface peeling during stretching.
  • each of the display islands includes a plurality of sub-pixels arranged in an array, and the size of each of the display islands and the spacing between adjacent display islands are determined according to actual process requirements, which are not implemented in the present invention. limited.
  • the embodiment of the present invention also provides a method for preparing the above-mentioned stretchable display module, which is a schematic structural flow diagram of the preparation method provided in conjunction with FIG. 3a- FIG. The description of the preparation steps only shows the cross-sectional structure of the display area, and will not affect the understanding of the preparation method), and Figure 4 is a schematic diagram of the text flow of the preparation method provided, which is explained in detail as follows:
  • the preparation method includes:
  • S101 Provide a rigid substrate 200, form a flexible substrate 210 on the rigid substrate 200, the rigid substrate 200 is usually a glass substrate, and the flexible substrate 210 is usually a polyimide film;
  • S102 Form an array driving layer 220 on the flexible substrate 210, and the array driving layer 220 includes a plurality of array driving islands 221 and connecting lines electrically connected between the adjacent array driving islands 221 (Fig. (not shown in the figure), the plurality of array driving islands 221 are arranged in an array and are spaced apart from each other.
  • the array driving layer 220 also includes gate driving circuit islands outside the display area, frame wiring and bonding Terminals, etc., see the above embodiments for details;
  • S103 correspondingly form a plurality of display device islands 230 on the plurality of the array drive islands 221, and the display device islands 230 are OLED type display device islands or Micro LED type display device islands;
  • S104 correspondingly form a plurality of package islands 240 on the plurality of display device islands 230, that is, to form the structure shown in FIG. 3a;
  • S105 forming a protective layer 250 on the plurality of packaging islands 240, that is, forming the structure shown in FIG. 3b, the protective layer 250 is used to protect the lower packaging islands 240 from scratches and other damages in subsequent processes , and the protective layer 250 will not cause damage to the underlying package island 240 after subsequent peeling;
  • S106 peel off and remove the rigid substrate 200, so that the flexible substrate 210 is exposed, that is, the structure shown in FIG. 3c is formed, and the rigid substrate 200 is usually peeled off by a laser lift-off process;
  • S107 Perform a patterning process on the flexible substrate 210, and remove a plurality of flexible substrates corresponding to the spaced regions of the array driving islands 221 to form a plurality of flexible substrate islands corresponding to the plurality of the array driving islands 221 211, that is, to form the structure shown in FIG. 3d, a plurality of the flexible substrate islands 211, a plurality of the array driving islands 221, a plurality of the display device islands 230 and a plurality of the packaging islands are arranged in sequence. 240 form multiple display islands;
  • the surface away from the array drive island 221 forms the structure shown in FIG. 3e.
  • the first adhesive layer 261 can be formed by coating a prepolymerized colloid solution and then curing, or a solid adhesive layer of corresponding size can be used directly. , and is formed by pressing with a certain pressure after attaching;
  • S111 Provide the second stretchable layer 280 and attach it to the second adhesive layer 263, that is, the preparation is completed, and the stretchable display module as shown in FIG. 3h is formed.
  • the patterning process or other process that can be patterned is completed by an exposure etching process or a laser cutting process, which is not limited in the present invention.
  • the embodiment of the present invention also provides a preparation method of the above-mentioned stretchable display module, which is basically the same as the preparation method provided by the above-mentioned embodiment, and the difference is only that the order of some steps is exchanged.
  • the final structure of the formed stretchable display module is not affected, and the following schematic diagrams of the structure of the preparation method are provided in conjunction with Fig. 5a-Fig. 5h (it should be noted that, in order to describe the preparation steps more clearly, only shows The cross-sectional structure of the display area is not affected, and the understanding of the preparation method will not be affected), and Figure 6 is a schematic diagram of the text flow of the preparation method provided, which is explained in detail:
  • the preparation method comprises the following steps:
  • S201 provide a rigid substrate 300, and form a flexible substrate 310 on the rigid substrate 300;
  • An array driving layer 320 is formed on the flexible substrate 310, and the array driving layer 320 includes a plurality of array driving islands 321 and connecting lines electrically connected between the adjacent array driving islands 321 (Fig. (not shown), the plurality of array driving islands 321 are arranged in an array and are spaced apart from each other.
  • the array driving layer 320 also includes gate driving circuit islands outside the display area, frame wiring and bonding terminals, etc., see the above embodiments for details
  • S204 correspondingly form a plurality of package islands 340 on the plurality of display device islands 330, that is, to form the structure shown in FIG. 5a;
  • S205 In the array driving islands 321, the display device islands 330 and the packaging islands 340 are formed in the spaced regions of a plurality of stacked structures to form a first filling layer 351, and the plurality of packaging islands 340 face away from the display device islands A second adhesive layer 352 is formed on the surface of 330, a first stretchable layer 360 is provided, and is attached to the second adhesive layer 352, that is, the structure shown in FIG. 5b is formed;
  • S208 Perform a patterning process on the flexible substrate 310, and remove a plurality of flexible substrates corresponding to the spaced regions of the array driving islands 321 to form a plurality of flexible substrate islands corresponding to the plurality of the array driving islands 321 311, that is, to form the structure as shown in FIG. 5e, a plurality of the flexible substrate islands 311, a plurality of the array driving islands 321, a plurality of the display device islands 330 and a plurality of the packaging islands are arranged in sequence. 340 forms multiple display islands;

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种可拉伸显示模组及其制备方法,可拉伸显示模组包括:显示层,包括多个彼此间隔设置的显示岛(A111),相邻的两个显示岛(A111)通过连接走线(L1)实现电性连接;透明胶层(120),包括填充于多个显示岛(A111)之间的间隔区域的填充胶层(121),与配置于显示层背离显示层出光方向表面上的第一胶层(122),以及配置于显示层出光方向表面上的第二胶层(123)。

Description

可拉伸显示模组及其制备方法 技术领域
本发明涉及显示技术领域,具体涉及一种可拉伸显示模组及其制备方法。
背景技术
近年来,柔性显示技术已成为显示领域的研究热点之一,特别是,具有相对物理变形自由度更高的有机发光二极管(OLED)开辟了关于显示形态的新的可能性。可机械变形的显示设备不仅具有更好的美学效果,而且还可以为信息显示的原始形态带来巨大的改进。例如,目前已实现量产的可折叠显示器便完全改变了具有有限屏幕面积的移动显示器的概念,而对屏幕尺寸没有任何限制。类似地,可拉伸显示器可将这种屏幕尺寸限制的概念更进一步地打破。从理论上讲,可拉伸显示器能够使柔性显示器实现复杂的曲率变形,并且可以与任何类型的表面贴合。这些特性对于新的电子设备(如可穿戴设备、车载显示设备)的开发是必不可少的,近来引起了极大的关注。
如何实现可拉伸显示器较大的拉伸率,同时仍保留较高的强度以防止断裂以及抑制拉伸时面板显示的扭曲变形,仍为目前研究开发的难点之一。
技术问题
本发明提供一种可拉伸显示模组以及制备方法,该可拉伸显示模组兼具较高的拉伸率与强度。
技术解决方案
为解决上述问题,第一方面,本发明提供一种可拉伸显示模组,所述可拉伸显示模组包括:
显示层,包括多个显示岛,所述多个显示岛呈阵列排布,且彼此间隔设置,相邻的两个所述显示岛通过连接走线实现电性连接;
透明胶层,包括填充于所述多个显示岛之间的间隔区域的填充胶层,配置于所述显示层背离所述显示层出光方向表面上的第一胶层,以及配置于所述显示层出光方向表面上的第二胶层,所述透明胶层使得多个所述显示岛粘结为一个整体。
在本发明实施例提供的一可拉伸显示模组中,所述可拉伸显示模组还包括:
第一可拉伸层,贴附于所述第一胶层上;以及
第二可拉伸层,贴附于所述第二胶层上。
在本发明实施例提供的一可拉伸显示模组中,每一所述显示岛均各自独立地包括柔性衬底岛,配置于所述柔性衬底岛上的阵列驱动岛,配置于所述阵列驱动岛上的显示器件岛,以及配置于所述显示器件岛上的封装岛。
在本发明实施例提供的一可拉伸显示模组中,所述连接走线为曲线型走线。
在本发明实施例提供的一可拉伸显示模组中,所述可拉伸显示模组划分为:
拉伸区,所述拉伸区包括显示区与配置于所述显示区外侧的栅极驱动电路区,其中,多个所述显示岛配置于所述显示区,所述栅极驱动电路区包括彼此间隔设置多个栅极驱动电路岛,相邻的两个所述栅极驱动电路岛,以及相邻的栅极驱动电路岛与显示岛通过所述连接走线实现电性连接;以及
非拉伸区,与所述拉伸区的一侧边相连,所述非拉伸区包括边框走线与绑定区。
在本发明实施例提供的一可拉伸显示模组中,所述第一可拉伸层与所述第二可拉伸层的材料包括聚二甲基硅氧烷。
在本发明实施例提供的一可拉伸显示模组中,所述透明胶层的材料为包含聚二甲基硅氧烷的粘性胶材。
在本发明实施例提供的一可拉伸显示模组中,每一所述的显示岛均包括多个阵列排布的子像素。
在本发明实施例提供的一可拉伸显示模组中,所述第一可拉伸层的杨氏模量大于等于所述透明胶层的杨氏模量的80%,且小于等于所述透明胶层的杨氏模量的120%,所述第二可拉伸层的杨氏模量大于等于所述透明胶层的杨氏模量的80%,且小于等于所述透明胶层的杨氏模量的120%。
在本发明实施例提供的一可拉伸显示模组中,所述连接走线与所述阵列驱动岛同层设置。
在本发明实施例提供的一可拉伸显示模组中,所述显示器件岛包括OLED显示器件或Micro LED显示器件。
在本发明实施例提供的一可拉伸显示模组中,所述曲线型走线由沿至少两个不同方向弯曲延伸的走线部连接形成。
在本发明实施例提供的一可拉伸显示模组中,所述栅极驱动电路岛包括第二柔性衬底岛与设于所述第二柔性衬底岛上的栅极驱动电路。所述边框走线与相邻的所述显示岛与栅极驱动电路岛通过所述连接走线实现电性连接。另一方面,本发明还提供了一种可拉伸显示模组的制备方法,所述制备方法包括如下步骤:
S101:提供一刚性基板,在所述刚性基板上形成柔性衬底;
S102:在所述柔性衬底形成多个阵列驱动岛以及电性连接于相邻的所述阵列驱动岛之间的连接走线,所述多个阵列驱动岛呈阵列排布,且彼此间隔设置;
S103:在多个所述阵列驱动岛上对应地形成多个显示器件岛;
S104:在多个所述显示器件岛上对应地形成多个封装岛;
S105:在所述多个封装岛上形成保护层;
S106:剥离去除所述刚性基板;
S107:对所述柔性衬底进行图案化制程,去除多个所述阵列驱动岛间隔区域对应的柔性衬底,以形成与多个所述阵列驱动岛对应的多个柔性衬底岛,进而得到呈阵列排布且彼此间隔的多个显示岛,每个所述显示岛包括依次层叠设置的所述柔性衬底岛,所述阵列驱动岛,所述显示器件岛以及所述封装岛;
S108:提供第一可拉伸层,在所述第一可拉伸层上形成第一胶层,并将所述第一胶层粘附于多个所述柔性衬底岛背离所述阵列驱动岛的表面;
S109:剥离去除所述保护层;
S110:在多个所述显示岛的间隔区域形成填充胶层,并在多个所述封装岛背离所述显示器件岛的表面形成第二胶层;以及
S111: 提供第二可拉伸层,并贴附于所述第二胶层上。
在本发明实施例提供的一可拉伸显示模组的制备方法中,在所述步骤S107中,通过曝光蚀刻工艺或激光切割工艺完成所述图案化制程。
在本发明实施例提供的一可拉伸显示模组的制备方法中,在所述步骤S110中,所述填充胶层与所述第二胶层通过一道制程同时形成。
另一方面,本发明还提供了一种可拉伸显示模组的制备方法,所述制备方法包括如下步骤:
S201:提供一刚性基板,在所述刚性基板上形成柔性衬底;
S202:在所述柔性衬底形成多个阵列驱动岛以及电性连接于相邻的所述阵列驱动岛之间的连接走线,所述多个阵列驱动岛呈阵列排布,且彼此间隔设置;
S203:在多个所述阵列驱动岛上对应地形成多个显示器件岛;
S204:在多个所述显示器件岛上对应地形成多个封装岛;
S205:在所述阵列驱动岛,显示器件岛与封装岛形成的多个堆叠结构的间隔区域形成第一填充胶层,并在多个所述封装岛背离所述显示器件岛的表面形成第二胶层,提供第一可拉伸层,并贴附于所述第二胶层上;
S206:在所述第一可拉伸层上形成保护层;
S207:剥离去除所述刚性基板;
S208: 对所述柔性衬底进行图案化制程,去除多个所述阵列驱动岛间隔区域对应的柔性衬底,以形成与多个所述阵列驱动岛对应的多个柔性衬底岛,进而得到呈阵列排布且彼此间隔的多个显示岛,每个所述显示岛包括依次层叠设置的所述柔性衬底岛,所述阵列驱动岛,所述显示器件岛以及所述封装岛;
S209: 在多个所述柔性衬底岛的间隔区域形成第二填充胶层,并在多个所述柔性衬底岛背离所述阵列驱动岛的表面形成第一胶层;
S210: 提供第二可拉伸层,并贴附于所述第一胶层上;以及
S211: 剥离去除所述保护层。
有益效果
相较于现有技术,本发明提供了一种可拉伸显示模组及其制备方法,所述可拉伸显示模组包括显示层,而所述显示层由彼此间隔设置的显示岛,以及连接相邻显示岛的连接走线形成,如此一来,通过将显示层分隔成独立的岛状,从而降低了整体显示层的杨氏模量以获得更大的拉伸率,同时设置透明胶层将分隔开来的显示岛相互粘结形成一个整体,从而提高了由独立的显示岛构成的显示层的强度,起到抑制拉伸时面板显示的扭曲变形的效果。
附图说明
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的一种可拉伸显示模组的截面结构示意图;
图2是本发明实施例提供的一种可拉伸显示模组的平面结构示意图;
图3a-图3h是本发明实施例提供的一种可拉伸显示模组的制备方法的结构流程示意图;
图4是本发明实施例提供的一种可拉伸显示模组的制备方法的文字流程示意图;
图5a-图5h是本发明实施例提供的另一种可拉伸显示模组的制备方法的结构流程示意图;
图6是本发明实施例提供的另一种可拉伸显示模组的制备方法的文字流程示意图。
本发明的实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。
在本申请中,“示例性”一词用来表示“用作例子、例证或说明”。本申请中被描述为“示例性”的任何实施例不一定被解释为比其它实施例更优选或更具优势。为了使本领域任何技术人员能够实现和使用本发明,给出了以下描述。在以下描述中,为了解释的目的而列出了细节。应当明白的是,本领域普通技术人员可以认识到,在不使用这些特定细节的情况下也可以实现本发明。在其它实例中,不会对公知的结构和过程进行详细阐述,以避免不必要的细节使本发明的描述变得晦涩。因此,本发明并非旨在限于所示的实施例,而是与符合本申请所公开的原理和特征的最广范围相一致。
本发明实施例提供一种可拉伸显示模组,以下结合图1提供的截面结构示意图以及图2提供的平面结构示意图,进行详细说明:
所述可拉伸显示模组包括:
显示层,包括多个显示岛A111(图中仅示例性地示出了3个),所述多个显示岛A111呈阵列排布,且彼此间隔设置,相邻的两个所述显示岛A111通过连接走线L1实现电性连接,所述连接走线L1通常包括数据线与信号线,作为间隔设置的显示岛A111之间的信号传输路径;
透明胶层120,包括填充于所述多个显示岛A111之间的间隔区域的填充胶层121,与配置于所述显示层背离所述显示层出光方向(将显示层出光方向定义为图2中向上的方向)表面上的第一胶层122,以及配置于所述显示层出光方向表面上的第二胶层123,所述填充胶层121,所述第一胶层122以及所述第二胶层123之间相互粘结形成整体的透明胶层,并使得多个所述显示岛粘结为一个整体。
通过上述设计,将所述显示层设置为彼此间隔排布的显示岛,再通过设置连接走线实现连接相邻显示岛的电性导通,如此一来,通过将显示层分隔成独立的岛状,从而降低了整体显示层的杨氏模量以获得更大的拉伸率,同时设置透明胶层将分隔开来的显示岛相互粘结形成一个整体,从而提高了由独立的显示岛构成的显示层的强度,起到抑制拉伸时面板显示的扭曲变形的效果。
在一些实施例中,所述可拉伸显示模组还包括:第一可拉伸层130,贴附于所述第一胶层122上;以及第二可拉伸层140,贴附于所述第二胶层123上。通过设置上下两层可拉伸层作为支撑层,可进一步提升显示层的强度,起到抑制拉伸时面板显示的扭曲变形的效果。
在一些实施例中,每一所述的显示岛A111均各自独立地包括柔性衬底岛111,配置于所述柔性衬底岛111上的阵列驱动岛112,补充说明的是,所述连接走线与所述阵列驱动岛112同层设置,配置于所述阵列驱动岛112上的显示器件岛113,以及配置于所述显示器件岛113上的封装岛114。即,显示层中的各个结构层均分隔为独立的岛,第一方面,常规整面形成的柔性衬底经图案化成多个独立间隔的柔性衬底岛111,即可避免因柔性衬底材质本身较大的杨氏模量造成拉伸率较低的问题,另一方面,常规整面形成的封装层同样经图案形化成多个独立间隔的封装岛114,每一封装岛对每一显示岛A111中的显示器件岛113进行独立地封装,从而避免了因拉伸造成封装层出现裂纹而导致封装失效的风险,提升该可拉伸显示模组的可靠性。
补充说明的是,在本发明提供的实施例中,所述柔性衬底岛即为柔性显示面板中通常设置的柔性衬底,可为聚酰亚胺薄膜,或中层夹设氮化硅/氧化硅薄膜的双层聚酰亚胺薄膜,出于本发明的特殊结构设计,将显示区的柔性衬底图案化为若干个间隔设置的岛状,故将其定义为柔性衬底岛;
其他结构命名同理,具体地,所述阵列驱动岛包括用于驱动上层显示器件岛的驱动电路,具体包括多个阵列排布的薄膜晶体管;
所述显示器件岛包括与所述阵列驱动岛中的多个阵列排布的薄膜晶体管一一对应配置并相互电连接的多个显示器件,所述显示器件可为OLED显示器件,Micro LED显示器件或其他可由薄膜晶体管驱动的显示器件;
所述封装岛则为对所述显示器件岛进行封装的结构层,作为阻隔层抑制外界环境中的水氧进入并侵袭所述显示器件岛中的显示器件,从而避免显示器件失效的发生,所述封装岛的封装形式通常为薄膜封装,包括层叠设置的无机膜层/有机膜层/无机膜层;
上述的柔性衬底岛,阵列驱动岛,显示器件岛以及封装岛对应地层叠设置,即形成所述显示岛。
在一些实施例中,所述连接走线与所述阵列驱动岛同层设置,即,所述连接走线通过将相邻的阵列驱动岛进行电性连接,而实现所述相邻的显示岛之间的电信连接,得以传输电信号。
在一些实施例中,所述连接走线L1为曲线型走线,示例性地,所述连接走线L1可为波浪型走线,更具体地,可由沿至少两个不同方向弯曲延伸的走线部连接形成,即形成如图2中所示的S型走线,以降低拉伸时连接走线断裂的风险。当然所述连接走线L1可为其他任意的线型,仅需保证所述连接走线L1的实际长度大于所连接的相邻显示岛A111之间的间隔宽度,本发明对此不作具体限定。
在一些实施例中,所述可拉伸显示模组划分为:
拉伸区A1,所述拉伸区A1包括显示区A11与配置于所述显示区外侧的栅极驱动电路区A12,其中,多个所述显示岛A111配置于所述显示区A11,所述栅极驱动电路区A12包括彼此间隔设置多个栅极驱动电路岛A121,所述栅极驱动电路岛A121通常包括第二柔性衬底岛(与显示岛A111的柔性衬底岛同层设置)与设于所述第二柔性衬底岛上的栅极驱动电路,相邻的两个所述栅极驱动电路岛A121,以及相邻的栅极驱动电路岛A121与显示岛A111同样通过所述连接走线L1实现电性连接;以及
非拉伸区A2,与所述拉伸区A1的一侧边相连,所述非拉伸区A2包括边框走线与绑定区(图中未具体示出,通常包括与COF覆晶薄膜/FPC柔性电路板进行绑定的绑定端子),同样地,所述边框走线与相邻的所述显示岛A111与栅极驱动电路岛A121通过所述连接走线L1实现电性连接,其中,所述非拉伸区A2包含与所述柔性衬底岛111同层设置的柔性衬底,但所述非拉伸区A2的柔性衬底未经图案化,为完整的膜层,抑制了非拉伸区A2的拉伸。
另外,很容易理解的是,所述填充胶层120当然也填充于相邻的两个所述显示岛栅极驱动电路岛A121,相邻的栅极驱动电路岛A121与显示岛A111,以及非拉伸区A2与栅极驱动电路岛A121与显示岛A111之间的间隔,即,所述第一可拉伸层130与第二可拉伸层140之间的所有间隙均被所述填充胶层120填充,以粘结形成完成的整体。
在一些实施例中,所述第一可拉伸层与所述第二可拉伸层的材料选用可拉伸的透明材料,示例性地,所述第一可拉伸层与所述第二可拉伸层的材料包括具有较低杨氏模量的聚二甲基硅氧烷。
在一些实施例中,所述透明胶层的材料选自可拉伸的透明粘性胶材,示例性地,所述透明胶层的材料为包含聚二甲基硅氧烷的粘性胶材,当然所述透明胶层的材料也可采用本领域常用的用于粘结膜层结构的光学透明胶或光学透明树脂。
在一些实施例中,所述第一可拉伸层,所述第二可拉伸层与所述透明胶层的杨氏模量通常需较为接近,以避免所述第一可拉伸层,所述第二可拉伸层与所述透明胶层因拉伸率相差过大,导致拉伸时界面剥离的不良,具体地,80%×(所述透明胶层的杨氏模量)≤第一可拉伸层的杨氏模量≤120%×(所述透明胶层的杨氏模量),80%×(所述透明胶层的杨氏模量)≤第二可拉伸层的杨氏模量≤120%×(所述透明胶层的杨氏模量),更进一步地,90%×(所述透明胶层的杨氏模量)≤第一可拉伸层的杨氏模量≤110%×(所述透明胶层的杨氏模量),90%×(所述透明胶层的杨氏模量)≤第二可拉伸层的杨氏模量≤110%×(所述透明胶层的杨氏模量)。
补充说明的是,每一所述的显示岛均包括若干个阵列排布的子像素,每一所述显示岛大小及相邻显示岛的间距根据实际的工艺需求而定,本发明对此不作限定。
另一方面,本发明实施例还提供了一种上述可拉伸显示模组的制备方法,结合图3a-图3h提供的该制备方法的结构流程示意图(需要说明的是,为了更清楚的进行制备步骤的描述,仅示出了显示区的截面结构,对制备方法的理解不会造成影响),以及图4是提供的该制备方法的文字流程示意图,进行如下详细说明:
具体地,所述制备方法包括:
S101:提供一刚性基板200,在所述刚性基板200上形成柔性衬底210,所述刚性基板200通常为玻璃基板,所述柔性衬底210通常为聚酰亚胺膜;
S102:在所述柔性衬底210形成阵列驱动层220,所述阵列驱动层220包括多个阵列驱动岛221以及电性连接于相邻的所述阵列驱动岛221之间的连接走线(图中未示出),所述多个阵列驱动岛221呈阵列排布,且彼此间隔设置,当然所述阵列驱动层220在显示区之外还包括栅极驱动电路岛,边框走线与绑定端子等,详见上述的实施例;
S103:在多个所述阵列驱动岛221上对应地形成多个显示器件岛230,所述显示器件岛230为OLED型显示器件岛或Micro LED型显示器件岛;
S104:在多个所述显示器件岛230上对应地形成多个封装岛240,即形成如图3a所示的结构;
S105:在所述多个封装岛240上形成保护层250,即形成如图3b所示的结构,所述保护层250用于保护下层的所述封装岛240在后续制程免受划伤等损伤,并且所述保护层250在后续剥离后也不会对下层的封装岛240造成损伤;
S106:剥离去除所述刚性基板200,使得柔性衬底210显露,即形成如图3c所示的结构,所述刚性基板200通常通过激光剥离工艺完成剥离;
S107:对所述柔性衬底210进行图案化制程,去除多个所述阵列驱动岛221间隔区域对应的柔性衬底,以形成与多个所述阵列驱动岛221对应的多个柔性衬底岛211,即形成如图3d所示的结构,依次层叠设置的多个所述柔性衬底岛211,多个所述阵列驱动岛221,多个所述显示器件岛230以及多个所述封装岛240形成多个显示岛;
S108:提供第一可拉伸层270,在所述第一可拉伸层270上形成第一胶层261,并将所述第一胶层261粘附于多个所述柔性衬底岛211背离所述阵列驱动岛221的表面,即形成如图3e所示的结构,所述第一胶层261可通过涂布预聚胶体溶液后经固化形成,也可直接使用对应大小的固态胶层,贴附后使用一定压力压合形成;
S109:剥离去除所述保护层250,即形成如图3f所示的结构;
S110:在多个所述显示岛的间隔区域形成填充胶层262,并在多个所述封装岛240背离所述显示器件岛230的表面形成第二胶层263,即形成所述图3g所示的结构,所述填充胶层262与所述第二胶层263可通过一道制程同时形成,所形成的填充胶层262与所述第二胶层263以及第一胶层261相互粘结形成整体的透明胶层,并使得多个所述显示岛粘结为一个整体;以及
S111: 提供第二可拉伸层280,并贴附于所述第二胶层263上,即制备完成,形成如图3h所示的可拉伸显示模组。
在一些实施例中,在所述步骤S107中,通过曝光蚀刻工艺或激光切割工艺完成所述图案化制程或其他可进行图案化的工艺,本发明对此不作限定。
另一方面,本发明实施例还提供了一种上述可拉伸显示模组的制备方法,与上述实施例提供的制备方法大体相同,不同之处仅在于部分步骤的顺序进行了调换,对所形成的可拉伸显示模组的最终结构不造成影响,以下结合图5a-图5h提供的该制备方法的结构流程示意图(需要说明的是,为了更清楚的进行制备步骤的描述,仅示出了显示区的截面结构,对制备方法的理解不会造成影响),以及图6是提供的该制备方法的文字流程示意图,进行详细说明:
该制备方法包括如下步骤:
S201:提供一刚性基板300,在所述刚性基板300上形成柔性衬底310;
S202: 在所述柔性衬底310形成阵列驱动层320,所述阵列驱动层320包括多个阵列驱动岛321以及电性连接于相邻的所述阵列驱动岛321之间的连接走线(图中未示出),所述多个阵列驱动岛321呈阵列排布,且彼此间隔设置,当然所述阵列驱动层320在显示区之外还包括栅极驱动电路岛,边框走线与绑定端子等,详见上述的实施例
S203:在多个所述阵列驱动岛321上对应地形成多个显示器件岛330;
S204:在多个所述显示器件岛330上对应地形成多个封装岛340,即形成如图5a所示的结构;
S205:在所述阵列驱动岛321,显示器件岛330与封装岛340形成的多个堆叠结构的间隔区域形成第一填充胶层351,并在多个所述封装岛340背离所述显示器件岛330的表面形成第二胶层352,提供第一可拉伸层360,并贴附于所述第二胶层352上,即形成如图5b所示的结构;
S206:在所述第一可拉伸层360上形成保护层370,即形成如图5c所示的结构;
S207:剥离去除所述刚性基板300,即形成如图5d所示的结构;
S208: 对所述柔性衬底310进行图案化制程,去除多个所述阵列驱动岛321间隔区域对应的柔性衬底,以形成与多个所述阵列驱动岛321对应的多个柔性衬底岛311,即形成如图5e所示的结构,依次层叠设置的多个所述柔性衬底岛311,多个所述阵列驱动岛321,多个所述显示器件岛330以及多个所述封装岛340形成多个显示岛;
S209: 在多个所述柔性衬底岛311的间隔区域形成第二填充胶层353,并在多个所述柔性衬底岛311背离所述阵列驱动岛321的表面形成第一胶层354,即形成如图5f所示的结构;
S210: 提供第二可拉伸层380,并贴附于所述第一胶层354上,即形成如图5g所示的结构;以及
S211: 剥离去除所述保护层370,即完成制备形成如图5h所示的可拉伸显示模组。
需要说明的是,上述可拉伸显示模组的实施例中仅描述了上述结构,可以理解的是,除了上述结构之外,还可以根据需要包括任何其他的必要结构,具体此处不作限定。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见上文针对其他实施例的详细描述,此处不再赘述。
以上对本发明实施例所提供的一种可拉伸显示模组及其制备方法进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想;同时,对于本领域的技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明的限制。

Claims (18)

  1. 一种可拉伸显示模组,其中,所述可拉伸显示模组包括:
    显示层,包括多个显示岛,所述多个显示岛呈阵列排布,且彼此间隔设置,相邻的两个所述显示岛通过连接走线实现电性连接;
    透明胶层,包括填充于所述多个显示岛之间的间隔区域的填充胶层,配置于所述显示层背离所述显示层出光方向表面上的第一胶层,以及配置于所述显示层出光方向表面上的第二胶层,所述透明胶层使得多个所述显示岛粘结为一个整体。
  2. 如权利要求1所述的可拉伸显示模组,其中,所述可拉伸显示模组还包括:
    第一可拉伸层,贴附于所述第一胶层上;以及
    第二可拉伸层,贴附于所述第二胶层上。
  3. 如权利要求1所述的可拉伸显示模组,其中,每一所述显示岛均各自独立地包括柔性衬底岛,配置于所述柔性衬底岛上的阵列驱动岛,配置于所述阵列驱动岛上的显示器件岛,以及配置于所述显示器件岛上的封装岛。
  4. 如权利要求1所述的可拉伸显示模组,其中,所述连接走线为曲线型走线。
  5. 如权利要求1所述的可拉伸显示模组,其中,所述可拉伸显示模组划分为:
    拉伸区,所述拉伸区包括显示区与配置于所述显示区外侧的栅极驱动电路区,其中,多个所述显示岛配置于所述显示区,所述栅极驱动电路区包括彼此间隔设置多个栅极驱动电路岛,相邻的两个所述栅极驱动电路岛,以及相邻的栅极驱动电路岛与显示岛通过所述连接走线实现电性连接;以及
    非拉伸区,与所述拉伸区的一侧边相连,所述非拉伸区包括边框走线与绑定区。
  6. 如权利要求1所述的可拉伸显示模组,其中,所述第一可拉伸层与所述第二可拉伸层的材料包括聚二甲基硅氧烷。
  7. 如权利要求1所述的可拉伸显示模组,其中,所述透明胶层的材料为包含聚二甲基硅氧烷的粘性胶材。
  8. 如权利要求1所述的可拉伸显示模组,其中,每一所述的显示岛均包括多个阵列排布的子像素。
  9. 如权利要求2所述的可拉伸显示模组,其中,所述第一可拉伸层的杨氏模量大于等于所述透明胶层的杨氏模量的80%,且小于等于所述透明胶层的杨氏模量的120%,所述第二可拉伸层的杨氏模量大于等于所述透明胶层的杨氏模量的80%,且小于等于所述透明胶层的杨氏模量的120%。
  10. 如权利要求3所述的可拉伸显示模组,其中,所述连接走线与所述阵列驱动岛同层设置。
  11. 如权利要求3所述的可拉伸显示模组,其中,所述显示器件岛包括OLED显示器件或Micro LED显示器件。
  12. 如权利要求4所述的可拉伸显示模组,其中,所述曲线型走线由沿至少两个不同方向弯曲延伸的走线部连接形成。
  13. 如权利要求6所述的可拉伸显示模组,其中,所述栅极驱动电路岛包括第二柔性衬底岛与设于所述第二柔性衬底岛上的栅极驱动电路。
  14. 如权利要求6所述的可拉伸显示模组,其中,所述边框走线与相邻的所述显示岛与栅极驱动电路岛通过所述连接走线实现电性连接。
  15. 一种可拉伸显示模组的制备方法,其中,所述制备方法包括如下步骤:
    S101:提供一刚性基板,在所述刚性基板上形成柔性衬底;
    S102:在所述柔性衬底形成多个阵列驱动岛以及电性连接于相邻的所述阵列驱动岛之间的连接走线,所述多个阵列驱动岛呈阵列排布,且彼此间隔设置;
    S103:在多个所述阵列驱动岛上对应地形成多个显示器件岛;
    S104:在多个所述显示器件岛上对应地形成多个封装岛;
    S105:在所述多个封装岛上形成保护层;
    S106:剥离去除所述刚性基板;
    S107:对所述柔性衬底进行图案化制程,去除多个所述阵列驱动岛间隔区域对应的柔性衬底,以形成与多个所述阵列驱动岛对应的多个柔性衬底岛,进而得到呈阵列排布且彼此间隔的多个显示岛,每个所述显示岛包括依次层叠设置的所述柔性衬底岛,所述阵列驱动岛,所述显示器件岛以及所述封装岛;
    S108:提供第一可拉伸层,在所述第一可拉伸层上形成第一胶层,并将所述第一胶层粘附于多个所述柔性衬底岛背离所述阵列驱动岛的表面;
    S109:剥离去除所述保护层;
    S110:在多个所述显示岛的间隔区域形成填充胶层,并在多个所述封装岛背离所述显示器件岛的表面形成第二胶层;以及
    S111: 提供第二可拉伸层,并贴附于所述第二胶层上。
  16. 如权利要求15所述的可拉伸显示模组的制备方法,其中,在所述步骤S107中,通过曝光蚀刻工艺或激光切割工艺完成所述图案化制程。
  17. 如权利要求15所述的可拉伸显示模组的制备方法,其中,在所述步骤S110中,所述填充胶层与所述第二胶层通过一道制程同时形成。
  18. 一种可拉伸显示模组的制备方法,其中,所述制备方法包括如下步骤:
    S201:提供一刚性基板,在所述刚性基板上形成柔性衬底;
    S202:在所述柔性衬底形成多个阵列驱动岛以及电性连接于相邻的所述阵列驱动岛之间的连接走线,所述多个阵列驱动岛呈阵列排布,且彼此间隔设置;
    S203:在多个所述阵列驱动岛上对应地形成多个显示器件岛;
    S204:在多个所述显示器件岛上对应地形成多个封装岛;
    S205:在所述阵列驱动岛,显示器件岛与封装岛形成的多个堆叠结构的间隔区域形成第一填充胶层,并在多个所述封装岛背离所述显示器件岛的表面形成第二胶层,提供第一可拉伸层,并贴附于所述第二胶层上;
    S206:在所述第一可拉伸层上形成保护层;
    S207:剥离去除所述刚性基板;
    S208: 对所述柔性衬底进行图案化制程,去除多个所述阵列驱动岛间隔区域对应的柔性衬底,以形成与多个所述阵列驱动岛对应的多个柔性衬底岛,进而得到呈阵列排布且彼此间隔的多个显示岛,每个所述显示岛包括依次层叠设置的所述柔性衬底岛,所述阵列驱动岛,所述显示器件岛以及所述封装岛;
    S209: 在多个所述柔性衬底岛的间隔区域形成第二填充胶层,并在多个所述柔性衬底岛背离所述阵列驱动岛的表面形成第一胶层;
    S210: 提供第二可拉伸层,并贴附于所述第一胶层上;以及
    S211: 剥离去除所述保护层。
PCT/CN2020/130510 2020-11-09 2020-11-20 可拉伸显示模组及其制备方法 WO2022095140A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/280,868 US11916052B2 (en) 2020-11-09 2020-11-20 Stretchable display module and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011237892.9 2020-11-09
CN202011237892.9A CN112397559B (zh) 2020-11-09 2020-11-09 可拉伸显示模组及其制备方法

Publications (1)

Publication Number Publication Date
WO2022095140A1 true WO2022095140A1 (zh) 2022-05-12

Family

ID=74598122

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/130510 WO2022095140A1 (zh) 2020-11-09 2020-11-20 可拉伸显示模组及其制备方法

Country Status (3)

Country Link
US (1) US11916052B2 (zh)
CN (1) CN112397559B (zh)
WO (1) WO2022095140A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113593418B (zh) * 2021-08-11 2022-11-08 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法、移动终端
CN113689788A (zh) * 2021-08-12 2021-11-23 武汉华星光电半导体显示技术有限公司 曲面显示模组
CN113780179B (zh) * 2021-09-13 2023-08-29 武汉华星光电半导体显示技术有限公司 柔性显示模组及显示终端
CN114220831B (zh) * 2021-12-10 2023-12-01 武汉华星光电半导体显示技术有限公司 可拉伸显示面板及其制造方法
CN114937414B (zh) * 2022-05-23 2023-08-22 武汉华星光电半导体显示技术有限公司 柔性显示面板及其制作方法、显示终端
CN115240547B (zh) * 2022-06-15 2023-06-23 昆山国显光电有限公司 显示装置及其制备方法
TWI812463B (zh) * 2022-09-13 2023-08-11 友達光電股份有限公司 可拉伸的畫素陣列基板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206249816U (zh) * 2016-09-18 2017-06-13 惠州市惠泽电器有限公司 一种可拉伸变大的显示屏
CN209133509U (zh) * 2019-01-08 2019-07-19 昆山工研院新型平板显示技术中心有限公司 可拉伸显示面板及显示装置
CN110189637A (zh) * 2019-06-27 2019-08-30 京东方科技集团股份有限公司 显示装置、可拉伸显示面板及其制造方法
CN110459571A (zh) * 2019-08-19 2019-11-15 京东方科技集团股份有限公司 一种阵列基板、电致发光显示装置和阵列基板的制作方法
CN110473475A (zh) * 2019-08-30 2019-11-19 京东方科技集团股份有限公司 光学胶层、拉伸显示装置及光学胶层的制备方法
CN110603644A (zh) * 2019-08-06 2019-12-20 京东方科技集团股份有限公司 柔性显示面板及其制作方法、柔性显示装置
JP2020148925A (ja) * 2019-03-14 2020-09-17 株式会社ポラテクノ 表示装置及び偏光板

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005279789A (ja) * 2004-03-26 2005-10-13 Ibiden Co Ltd 研削・研磨用真空チャック
JP5293330B2 (ja) * 2009-03-26 2013-09-18 三菱マテリアル株式会社 表面被覆立方晶窒化ほう素基超高圧焼結材料製切削工具
JP2011187901A (ja) * 2010-03-11 2011-09-22 Canon Inc 半導体デバイスの製造方法
JP2011233714A (ja) * 2010-04-27 2011-11-17 Canon Inc 半導体素子
KR101852190B1 (ko) * 2011-06-28 2018-04-25 엘지디스플레이 주식회사 플렉서블 표시장치의 제조방법
JP6325310B2 (ja) * 2014-03-28 2018-05-16 パイオニア株式会社 スピーカ装置用振動板、及び、スピーカ装置用振動板の製造方法
KR102348353B1 (ko) * 2015-04-30 2022-01-07 엘지디스플레이 주식회사 플렉서블 디스플레이 장치 및 이의 제조 방법
KR102478223B1 (ko) * 2016-02-02 2022-12-19 삼성디스플레이 주식회사 유기 발광 표시 장치
KR101810050B1 (ko) * 2016-08-11 2017-12-19 삼성디스플레이 주식회사 스트레처블 디스플레이 장치 및 스트레처블 디스플레이 장치의 제조 방법
KR20190005795A (ko) * 2017-07-07 2019-01-16 (주)넥스디스플레이 평면형 디스플레이 장치와 곡면형 에지를 갖는 커버글래스를 갖는 사용자 기기
KR102393377B1 (ko) * 2017-08-07 2022-05-03 삼성디스플레이 주식회사 디스플레이 장치
KR102485295B1 (ko) * 2017-11-30 2023-01-04 엘지디스플레이 주식회사 표시장치
KR102014179B1 (ko) * 2017-12-08 2019-08-26 엘지디스플레이 주식회사 유기발광 표시장치와 그의 제조방법
KR102615589B1 (ko) * 2017-12-28 2023-12-18 엘지디스플레이 주식회사 지문 인식이 가능한 표시 장치
KR102591811B1 (ko) * 2018-05-18 2023-10-23 삼성디스플레이 주식회사 박막 트랜지스터 기판, 이의 제조 방법 및 이를 포함하는 표시 장치
CN112166465B (zh) * 2018-05-31 2022-07-12 株式会社日本显示器 显示装置以及阵列基板
US10549393B2 (en) * 2018-06-05 2020-02-04 Universidad Nacional de Itapua Rotary base for securing tools to a work table
KR102530672B1 (ko) * 2018-07-20 2023-05-08 엘지디스플레이 주식회사 스트레쳐블 표시 장치
KR102554461B1 (ko) * 2018-07-26 2023-07-10 엘지디스플레이 주식회사 스트레쳐블 표시 장치
KR102609426B1 (ko) * 2018-10-08 2023-12-01 엘지디스플레이 주식회사 스트레쳐블 표시 장치
KR20200052094A (ko) * 2018-11-06 2020-05-14 엘지디스플레이 주식회사 스트레쳐블 표시 장치
CN111509136B (zh) * 2019-01-31 2021-12-28 武汉华星光电半导体显示技术有限公司 Oled显示面板
CN112599532A (zh) * 2019-10-01 2021-04-02 财团法人工业技术研究院 电子装置
CN111402734A (zh) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 柔性显示模组及其制备方法与柔性显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206249816U (zh) * 2016-09-18 2017-06-13 惠州市惠泽电器有限公司 一种可拉伸变大的显示屏
CN209133509U (zh) * 2019-01-08 2019-07-19 昆山工研院新型平板显示技术中心有限公司 可拉伸显示面板及显示装置
JP2020148925A (ja) * 2019-03-14 2020-09-17 株式会社ポラテクノ 表示装置及び偏光板
CN110189637A (zh) * 2019-06-27 2019-08-30 京东方科技集团股份有限公司 显示装置、可拉伸显示面板及其制造方法
CN110603644A (zh) * 2019-08-06 2019-12-20 京东方科技集团股份有限公司 柔性显示面板及其制作方法、柔性显示装置
CN110459571A (zh) * 2019-08-19 2019-11-15 京东方科技集团股份有限公司 一种阵列基板、电致发光显示装置和阵列基板的制作方法
CN110473475A (zh) * 2019-08-30 2019-11-19 京东方科技集团股份有限公司 光学胶层、拉伸显示装置及光学胶层的制备方法

Also Published As

Publication number Publication date
CN112397559A (zh) 2021-02-23
US20220359477A1 (en) 2022-11-10
CN112397559B (zh) 2024-02-02
US11916052B2 (en) 2024-02-27

Similar Documents

Publication Publication Date Title
WO2022095140A1 (zh) 可拉伸显示模组及其制备方法
TWI717642B (zh) 顯示面板
WO2018161371A1 (zh) 一种可折叠面板及其制作方法
CN109755412B (zh) 一种柔性基板、制作方法、柔性显示装置和电子器件
CN109192761B (zh) 一种显示面板及其制备方法
WO2019085467A1 (zh) 一种柔性显示模组、柔性显示屏及其制备方法
WO2021003849A1 (zh) 显示面板及其制备方法
WO2022193699A1 (zh) 显示基板及显示装置
TWI737182B (zh) 顯示面板、顯示裝置及顯示面板的製造方法
WO2021175320A1 (zh) 阵列基板及其制备方法、发光基板和显示装置
WO2021223302A1 (zh) 显示面板及其制备方法
WO2021160089A1 (zh) 显示面板以及显示装置
WO2023024152A1 (zh) 可拉伸显示面板
CN112786621A (zh) 柔性基板、显示面板及显示装置
CN112599570B (zh) 显示面板及其制备方法
WO2022227510A1 (zh) Oled显示装置及其制备方法
WO2022067520A1 (zh) 显示基板及其制作方法、显示装置
WO2023035314A1 (zh) 可拉伸显示模组及可拉伸显示设备
WO2023155634A1 (zh) 显示面板和电子设备
WO2023005610A1 (zh) 驱动基板及其制备方法、发光装置
WO2023015626A1 (zh) 曲面显示模组
KR20190077903A (ko) 플렉서블 표시 장치 및 그 제조방법
US20240122001A1 (en) Display Module and Display Apparatus
TW202242497A (zh) 顯示裝置
JP2012113216A (ja) 表示装置及びその製造方法並びにディスプレイ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20960597

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20960597

Country of ref document: EP

Kind code of ref document: A1