WO2023024152A1 - 可拉伸显示面板 - Google Patents

可拉伸显示面板 Download PDF

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Publication number
WO2023024152A1
WO2023024152A1 PCT/CN2021/116716 CN2021116716W WO2023024152A1 WO 2023024152 A1 WO2023024152 A1 WO 2023024152A1 CN 2021116716 W CN2021116716 W CN 2021116716W WO 2023024152 A1 WO2023024152 A1 WO 2023024152A1
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WIPO (PCT)
Prior art keywords
layer
display panel
stretchable display
pixel
disposed
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Application number
PCT/CN2021/116716
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English (en)
French (fr)
Inventor
胡丽
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US17/605,350 priority Critical patent/US20240030236A1/en
Publication of WO2023024152A1 publication Critical patent/WO2023024152A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technology, in particular to a stretchable display panel.
  • An embodiment of the present application provides a stretchable display panel to solve the technical problem that the stretchable display panel may be broken when the existing stretchable display panel is stretched in any direction.
  • An embodiment of the present application provides a stretchable display panel, including:
  • each of the pixel islands includes a plurality of light emitting units
  • connection bridges are arranged on the first flexible supporting layer, and the connection bridges connect two adjacent pixel islands, the connection bridges include a plurality of routing lines, and the two ends of the routing lines are respectively connected to the two pixel islands.
  • the light-emitting units in adjacent pixel islands are electrically connected;
  • a plurality of hollowed out areas are arranged between adjacent connecting bridges, and/or are arranged between adjacent pixel islands;
  • a second flexible supporting layer disposed on the side of the pixel island and the connecting bridge away from the first flexible supporting layer
  • the hollow area is provided with a first opening, and the first opening is filled with a stretchable material, and the stretchable material is arranged on a side of the first flexible supporting layer close to the pixel island;
  • the pixel island includes a substrate island sequentially stacked on the first flexible supporting layer, a pixel driving circuit, and the light emitting unit electrically connected to the pixel driving circuit;
  • the connecting bridge includes a substrate bridge stacked on the first flexible support layer and a plurality of the wirings in sequence, and two ends of the substrate bridge are respectively connected to two adjacent substrate islands.
  • the stretchable display panel includes an active layer, a first metal layer, and a second metal layer arranged on the substrate island and arranged in different layers, the substrate island, the At least one inorganic layer is arranged between two adjacent film layers in the active layer, the first metal layer, and the second metal layer; the connecting bridge includes a second opening, and the second The opening penetrates multiple layers of the inorganic layer, and the second opening is filled with an organic filling layer, and the organic filling layer is disposed between the substrate bridge and the wiring.
  • the second metal layer includes a source-drain layer of the pixel driving circuit and the wiring.
  • the stretchable display panel includes:
  • the active layer is disposed on the buffer layer
  • a gate insulating layer disposed on the active layer
  • the first metal layer is disposed on the gate insulating layer
  • the buffer layer, the gate insulating layer, and the interlayer insulating layer are all inorganic layers, and the second opening penetrates through the interlayer insulating layer, the gate insulating layer, and the interlayer insulating layer. layer and the buffer layer.
  • the stretchable display panel also includes:
  • a passivation layer disposed on the planar layer
  • the first opening penetrates through the passivation layer, the planar layer, the second metal layer, the interlayer insulating layer, the first metal layer, the gate insulating layer, the active source layer, and the buffer layer.
  • the stretchable material filled in the first opening is OCA glue.
  • the planar layer is an organic layer, and the planar layer extends to the connecting bridge and covers a plurality of connecting traces of the connecting bridge.
  • between the first flexible supporting layer and the pixel island, between the first flexible supporting layer and the connecting bridge, between the second flexible supporting layer and the pixel island between, and between the second flexible supporting layer and the connecting bridge are bonded by the stretchable material.
  • the embodiment of the present application provides another stretchable display panel, including:
  • each of the pixel islands includes a plurality of light emitting units
  • connection bridges are arranged on the first flexible supporting layer, and the connection bridges connect two adjacent pixel islands, the connection bridges include a plurality of routing lines, and the two ends of the routing lines are respectively connected to the two pixel islands.
  • the light-emitting units in adjacent pixel islands are electrically connected;
  • a plurality of hollow areas are arranged between adjacent connecting bridges, and/or are arranged between adjacent pixel islands;
  • the hollow area is provided with a first opening, and the first opening is filled with a stretchable material, and the stretchable material is disposed on a side of the first flexible supporting layer close to the pixel island.
  • the pixel island includes a substrate island sequentially stacked on the first flexible supporting layer, a pixel driving circuit, and the light emitting unit electrically connected to the pixel driving circuit; the connection The bridge includes a substrate bridge stacked on the first flexible support layer in sequence and a plurality of the routing lines, and two ends of the substrate bridge are respectively connected to two adjacent substrate islands.
  • the stretchable display panel includes an active layer, a first metal layer, and a second metal layer arranged on the substrate island and arranged in different layers, the substrate island, At least one inorganic layer is arranged between two adjacent layers of the active layer, the first metal layer, and the second metal layer; the connecting bridge includes a second opening, and the first Two openings penetrate multiple layers of the inorganic layer, and the second opening is filled with an organic filling layer, and the organic filling layer is disposed between the substrate bridge and the wiring.
  • the second metal layer includes a source-drain layer of the pixel driving circuit and the wiring.
  • the stretchable display panel includes:
  • the active layer is disposed on the buffer layer
  • a gate insulating layer disposed on the active layer
  • the first metal layer is disposed on the gate insulating layer
  • the buffer layer, the gate insulating layer, and the interlayer insulating layer are all inorganic layers, and the second opening penetrates through the interlayer insulating layer, the gate insulating layer, and the interlayer insulating layer. layer and the buffer layer.
  • the stretchable display panel further includes:
  • a passivation layer disposed on the planar layer
  • the first opening penetrates through the passivation layer, the planar layer, the second metal layer, the interlayer insulating layer, the first metal layer, the gate insulating layer, the active source layer, and the buffer layer.
  • the stretchable material filled in the first opening is OCA glue.
  • the stretchable display panel further includes a second flexible supporting layer disposed on a side of the pixel island and the connecting bridge away from the first flexible supporting layer.
  • the planar layer is an organic layer, and the planar layer extends to the connecting bridge and covers a plurality of connecting wires of the connecting bridge.
  • Embodiments of the present application provide a stretchable display panel and a stretchable display device.
  • the stretchable display panel includes a first flexible support layer, pixel islands and connecting bridges disposed on the first flexible support layer, and Adjacent to the hollow area between the connecting bridges and/or between the adjacent pixel islands, the hollow area is provided with a first opening, and the first opening is filled with a stretchable material.
  • the peripheral area of the pixel island and the connecting bridge as a hollow area with a first opening, the overall Young's modulus of the stretchable display panel can be reduced and the stretching rate of the stretchable display panel can be increased.
  • Stretch material filling can prevent the stretchable display panel from breaking when stretched and can restrain the stretchable display panel from twisting and deforming when stretched.
  • FIG. 1 is a schematic plan view of a stretchable display panel provided in an embodiment of the present application
  • Fig. 2 is a schematic diagram of the film layer stack structure of the stretchable display panel provided by the embodiment of the present application;
  • Fig. 3 is a schematic cross-sectional view of the stretchable display panel provided by the embodiment of the present application when the stretchable adhesive layer is not filled;
  • FIG. 4 is a schematic plan view of a pixel island provided by an embodiment of the present application.
  • FIG. 5 is a flow chart of the steps of the method for preparing a stretchable display panel provided in the embodiment of the present application.
  • Figure 6 to Figure 13 are schematic diagrams of the film layer structure of the preparation process of the stretchable display panel provided by the embodiment of the present application.
  • Fig. 14 and Fig. 15 are structural schematic diagrams of attaching the first flexible supporting layer and the second flexible supporting layer provided by the embodiment of the present application.
  • a first feature being “on” or “under” a second feature may include that the first and second features are in direct contact, and may also include that the first and second features are not in direct contact with each other. contact but through additional feature contact between them.
  • “on”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • "Below”, “beneath” and “beneath” the first feature on the second feature include the first feature being directly below and obliquely below the second feature, or simply means that the level of the first feature is smaller than that of the second feature.
  • the present application aims at the technical problem that the existing stretchable display panel may be broken when it is stretched in any direction, and this embodiment is proposed to overcome this defect.
  • the embodiment of the present application provides a stretchable display panel 100, including pixel islands 101 distributed in an array, a plurality of connecting bridges 102 and a plurality of hollow areas 103, any of the connecting bridges 102 connecting For two adjacent pixel islands 101 , the hollow area 103 is disposed between the adjacent connecting bridges 102 , and/or, disposed between the adjacent pixel islands 101 .
  • the stretchable display panel 100 further includes a first flexible supporting layer 60 , and the pixel islands 101 and the connecting bridges 102 are disposed on the first flexible supporting layer 60 .
  • Each of the pixel islands 101 includes a light emitting unit 30 for realizing a display function.
  • the connection bridge 102 includes a plurality of wires, and both ends of the wires are respectively electrically connected to the light emitting units 30 in two adjacent pixel islands 101 for transmitting electrical signals.
  • the hollow area 103 is provided with a first opening 103A, and the first opening 103A is filled with a stretchable material 40 , and the stretchable material 40 is set on the first flexible
  • the supporting layer 60 is close to one side of the pixel island 101 .
  • the peripheral area of the pixel island 101 and the connecting bridge 102 as a hollow area 103 with a first opening 103A, the overall Young's modulus of the stretchable display panel 100 can be reduced and the stretching rate of the stretchable display panel 100 can be increased.
  • the first opening 103A is filled with the stretchable material 40 , which can prevent the stretchable display panel 100 from being broken during stretching, and can prevent the stretchable display panel 100 from twisting and deforming during stretching.
  • the shape of the connecting bridge 102 may be a curved shape, specifically a serpentine shape or a wave shape, and the connecting bridge 102 may be stretched under the action of an external force.
  • the shape of the pixel island 101 can be block, such as square, rectangular, rectangular, rhombus and other shapes, so the rigidity of the pixel island 101 will be greater than the rigidity of the connecting bridge 102, and the connecting bridge 102 has better than Stretchability of Pixel Island 101.
  • the hollow area 103 is surrounded by several pixel islands 101 and the connecting bridges 102 between the pixel islands 101.
  • the bending degree of the connecting bridge 102 gradually decreases (developing from a bent state to a straightened state), and the area of the hollow area 103 gradually increases. After the external force disappears, the stretchable display panel 100 resumes its elastic deformation, and the bending degree of the connecting bridge 102 returns to the state when it is not stretched.
  • the stretchable display panel 100 further includes a flexible substrate 10, and the flexible substrate 10 includes a substrate island 11 located on the pixel island 101 and a substrate located on the connecting bridge 102.
  • the bottom bridge 12 , the substrate bridge 12 connects two adjacent substrate islands 11 , and the part of the flexible substrate 10 located in the hollow area 103 is removed to form a part of the first opening 103A.
  • the pixel island 101 includes a substrate island 11 sequentially stacked on the first flexible support layer 60 , a pixel driving circuit 20 , and the light emitting unit electrically connected to the pixel driving circuit 20 30.
  • the connection bridge 102 includes a substrate bridge 12 and a plurality of traces 70 stacked on the first flexible support layer 60 in sequence, and the two ends of the substrate bridge 12 are respectively connected to two adjacent substrates. Bottom Island 11 connection.
  • the top surface L1 of the stretchable material 40 must be at least in line with The top surface L2 of the light emitting unit 30 is even. That is, the top surface L1 of the stretchable material 40 is higher than or equal to the top surface L2 of the light emitting unit 30 . Since the part of the flexible substrate 10 located in the hollow area 103 is removed, other film layers cannot be formed in the hollow area 103 subsequently, resulting in a layer difference between the hollow area 103 and the pixel island 101, which is not conducive to the stretchable display panel 100 as a whole.
  • the flatness and stretchability of the stretchable material 40, the top surface L1 of the stretchable material 40 is higher than or flush with the top surface L2 of the light-emitting unit 30, which can not only make up for the difference between the various regions, but also prevent stretching.
  • the stretch display panel 100 is broken and twisted when stretched.
  • the stretchable display panel 100 further includes a second flexible supporting layer 50 disposed on a side of the pixel island 101 and the connecting bridge 102 away from the first flexible supporting layer 60 .
  • the second flexible support layer 50 can be used as a cover plate to protect the light-emitting unit and the driving circuit of the stretchable display panel 100
  • the first flexible support layer 60 can be used as a backplane to protect the flexibility of the stretchable display panel.
  • the substrate 10 and the film layers stacked on it play a supporting role.
  • the materials of the first flexible support layer 60 and the second flexible support layer 50 are polymer materials with low elastic modulus, and have stretchability.
  • the first flexible support layer 60 and the second flexible support layer 50 can specifically be PDMS (Polydimethylsiloxane, polydimethylsiloxane) elastic substrates.
  • the first flexible support layer 60 and the second flexible support layer 50 are integral structures, and during stretching, each point of the first flexible support layer 60 and the second flexible support layer 50 Both will be stretched, so the Young's modulus of the material of the first flexible supporting layer 60 and the second flexible supporting layer 50 can be smaller than the Young's modulus of the flexible substrate 10, so that the first flexible supporting layer 60 And the second flexible support layer 50 is easier to stretch.
  • the stretchable material 40 may be stretchable glue, and the stretchable glue can also play a role of attachment while filling the first opening 103A.
  • the first flexible supporting layer 60 and the second flexible supporting layer 50 can be pasted on two opposite sides of the pixel island 101 and the connecting bridge 102 of the stretchable display panel 100 by using stretchable glue.
  • the surface of the stretchable material 40 on the same side as the light-emitting unit 30 can protrude from the light-emitting unit to facilitate the attachment of the second flexible support layer 50;
  • the surface on the same side of the flexible substrate 10 may protrude from the flexible substrate 10 to facilitate the attachment of the first flexible support layer 60 .
  • the stretchable material 40 can be OCA glue (Optically Clear Adhesive, optically transparent glue), and can also be stretchable PDMS, OCR (Optical Clear Adhesive). Resin, optically clear resin or liquid optical glue) and other transparent adhesive materials.
  • OCA glue Optically Clear Adhesive, optically transparent glue
  • OCR Optical Clear Adhesive
  • first flexible support layer 60 and the pixel island 101 Between the first flexible support layer 60 and the pixel island 101, between the first flexible support layer 60 and the connecting bridge 102, between the second flexible support layer 50 and the pixel island 101 , and the second flexible support layer 50 and the connecting bridge 102 are bonded by the OCA glue.
  • FIG. 3 is a schematic cross-sectional view of the stretchable display panel when it is not filled with stretchable material.
  • the stretchable display panel 100 includes multiple inorganic layers stacked on the substrate island 11, and the multiple inorganic layers are hollowed out in the hollow area 103 to form the first opening 103A.
  • a part of the multi-layer inorganic layer is hollowed out at the part of the connection bridge 102 to form a second opening 104 , and the second opening 104 is filled by the organic filling layer 27 .
  • the second opening 104 is formed by removing the multi-layer inorganic layer at the part of the connecting bridge 102, which can prevent the stress on the connecting bridge 102 from penetrating along the inorganic layer when the stretchable display panel 100 is stretched. To the pixel island 101, it affects the stability of the light-emitting unit of the pixel island 101. On the other hand, using the organic filling layer 27 to fill the second opening 104 can relieve the tensile stress of the connecting bridge 102 and improve the tensile performance of the connecting bridge 102. .
  • the stretchable display panel 100 includes an active layer 21 , a first metal layer, and a second metal layer disposed on the substrate island 11 in different layers.
  • the substrate island 11 , The active layer 21, the first metal layer, and the second metal layer are provided with at least one inorganic layer between two adjacent film layers, so as to insulate or block water and oxygen. effect.
  • the connecting bridge 102 includes a second opening 104, the second opening 104 penetrates multiple layers of the inorganic layer, and the second opening 104 is filled with an organic filling layer 27, and the organic filling layer 27 is disposed on the lining between the bottom bridge 12 and the wiring 70 .
  • the pixel driving circuit 20 includes at least one thin film transistor, the thin film transistor can be low temperature polysilicon type, oxide type, or amorphous silicon type, etc., and the thin film transistor can be top gate structure or bottom gate structure
  • the thin film transistor may have a single gate structure or a double gate structure, and the embodiment of the present application does not limit the structure and type of the thin film transistor. It can be understood that no matter what type of thin film transistor it is, the preparation of each device of the thin film transistor on the substrate island 11 involves the preparation of inorganic layers with different functions in different film layers.
  • the stretchable display panel 100 includes a buffer layer 24 disposed on the substrate island 11, the active layer 21 disposed on the buffer layer 24, and the active layer 21 disposed on the buffer layer 24.
  • the insulating layer 26 , the gate insulating layer 25 and the buffer layer 24 , the second opening 104 is filled with the organic filling layer 27 .
  • the surface of the organic filling layer 27 facing away from the flexible substrate 10 may be flush with the surface of the interlayer insulating layer 26 facing away from the flexible substrate 10, or the organic filling layer 27 may
  • the side surface of the filling layer 27 away from the flexible substrate 10 is slightly higher than the side surface of the interlayer insulating layer 26 away from the flexible substrate 10, so that the traces arranged on the organic filling layer 27
  • the surface of the wiring 70 is flat, so as to avoid a large step between the organic filling layer 27 and the interlayer insulating layer 26 , causing the wire 70 to break at the step.
  • the wiring 70 and the source-drain layer 23 can be formed through the same metal process to save photomask process. That is, the second metal layer may further include wires 70.
  • the organic filling layer 27 is formed, a film layer of the second metal layer is deposited on the interlayer insulating layer 26 and the organic filling layer 27, and Patterning is performed on the second metal layer, and source electrodes, drain electrodes, and various wires 70 are formed at corresponding positions.
  • the wiring 70 includes but is not limited to at least one of signal lines such as scan lines, data lines, power signal lines, and common lines.
  • the plurality of wirings 70 can be arranged in layers, on different film layers in the connecting bridge 102 , and the adjacent wiring film layers can be separated by an organic layer.
  • the interlayer insulating layer 26 is also provided with a plurality of first via holes located on the pixel island 101, and the first via holes sequentially pass through the interlayer insulating layer 26 and the gate insulating layer 25 to expose the On the surfaces of both ends of the active layer 21 , the source and drain electrodes of the source and drain layer 23 are respectively connected to the active layer 21 through the corresponding first via holes.
  • the thin film transistor may have a bottom-gate structure.
  • the gate is disposed on the buffer layer
  • the gate insulating layer is disposed on the gate
  • the active layer is disposed on the gate insulating layer
  • the interlayer insulating layer is disposed on On the active layer
  • the source and drain layers are arranged on the interlayer insulating layer, and the openings opened by the interlayer insulating layer and located at the connecting bridges sequentially pass through the interlayer insulating layer, the gate Pole insulating layer and buffer layer.
  • the thin film transistor may also have a double-gate structure, the gate includes a first gate and a second gate, and the first gate and the second gate are respectively arranged on the On both sides of the active layer, a first insulating layer is provided between the first gate and the active layer, and a second insulating layer is provided between the second gate and the active layer, so An interlayer insulating layer is disposed on the second grid. The opening of the interlayer insulating layer passes through the interlayer insulating layer, the second gate insulating layer, the first gate insulating layer and the buffer layer in sequence.
  • the material of the active layer 21 in the embodiment of the present application includes any one of materials such as low-temperature polysilicon, indium gallium zinc oxide, and amorphous silicon.
  • the second opening 104 is located in the connecting bridge 102, and the second opening 104 runs through the multi-layer inorganic layers in the pixel driving circuit 20 and the pixel driving circuit 20.
  • An inorganic layer is formed between the circuit 20 and the substrate island 11 , and the second opening 104 is filled with an organic filling layer 27 .
  • Materials of the gate insulating layer 25 and the interlayer insulating layer 26 may include at least one of inorganic materials such as silicon oxide (SiOx) and silicon nitride (SiNx).
  • the buffer layer 24 can be a multi-layer composite film structure or a single-layer film structure, and the material of the buffer layer 24 includes at least one material among SiOx, SiNx and Al 2 O 3 .
  • the side of the plurality of traces 70 facing away from the organic filling layer 27 is covered with at least one organic layer, so that the upper and lower sides of the traces 70 are protected by the organic layer, which can relieve tensile stress.
  • the organic layer on the upper side of the wiring 70 can be formed by preparing the organic film layer on the pixel island 101 while retaining the film layer in the connecting bridge 102 .
  • At least one organic layer (such as a flat layer 80 ) is provided between the pixel driving circuit 20 and the light emitting unit 30 , and the organic layer extends to the connection bridge 102 to cover the connection Multiple traces 70 of the bridge 102 .
  • the stretchable display panel 100 further includes a flat layer 80, a bonding electrode 31 and a passivation layer 90, the flat layer 80 is disposed on the source-drain layer 23, and the bonding electrode 31 is disposed On the planar layer 80 , the light emitting unit 30 is disposed on the bonding electrode 31 , and the passivation layer 90 is disposed on the planar layer 80 .
  • the flat layer 80 extends into the connection bridge 102 and covers a plurality of wires 70 of the connection bridge 102
  • the passivation layer 90 is an inorganic layer
  • the passivation layer 90 is located on the connection bridge 102. Portions of the bridge 102 are hollowed out.
  • the first opening 103A runs through the passivation layer 90 , the planar layer 80 , the second metal layer, the interlayer insulating layer 26 , the first metal layer, the gate insulating layer 25 , the active layer 21 , and the buffer layer 24 .
  • the passivation layer 90 corresponding to the first opening 103A, the substrate 10 and all film layers between the passivation layer 90 and the substrate 10 are hollowed out, but it can be understood that the first flexible support The layer 60 does not need to be excavated in order to play a bearing role.
  • the light emitting unit 30 of the embodiment of the present application includes a first sub-pixel unit 1011 , a second sub-pixel unit 1012 and a third sub-pixel unit 1013 with different colors.
  • the first sub-pixel unit 1011 , the second sub-pixel unit The size, arrangement, and shape of the unit 1012 and the third sub-pixel unit 1013 are not limited.
  • the first sub-pixel unit 1011, the second sub-pixel unit 1012 and the third sub-pixel unit 1013 are selected from red, green and blue respectively. One of the color sub-pixel units.
  • the light emitting unit 30 includes any one of an OLED light emitting unit, a Mini-LED light emitting unit, and a Micro-LED light emitting unit.
  • the light emitting unit 30 can be a Micro-LED light emitting unit or a Micro-LED light emitting unit, and the PN electrode 32 of the light emitting unit 30 is disposed on the bonding electrode 31 , And it is electrically connected with the bonding electrode 31 .
  • a plurality of second via holes located on the pixel island 101 are opened on the planar layer 80 , and the second via holes pass through the planar layer 80 to expose the source or drain of the source-drain layer 23
  • the bonding electrode 31 is connected to the source or the drain of the source-drain layer 23 through the second via hole, so that the pixel driving circuit 20 can drive the light-emitting unit 30 to emit light.
  • the light-emitting unit 30 is preferably a Micro-LED light-emitting unit. Since the LED chip is transferred to the stretchable display panel 100, the LED chip does not need to be packaged after the transfer. In addition, The size of Micro-LED can reach tens of microns or even several microns, Micro-LED can achieve high PPI and high brightness; in addition, Micro-LED does not require special packaging process, Micro-LED LED is made of inorganic materials, and its lifespan and stability are much stronger than the organic molecules of OLED screens, and it is not prone to screen burn-in and aging.
  • the embodiment of the present application also provides a method for manufacturing the stretchable display panel in the above embodiment, the method includes: S10, forming a flexible substrate 10 on a rigid substrate 200, A pixel island 101, a connecting bridge 102, and a hollow area 103 are defined on the flexible substrate 10; Line 70 ; S30 , remove all the flexible substrate 10 located in the hollow area 103 and the film layer thereon; S40 , fill the hollow area 103 with a stretchable material 40 .
  • the rigid substrate 200 can be a glass substrate, and the flexible substrate 10 can be a polyimide material.
  • the polyimide material is coated on the entire surface of the rigid substrate 200 and cured to form a film.
  • the embodiment of the present application is described by taking the preparation of a top-gate thin film transistor as an example.
  • the preparation methods of other types of thin film transistors can refer to the prior art, and will not be listed one by one.
  • the formation of the pixel driving circuit 20 includes: forming a buffer layer 24 on the flexible substrate 10; forming a patterned active layer 21 on the buffer layer 24; A gate insulating layer 25 is formed on the active layer 21; a patterned gate 22 is formed on the gate insulating layer 25; an interlayer insulating layer 26 is formed on the gate 22; wherein the buffer layer 24. Both the gate insulating layer 25 and the interlayer insulating layer 26 are inorganic layers.
  • the buffer layer 24 can be a multi-layer composite film structure, or a single-layer film structure, and the material of the buffer layer 24 includes at least one material among SiOx, SiNx and Al 2 O 3 .
  • Materials of the gate insulating layer 25 and the interlayer insulating layer 26 may include at least one of inorganic materials such as silicon oxide (SiOx) and silicon nitride (SiNx).
  • the interlayer insulating layer 26, the gate insulating layer 25, and the buffer layer 24 are etched through half-tone masks with different light transmittances to remove the above-mentioned film layers in the hollowed out area.
  • a second opening 104 is formed in the connecting bridge 102
  • a first via hole 105 is formed in the pixel island 101
  • the second opening 104 penetrates the interlayer insulating layer 26, the
  • the gate insulating layer 25 and the buffer layer 24, the first via hole 105 passes through the interlayer insulating layer 26 and the gate insulating layer 25 in order to expose the surfaces of both ends of the active layer 21 .
  • the second opening 104 is filled with an organic filling layer 27 , wherein the surface of the organic filling layer 27 is at least flush with the surface of the interlayer insulating layer 26 .
  • a second metal layer is deposited on the interlayer insulating layer 26 and the organic filling layer 27, and the second metal layer is exposed, developed, etched, etc. to form a patterned
  • the source and drain layers 23 and the plurality of wires 70 are described above.
  • the formation of the light-emitting unit 30 includes: forming a patterned flat layer 80 on the source-drain layer 23 and the wiring 70 ; An electrode 31 ; forming a PN electrode 32 on the bonding electrode 31 ; binding the Micro-LED chip on the PN electrode 32 to form a light emitting unit 30 .
  • a flat layer 80 is deposited on the source-drain layer 23 , the flat layer 80 is an organic layer, and the flat layer 80 is etched to remove its part in the hollowed out region 103 , keep the part of the flat layer 80 in the connecting bridge 102 so that the flat layer 80 covers the wiring 70, and form a second via hole 106 in the pixel island 101, and the second via hole 106 exposes the The source or drain of the source-drain layer 23.
  • a patterned bonding electrode 31 is formed at the second via hole 106 , and the bonding electrode 31 is connected to the source or drain of the underlying source and drain layer 23 .
  • the material of the bonding electrode 31 includes but not limited to ITO, Mo, Cu, Ti/AL/Ti and other conductive materials.
  • a patterned passivation layer 90 is then formed on the flat layer 80, the passivation layer 90 includes accommodating grooves, the accommodating grooves expose the bonding electrodes 31, and the accommodating grooves are used for Accommodates devices related to the light emitting unit 30 .
  • the passivation layer 90 is an inorganic layer, and the parts of the passivation layer 90 located in the hollow area 103 and the connecting bridge 102 are all removed.
  • PN electrodes 32 are vapor-deposited or electroplated on the bonding electrodes 31, and the Micro-LED chip is bound on the PN electrodes 32 by transfer printing, bonding and other processes to form the light emitting unit 30.
  • the flexible substrate 10 is patterned to form substrate islands 11 and substrate bridges 12 .
  • an etching process or a laser cutting process may be used to remove the part of the flexible substrate 10 located in the hollow area 103 to form a patterned substrate island 11 and a substrate bridge 12 .
  • the patterning process of the flexible substrate 10 may be performed after the material deposition of the flexible substrate 10 is completed, or before transferring the Micro-LED chip, which is not limited here.
  • the flexible substrate 10 and the rigid substrate 200 can be peeled off by using a laser lift-off process to obtain the stretchable display panel shown in FIG. 3 .
  • the hollowed out area 103 is filled with a stretchable material 40 to improve the rigidity of the patterned flexible substrate 10 and prevent stretching.
  • the stretchable display panel 100 is broken when stretched and the stretchable display panel 100 can be prevented from twisting and deforming when stretched.
  • the first flexible supporting layer 60 and the second flexible supporting layer 50 can be attached to the two opposite sides of the stretchable display panel 100 respectively.
  • the stretchable material 40 can be a stretchable adhesive layer, the filling of the stretchable material 40 can be divided into two times, and the stretchable material 40 can include the first stretchable Stretch the adhesive layer 41 and the second stretchable adhesive layer 42 .
  • first flexible supporting layer 60 attaches to the bottom of the stretchable display panel (the side of the flexible substrate 10 facing away from the light-emitting unit 30 ) through the first stretchable adhesive layer 41, and then attach the first flexible support layer 60 on the hollowed out area.
  • 103 filling the second stretchable adhesive layer 42 until the second stretchable adhesive layer 42 overflows the top of the stretchable display panel (the side of the light emitting unit 30 away from the flexible substrate 10 ), covering the On the top surface of the pixel island 101 and the connecting bridge 102 , finally attach the second flexible supporting layer 50 on the second stretchable adhesive layer 42 .
  • the first flexible supporting layer 60 is located at the bottom of the stretchable display panel 100 and can support the stretchable display panel 100
  • the second flexible supporting layer 50 is located at the bottom of the stretchable display panel 100.
  • the top of the stretchable display panel 100 can be used to protect the light emitting unit 30 and the pixel driving circuit 20 of the stretchable display panel.
  • the second flexible support layer 50 and the first flexible support layer 60 can be elastic substrates, such as PDMS (Polydimethylsiloxane, polydimethylsiloxane) substrates, which have a low elastic modulus, which is conducive to improving stretchability. Displays the tensile properties of the panel as a whole.
  • PDMS Polydimethylsiloxane, polydimethylsiloxane
  • the stretchable display panel in the embodiment of the present application includes, but is not limited to, electronic display products such as electronic paper, mobile, tablet computer, television, monitor, notebook computer, digital photo frame, and digital camera.
  • the embodiment of the present application provides a stretchable display panel, which includes a first flexible support layer 60, pixel islands 101 and connecting bridges 102 disposed on the first flexible support layer 60, and a stretchable display panel disposed on the first flexible support layer 60.
  • the hollow area 103 disposed between adjacent connecting bridges 102 and/or between adjacent pixel islands 101
  • the hollow area 103 is provided with a first opening 103A
  • the first opening 103A is filled with a stretchable material 40 .

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Abstract

一种可拉伸显示面板（100），包括第一柔性支撑层（60）、设于第一柔性支撑层（60）上的多个像素岛（101）和多个连接桥（102），以及多个镂空区（103），镂空区（103）设有第一开口（103A），第一开口（103A）填充有可拉伸材料（40），可降低可拉伸显示面板（100）整体的杨氏模量和提高可拉伸显示面板（100）的拉伸率，以及能够抑制可拉伸显示面板（100）在拉伸时发生扭曲变形。

Description

可拉伸显示面板 技术领域
本申请涉及显示技术领域，尤其涉及一种可拉伸显示面板。
 背景技术
随着物联网技术的发展，消费电子会越来越多的融入我们的生活，而这些物体通常不一定是2D的，因此要求我们进行3D自由曲面显示技术的开发。然而，可折叠、可弯曲显示屏仅在某一空间方向实现了显示的功能，并未在全局空间任意方向实现柔性显示的效果。研究可拉伸式显示器件，实现任意方向的拉伸依然能保证良好的显示效果，将是下一代新型全空间柔性显示研究的重点。
如何实现可拉伸显示面板在任意方向的拉伸的同时，保证可拉伸显示面板不被拉断，仍为目前可拉伸显示产品研究开发的难点之一。
 技术问题
本申请实施例提供一种可拉伸显示面板，以解决现有的可拉伸显示面板在任意方向拉伸时，可拉伸显示面板可能会被拉断的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供一种可拉伸显示面板，包括：
第一柔性支撑层；
多个像素岛，设置在所述第一柔性支撑层上，且每个所述像素岛包括多个发光单元；
多个连接桥，设置在所述第一柔性支撑层上，且所述连接桥连接相邻的两所述像素岛，所述连接桥包括多条走线，所述走线两端分别与两个相邻所述像素岛中的发光单元电连接；
多个镂空区，设置于相邻的所述连接桥之间，和/或，设置于相邻的所述像素岛之间；以及
第二柔性支撑层，设置于所述像素岛和所述连接桥背离所述第一柔性支撑层一侧；
其中，所述镂空区设置有第一开口，且所述第一开口中填充有可拉伸材料，所述可拉伸材料设置在所述第一柔性支撑层靠近所述像素岛的一侧；
所述像素岛包括依次堆叠于所述第一柔性支撑层上的衬底岛、像素驱动电路以及电连接所述像素驱动电路的所述发光单元；
所述连接桥包括依次堆叠于所述第一柔性支撑层上的衬底桥和多条所述走线，所述衬底桥的两端分别与两相邻的所述衬底岛连接。
在本申请的一些实施中，所述可拉伸显示面板包括设置于所述衬底岛上且异层设置的有源层、第一金属层、第二金属层，所述衬底岛、所述有源层、所述第一金属层、所述第二金属层中的两两相邻膜层之间均设有至少一层无机层；所述连接桥包括第二开口，所述第二开口贯穿多层所述无机层，且所述第二开口填充有有机填充层，所述有机填充层设置于所述衬底桥与所述走线之间。
在本申请的一些实施中，所述第二金属层包括所述像素驱动电路的源漏极层和所述走线。
在本申请的一些实施中，所述可拉伸显示面板包括：
缓冲层，设于所述衬底岛上；
所述有源层，设于所述缓冲层上；
栅极绝缘层，设于所述有源层上；
所述第一金属层，设于所述栅极绝缘层上；
层间绝缘层，设于所述第一金属层上；以及
第二金属层，设于所述层间绝缘层上；
其中，所述缓冲层、所述栅极绝缘层、所述层间绝缘层，所述层间绝缘层均为无机层，所述第二开口贯穿所述层间绝缘层、所述栅极绝缘层以及所述缓冲层。
在本申请的一些实施中，所述可拉伸显示面板还包括：
平坦层，设于所述第二金属层上，所述发光单元设于所述平坦层上；
钝化层，设于所述平坦层上；
其中，所述第一开口贯穿所述钝化层、所述平坦层、所述第二金属层、所述层间绝缘层、所述第一金属层、所述栅极绝缘层、所述有源层、以及所述缓冲层。
在本申请的一些实施中，填充于所述第一开口的所述可拉伸材料为OCA胶。
在本申请的一些实施中，所述平坦层为有机层，所述平坦层延伸至所述连接桥，并覆盖所述连接桥的多条所述连接走线。
在本申请的一些实施中，所述第一柔性支撑层与所述像素岛之间、所述第一柔性支撑层与所述连接桥之间、所述第二柔性支撑层与所述像素岛之间，以及所述第二柔性支撑层与所述连接桥之间通过所述可拉伸材料粘结。
本申请实施例提供另一种可拉伸显示面板，包括：
第一柔性支撑层；
多个像素岛，设置在所述第一柔性支撑层上，且每个所述像素岛包括多个发光单元；
多个连接桥，设置在所述第一柔性支撑层上，且所述连接桥连接相邻的两所述像素岛，所述连接桥包括多条走线，所述走线两端分别与两个相邻所述像素岛中的发光单元电连接；
多个镂空区，设置于相邻的所述连接桥之间，和/或，设置于相邻的所述像素岛之间；
其中，所述镂空区设置有第一开口，且所述第一开口中填充有可拉伸材料，所述可拉伸材料设置在所述第一柔性支撑层靠近所述像素岛的一侧。
在本申请的一些实施例中，所述像素岛包括依次堆叠于所述第一柔性支撑层上的衬底岛、像素驱动电路以及电连接所述像素驱动电路的所述发光单元；所述连接桥包括依次堆叠于所述第一柔性支撑层上的衬底桥和多条所述走线，所述衬底桥的两端分别与两相邻的所述衬底岛连接。
在本申请的一些实施例中，所述可拉伸显示面板包括设置于所述衬底岛上且异层设置的有源层、第一金属层、第二金属层，所述衬底岛、所述有源层、所述第一金属层、所述第二金属层中的两两相邻膜层之间均设有至少一层无机层；所述连接桥包括第二开口，所述第二开口贯穿多层所述无机层，且所述第二开口填充有有机填充层，所述有机填充层设置于所述衬底桥与所述走线之间。
在本申请的一些实施例中，所述第二金属层包括所述像素驱动电路的源漏极层和所述走线。
在本申请的一些实施例中，所述可拉伸显示面板包括：
缓冲层，设于所述衬底岛上；
所述有源层，设于所述缓冲层上；
栅极绝缘层，设于所述有源层上；
所述第一金属层，设于所述栅极绝缘层上；
层间绝缘层，设于所述第一金属层上；以及
第二金属层，设于所述层间绝缘层上；
其中，所述缓冲层、所述栅极绝缘层、所述层间绝缘层，所述层间绝缘层均为无机层，所述第二开口贯穿所述层间绝缘层、所述栅极绝缘层以及所述缓冲层。
在本申请的一些实施例中，所述可拉伸显示面板还包括：
平坦层，设于所述第二金属层上，所述发光单元设于所述平坦层上；
钝化层，设于所述平坦层上；
其中，所述第一开口贯穿所述钝化层、所述平坦层、所述第二金属层、所述层间绝缘层、所述第一金属层、所述栅极绝缘层、所述有源层、以及所述缓冲层。
在本申请的一些实施例中，填充于所述第一开口的所述可拉伸材料为OCA胶。
在本申请的一些实施例中，所述可拉伸显示面板还包括设置于所述像素岛和所述连接桥背离所述第一柔性支撑层一侧的第二柔性支撑层。
在本申请的一些实施例中，所述第一柔性支撑层与所述像素岛之间、所述第一柔性支撑层与所述连接桥之间、所述第二柔性支撑层与所述像素岛之间，以及所述第二柔性支撑层与所述连接桥之间通过所述OCA胶粘结。
在本申请的一些实施例中，所述平坦层为有机层，所述平坦层延伸至所述连接桥，并覆盖所述连接桥的多条所述连接走线。
 有益效果
本申请实施例提供一种可拉伸显示面板和可拉伸显示装置，可拉伸显示面板包括第一柔性支撑层、设于第一柔性支撑层上的像素岛和连接桥，以及设于相邻连接桥之间和/或设置于相邻的所述像素岛之间的镂空区，镂空区设有第一开口，且第一开口填充有可拉伸材料。通过将像素岛和连接桥的周边区域设计成具有第一开口的镂空区，可降低可拉伸显示面板整体的杨氏模量和提高可拉伸显示面板的拉伸率，第一开口用可拉伸材料填充，可防止可拉伸显示面板在拉伸时发生断裂以及能够抑制可拉伸显示面板在拉伸时发生扭曲变形。
 附图说明
图1为本申请实施例提供的可拉伸显示面板的平面示意图；
图2为本申请实施例提供的可拉伸显示面板的膜层叠构示意图；
图3为本申请实施例提供的可拉伸显示面板在未填充可拉伸胶层时的剖面示意图；
图4为本申请实施例提供的像素岛的平面示意图；
图5为本申请实施例提供的可拉伸显示面板的制备方法的步骤流程图；
图6至图13为本申请实施例提供的可拉伸显示面板的制备过程的膜层结构示意图；
图14和图15为本申请实施例提供的贴附第一柔性支撑层和第二柔性支撑层的结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本申请针对现有的可拉伸显示面板在任意方向拉伸时，可能会出现被拉断的技术问题，提出本实施例以克服该缺陷。
请参阅图1和图2，本申请实施例提供一种可拉伸显示面板100，包括阵列分布的像素岛101、多个连接桥102以及多个镂空区103，任一所述连接桥102连接相邻两所述像素岛101，所述镂空区103设置于相邻的所述连接桥102之间，和/或，设置于相邻的所述像素岛101之间。
所述可拉伸显示面板100还包括第一柔性支撑层60，所述像素岛101和所述连接桥102设置于所述第一柔性支撑层60上。每一所述像素岛101包括的发光单元30，用于实现显示功能。所述连接桥102包括多条走线，所述走线两端分别与两相邻所述像素岛101中的发光单元30电连接，用于传输电信号。
请参阅图2和图3，所述镂空区103设置有第一开口103A，且所述第一开口103A中填充有可拉伸材料40，所述可拉伸材料40设置在所述第一柔性支撑层60靠近所述像素岛101的一侧。通过将像素岛101和连接桥102的周边区域设计成具有第一开口103A的镂空区103，可降低可拉伸显示面板100整体的杨氏模量和提高可拉伸显示面板100的拉伸率，第一开口103A用可拉伸材料40填充，可防止可拉伸显示面板100在拉伸时发生断裂，能够抑制可拉伸显示面板100在拉伸时发生扭曲变形。
具体地，所述连接桥102的形状可为弯曲形状，具体可为蛇形形状或波浪形形状，所述连接桥102在外力作用下可发生拉伸。所述像素岛101的形状可为块状，例如方块状、矩形状、矩形状、菱形状等形状，因此所述像素岛101的刚度会大于连接桥102的刚度，连接桥102具有优于像素岛101的拉伸性能。所述镂空区103由若干个像素岛101和像素岛101之间的连接桥102所围成，在所述可拉伸显示面板100在外力作用下发生拉伸时，弯曲形状的连接桥102和可拉伸材料40发生拉伸，像素岛101不发生拉伸。在拉伸过程中，连接桥102的弯曲程度逐渐减小（由弯曲状态向拉直状态发展），镂空区103的面积逐渐增大。外力消失后，可拉伸显示面板100恢复弹性形变，连接桥102的弯曲程度恢复成未受到拉伸时的状态。
请参阅图1和图2，所述可拉伸显示面板100还包括柔性衬底10，所述柔性衬底10包括位于所述像素岛101的衬底岛11和位于所述连接桥102的衬底桥12，所述衬底桥12连接相邻的两所述衬底岛11，所述柔性衬底10位于所述镂空区103的部分被去除以形成所述第一开口103A的一部分。
请参阅图2和图3，所述像素岛101包括依次堆叠于所述第一柔性支撑层60上的衬底岛11、像素驱动电路20以及电连接所述像素驱动电路20的所述发光单元30。所述连接桥102包括依次堆叠于所述第一柔性支撑层60上的衬底桥12和多条所述走线70，所述衬底桥12的两端分别与两相邻的所述衬底岛11连接。
请参阅图2，相对于所述柔性衬底10所在的基准面（可以所述柔性衬底10的上表面或下表面为基准面），所述可拉伸材料40的顶面L1至少要与所述发光单元30的顶面L2平齐。即所述可拉伸材料40的顶面L1高于或平齐于所述发光单元30的顶面L2。由于将柔性衬底10位于镂空区103的部分去除，后续无法在镂空区103形成其他的膜层，导致镂空区103与像素岛101之间存在膜层段差，不利于可拉伸显示面板100整体的平整性及可拉伸性能，将可拉伸材料40的顶面L1高于或平齐于所述发光单元30的顶面L2，不仅可弥补各个区域之间的段差，还能防止可拉伸显示面板100在拉伸时发生断裂和扭曲变形。
请参阅图2，进一步地，所述可拉伸显示面板100还包括设置于所述像素岛101和所述连接桥102背离所述第一柔性支撑层60一侧的第二柔性支撑层50。所述第二柔性支撑层50可作为盖板使用，保护可拉伸显示面板100的发光单元及驱动电路，所述第一柔性支撑层60可作为背板使用，对可拉伸显示面板的柔性衬底10及其上堆叠的膜层起到支撑作用。
所述第一柔性支撑层60和所述第二柔性支撑层50的材料均为具有低弹性模量的聚合物材料，具有可拉伸性能。所述第一柔性支撑层60和所述第二柔性支撑层50具体可为PDMS（Polydimethylsiloxane，聚二甲基硅氧烷）弹性基板。
所述第一柔性支撑层60和所述第二柔性支撑层50为整面式结构，在拉伸过程中，所述第一柔性支撑层60和所述第二柔性支撑层50的各个点位均会受到拉伸，因此第一柔性支撑层60、第二柔性支撑层50的材料的杨氏模量可小于所述柔性衬底10的杨氏模量，使得所述第一柔性支撑层60和所述第二柔性支撑层50更易拉伸。
在本申请的实施例中，所述可拉伸材料40可为可拉伸胶，可拉伸胶在填充所述第一开口103A的同时，也能起到贴附的作用。所述第一柔性支撑层60和所述第二柔性支撑层50可利用可拉伸胶贴附在可拉伸显示面板100的像素岛101和连接桥102的两相对侧。所述可拉伸材料40的与所述发光单元30同侧的表面可凸出于所述发光单元，便于所述第二柔性支撑层50的贴附；所述可拉伸材料40的与所述柔性衬底10同侧的表面可凸出于所述柔性衬底10，便于所述第一柔性支撑层60的贴附。
所述可拉伸材料40可为OCA胶（Optically Clear Adhesive，光学透明胶），也可为可拉伸PDMS、OCR（Optical Clear Resin，光学透明树脂或液体光学胶）等透明胶材。
所述第一柔性支撑层60与所述像素岛101之间、所述第一柔性支撑层60与所述连接桥102之间、所述第二柔性支撑层50与所述像素岛101之间，以及所述第二柔性支撑层50与所述连接桥102之间通过所述OCA胶粘结。
请参阅图3，图3为可拉伸显示面板在未填充可拉伸材料时的剖面示意图。所述可拉伸显示面板100包括堆叠于所述衬底岛11上的多层无机层，多层所述无机层在所述镂空区103的部分被挖空以形成所述第一开口103A的一部分，多层无机层在所述连接桥102的部分被挖空以形成第二开口104，所述第二开口104通过有机填充层27填充。
一方面通过将该多层无机层在连接桥102的部分去除形成所述第二开口104，可防止所述可拉伸显示面板100在拉伸时，连接桥102上的应力沿着无机层渗透到像素岛101，影响像素岛101的发光单元的稳定性，另一方面利用有机填充层27来填充所述第二开口104能够缓解连接桥102的拉伸应力，提高连接桥102的拉伸性能。
请参阅图3，所述可拉伸显示面板100包括设置于所述衬底岛11上且异层设置的有源层21、第一金属层、第二金属层，所述衬底岛11、所述有源层21、所述第一金属层、所述第二金属层中的两两相邻膜层之间均设有至少一层所述无机层，以起到绝缘或者阻隔水氧的作用。
所述连接桥102包括第二开口104，所述第二开口104贯穿多层所述无机层，且所述第二开口104填充有有机填充层27，所述有机填充层27设置于所述衬底桥12与所述走线70之间。
具体地，所述像素驱动电路20包括至少一薄膜晶体管，所述薄膜晶体管可为低温多晶硅型、氧化物型、或者非晶硅型等，所述薄膜晶体管可为顶栅型结构或者底栅型结构，所述薄膜晶体管可为单栅结构或者双栅结构，本申请实施例对薄膜晶体管的结构及类型不做限制。可以理解的是，无论是哪种类型的薄膜晶体管，在衬底岛11上制备薄膜晶体管的各个器件时，均会涉及到在不同膜层制备不同功能的无机层。
本申请实施例以顶栅型的低温多晶硅薄膜晶体管为例进行说明，但不限于此。具体地，所述可拉伸显示面板100包括设于所述衬底岛11上的缓冲层24、设于所述缓冲层24上的所述有源层21、设于所述有源层21上的栅极绝缘层25、设于所述栅极绝缘层25上的第一金属层、设于所述第一金属层上的层间绝缘层26，以及设于层间绝缘层26上的第二金属层，所述第一金属层包括像素驱动电路20的栅极22，所述第二金属层包括所述源漏极层23；其中，多层所述无机层包括所述缓冲层24、所述栅极绝缘层25、所述层间绝缘层26，所述层间绝缘层26在所述连接桥102开设有所述第二开口104，所述第二开口104贯穿所述层间绝缘层26、所述栅极绝缘层25以及所述缓冲层24，所述第二开口104被所述有机填充层27填充。
在一些实施例中，所述有机填充层27背离所述柔性衬底10的一侧表面可与所述层间绝缘层26背离所述柔性衬底10的一侧表面平齐，或者所述有机填充层27背离所述柔性衬底10的一侧表面略高于所述层间绝缘层26背离所述柔性衬底10的一侧表面，以使在所述有机填充层27上设置的走线70的表面是平坦的，避免有机填充层27与层间绝缘层26之间存在较大的台阶，导致走线70在台阶处发生断裂。
所述走线70可与所述源漏极层23经过同一金属制程工艺形成，以节省光罩制程。即所述第二金属层还可包括走线70，在形成所述有机填充层27之后，在所述层间绝缘层26和所述有机填充层27上沉积第二金属层的膜层，并对第二金属层进行图案化处理，在相应位置形成源极、漏极以及各条走线70。
在本申请的实施例中，所述走线70包括但不限于扫描线、数据线、电源信号线、公共线等信号线中的至少一种。在其他实施例中，多条所述走线70可分层设置，设置在连接桥102中的不同膜层上，相邻走线膜层之间通过有机层隔开即可。
所述层间绝缘层26还设有位于所述像素岛101的多个第一过孔，所述第一过孔依次穿过所述层间绝缘层26和栅极绝缘层25以露出所述有源层21的两端的表面，所述源漏极层23的源极和漏极分别通过相应的所述第一过孔与所述有源层21连接。
在其他实施例中，所述薄膜晶体管可为底栅结构。具体地，所述栅极设置于缓冲层上，所述栅极绝缘层设置于所述栅极上，所述有源层设置于所述栅极绝缘层上，所述层间绝缘层设置于所述有源层上，所述源漏极层设置于所述层间绝缘层上，所述层间绝缘层开设的位于所述连接桥的开口依次贯穿所述层间绝缘层、所述栅极绝缘层以及缓冲层。
在其他实施例中，所述薄膜晶体管还可为双栅结构，所述栅极包括第一栅极和第二栅极，所述第一栅极和所述第二栅极分别设置于所述有源层的两侧，所述第一栅极与所述有源层之间设有第一绝缘层，所述第二栅极与所述有源层之间设有第二绝缘层，所述第二栅极上设有层间绝缘层。所述层间绝缘层的开口依次贯穿所述层间绝缘层、所述第二栅极绝缘层、所述第一栅极绝缘层以及所述缓冲层。
本申请实施例中的有源层21的材料包括低温多晶硅、铟镓锌氧化物、非晶硅等材料中的任意一种。
无论所述薄膜晶体管为哪种结构，所述第二开口104位于所述连接桥102内，且所述第二开口104均贯穿所述像素驱动电路20内的多层无机层以及所述像素驱动电路20与所述衬底岛11之间的无机层，且用有机填充层27来填充所述第二开口104。
所述栅极绝缘层25以及所述层间绝缘层26的材料均可包括氧化硅（SiOx）、氮化硅（SiNx）等无机材料中的至少一种。
所述缓冲层24可为多层复合膜层结构也可为单层膜层结构，所述缓冲层24的材料包括SiOx、SiNx以及Al 2O 3中的至少一种材料。
多条所述走线70背离所述有机填充层27的一侧覆盖有至少一层有机层，以使得所述走线70的上下两侧均有有机层的保护，能够缓解拉伸应力。
所述走线70上侧的有机层的形成，可通过在制备所述像素岛101上的有机膜层的同时保留所述连接桥102内的膜层来形成。
请参阅图3，所述像素驱动电路20与所述发光单元30之间设有至少一层有机层（例如平坦层80），且所述有机层延伸至所述连接桥102，覆盖所述连接桥102的多条所述走线70。
具体地，所述可拉伸显示面板100还包括平坦层80、搭接电极31以及钝化层90，所述平坦层80设于所述源漏极层23上，所述搭接电极31设于所述平坦层80上，所述发光单元30设于所述搭接电极31上，所述钝化层90设于所述平坦层80上。其中，所述平坦层80延伸至所述连接桥102内，并覆盖所述连接桥102的多条走线70，所述钝化层90为无机层，所述钝化层90位于所述连接桥102的部分被挖空。
请继续参阅图3，所述第一开口103A贯穿所述钝化层90、所述平坦层80、所述第二金属层、所述层间绝缘层26、所述第一金属层、所述栅极绝缘层25、所述有源层21、以及所述缓冲层24。换言之，所述第一开口103A对应的钝化层90、衬底10以及钝化层90与衬底10之间的所有膜层均被挖空，但可以理解的是，所述第一柔性支撑层60不必挖除，以起到承载作用。
请参阅图4，本申请实施例的发光单元30包括颜色各异的第一子像素单元1011、第二子像素单元1012和第三子像素单元1013，第一子像素单元1011、第二子像素单元1012和第三子像素单元1013的面积大小、排列方式、及形状不做限制，第一子像素单元1011、第二子像素单元1012和第三子像素单元1013分别选自红、绿、蓝色子像素单元中的一种。
所述发光单元30包括OLED发光单元、Mini-LED发光单元、Micro-LED发光单元中的任意一种。
在本申请实施例中，请参阅图3，所述发光单元30可为Micro-LED发光单元或Micro-LED发光单元，所述发光单元30的PN电极32设置于所述搭接电极31上，且与所述搭接电极31电性连接。
所述平坦层80上开设有位于所述像素岛101的多个第二过孔，所述第二过孔穿过所述平坦层80以露出所述源漏极层23的源极或漏极，所述搭接电极31通过所述第二过孔与所述源漏极层23的源极或漏极连接，以实现所述像素驱动电路20驱动所述发光单元30发光。
本申请实施例优选所述发光单元30为Micro-LED发光单元，由于LED芯片是通过转印至可拉伸显示面板100上的，LED芯片在转印之后不需再进行一道封装工艺，此外，Micro-LED的尺寸可达到几十微米甚至几微米级别，Micro-LED可以实现高PPI和较高的亮度；另外，Micro-LED无需特殊封装工艺，Micro LED采用无机材料制作，寿命和稳定性均比OLED屏幕的有机分子要强得多，也不容易发生烧屏老化等现象。
请参阅图5至图12，本申请实施例还提供一种上述实施例中的可拉伸显示面板的制备方法，所述制备方法包括：S10，在一刚性基板200上形成柔性衬底10，在所述柔性衬底10上定义出像素岛101、连接桥102及镂空区103；S20，在所述像素岛101形成像素驱动电路20和发光单元30、在所述连接桥102形成多条走线70；S30，将位于所述镂空区103的所述柔性衬底10及其上的膜层全部去除；S40，在所述镂空区103填充可拉伸材料40。
所述刚性基板200可为玻璃基板，所述柔性衬底10可为聚酰亚胺材料，通过在刚性基板200上整面涂布聚酰亚胺材料，并固化成膜。
本申请实施例以制备顶栅型薄膜晶体管为例进行说明，其他类型的薄膜晶体管的制备方法可参考现有技术，不再一一列举。
具体地，请参阅图6至图9，像素驱动电路20的形成包括：在所述柔性衬底10上形成缓冲层24；在所述缓冲层24上形成图案化的有源层21；在所述有源层21上形成栅极绝缘层25；在所述栅极绝缘层25上形成图案化的栅极22；在所述栅极22上形成层间绝缘层26；其中，所述缓冲层24、所述栅极绝缘层25、所述层间绝缘层26均为无机层。
所述缓冲层24可为多层复合膜层结构，也可为单层膜层结构，所述缓冲层24的材料包括SiOx、SiNx以及Al 2O 3中的至少一种材料。
所述栅极绝缘层25以及所述层间绝缘层26的材料均可包括氧化硅（SiOx）、氮化硅（SiNx）等无机材料中的至少一种。
请参阅图7，通过具有不同透光率的半色调掩模板对所述层间绝缘层26、所述栅极绝缘层25以及所述缓冲层24进行刻蚀，以去除上述膜层在镂空区103和连接桥102内的部分，在所述连接桥102形成第二开口104，在所述像素岛101形成第一过孔105，所述第二开口104贯穿所述层间绝缘层26、所述栅极绝缘层25以及所述缓冲层24，所述第一过孔105依次穿过所述层间绝缘层26、所述栅极绝缘层25以露出所述有源层21的两端的表面。
请参阅图8，之后，在所述第二开口104内填充有机填充层27，其中有机填充层27的表面至少与所述层间绝缘层26的表面平齐。
请参阅图9，再在所述层间绝缘层26和所述有机填充层27上沉积第二金属层，并对该第二金属层进行曝光、显影、刻蚀等工艺，形成图案化的所述源漏极层23和多条走线70。
请参阅图10至图12，所述发光单元30的形成包括：在所述源漏极层23和所述走线70上形成图案化的平坦层80；在所述平坦层80上形成搭接电极31；在搭接电极31上形成PN电极32；将Micro-LED芯片绑定在PN电极32上以形成发光单元30。
其中，请参阅图10，在所述源漏极层23上沉积平坦层80，所述平坦层80为有机层，对所述平坦层80进行刻蚀以去除其在所述镂空区103的部分，保留所述平坦层80在所述连接桥102的部分以使得平坦层80覆盖所述走线70，并在所述像素岛101形成第二过孔106，所述第二过孔106露出所述源漏极层23的源极或漏极。
请参阅图11，在所述第二过孔106处形成图案化的搭接电极31，所述搭接电极31与下方的所述源漏极层23的源极或漏极连接。
所述搭接电极31的材料包括但不限于ITO、Mo、Cu、Ti/AL/Ti等导电材料。
请参阅图12，然后在所述平坦层80上形成图案化的钝化层90，所述钝化层90包括容纳槽，所述容纳槽露出所述搭接电极31，所述容纳槽用以容纳与发光单元30相关的器件。所述钝化层90为无机层，所述钝化层90位于所述镂空区103及连接桥102内的部分均被去除。
之后在所述搭接电极,31上蒸镀或电镀PN电极32，并通过转印、绑定等工艺将Micro-LED芯片绑定在PN电极32上以形成发光单元30。
请参阅图13，在形成发光单元30后，对所述柔性衬底10进行形成图案化处理以形成衬底岛11和衬底桥12。具体地，可采用刻蚀工艺或激光切割工艺去除所述柔性衬底10的位于镂空区103的部分，形成图案化的衬底岛11和衬底桥12。
对所述柔性衬底10的图案化处理工序可在所述柔性衬底10的材料沉积完成后进行，也可在转移所述Micro-LED芯片之前进行，这里不做限制。
在去除镂空区103内的柔性衬底10后，可利用激光剥离工艺将柔性衬底10与刚性基板200剥离，得到图3所示的可拉伸显示面板。
请参阅图1和图2，在所述镂空区103的膜层均被去除之后，在所述镂空区103填充可拉伸材料40，以提高图案化的柔性衬底10的刚度，防止可拉伸显示面板100在拉伸时发生断裂以及能够抑制可拉伸显示面板100在拉伸时发生扭曲变形。
请参阅图2，所述可拉伸显示面板100的两相对侧还可进分别贴附第一柔性支撑层60和第二柔性支撑层50。
请参阅图14和图15，所述可拉伸材料40可为可拉伸胶层，所述可拉伸材料40的填充可分两次进行，所述可拉伸材料40可包括第一可拉伸胶层41和第二可拉伸胶层42。
首先，通过第一可拉伸胶层41将第一柔性支撑层60贴附在可拉伸显示面板的底部（所述柔性衬底10背离发光单元30的一侧），然后在所述镂空区103填充所述第二可拉伸胶层42直至第二可拉伸胶层42溢出所述可拉伸显示面板的顶部（发光单元30背离所述柔性衬底10的一侧），覆盖所述像素岛101和所述连接桥102的顶面，最后将所述第二柔性支撑层50贴附在所述第二可拉伸胶层42上。
其中，所述第一柔性支撑层60位于所述可拉伸显示面板100的底部，可对所述可拉伸显示面板100起到支撑作用，所述第二柔性支撑层50位于所述可拉伸显示面板100的顶部，可用于保护可拉伸显示面板的发光单元30和像素驱动电路20。
所述第二柔性支撑层50和所述第一柔性支撑层60可为弹性基板，例如PDMS（Polydimethylsiloxane，聚二甲基硅氧烷）基板，其具有低弹性模量，有利于提高可拉伸显示面板整体的拉伸性能。
本申请实施例的可拉伸显示面板包括但不限于：电子纸、移动、平板计算机、电视、监视器、笔记本计算机、数字相框、数码相机等电子显示产品。
综上，本申请实施例提供一种可拉伸显示面板，可拉伸显示面板包括第一柔性支撑层60、设于第一柔性支撑层60上的像素岛101和连接桥102，以及设于相邻连接桥102之间和/或设置于相邻的所述像素岛101之间的镂空区103，镂空区103设有第一开口103A，且第一开口103A填充有可拉伸材料40。通过将像素岛和连接桥的周边区域设计成具有第一开口103A的镂空区103，可降低可拉伸显示面板整体的杨氏模量和提高可拉伸显示面板的拉伸率，第一开口103A用可拉伸材料40填充，可防止可拉伸显示面板在拉伸时发生断裂以及能够抑制可拉伸显示面板在拉伸时发生扭曲变形。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种可拉伸显示面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (18)

  1. 一种可拉伸显示面板，包括：
    第一柔性支撑层；
    多个像素岛，设置在所述第一柔性支撑层上，且每个所述像素岛包括多个发光单元；
    多个连接桥，设置在所述第一柔性支撑层上，且所述连接桥连接相邻的两所述像素岛，所述连接桥包括多条走线，所述走线两端分别与两个相邻所述像素岛中的发光单元电连接；
    多个镂空区，设置于相邻的所述连接桥之间，和/或，设置于相邻的所述像素岛之间；以及
    第二柔性支撑层，设置于所述像素岛和所述连接桥背离所述第一柔性支撑层一侧；
    其中，所述镂空区设置有第一开口，且所述第一开口中填充有可拉伸材料，所述可拉伸材料设置在所述第一柔性支撑层靠近所述像素岛的一侧；
    所述像素岛包括依次堆叠于所述第一柔性支撑层上的衬底岛、像素驱动电路以及电连接所述像素驱动电路的所述发光单元；
    所述连接桥包括依次堆叠于所述第一柔性支撑层上的衬底桥和多条所述走线，所述衬底桥的两端分别与两相邻的所述衬底岛连接。
  2. 根据权利要求1所述的可拉伸显示面板，其中，
    所述可拉伸显示面板包括设置于所述衬底岛上且异层设置的有源层、第一金属层、第二金属层，所述衬底岛、所述有源层、所述第一金属层、所述第二金属层中的两两相邻膜层之间均设有至少一层无机层；
    所述连接桥包括第二开口，所述第二开口贯穿多层所述无机层，且所述第二开口填充有有机填充层，所述有机填充层设置于所述衬底桥与所述走线之间。
  3. 根据权利要求2所述的可拉伸显示面板，其中，所述第二金属层包括所述像素驱动电路的源漏极层和所述走线。
  4. 根据权利要求2所述的可拉伸显示面板，其中，所述可拉伸显示面板包括：
    缓冲层，设于所述衬底岛上；
    所述有源层，设于所述缓冲层上；
    栅极绝缘层，设于所述有源层上；
    所述第一金属层，设于所述栅极绝缘层上；
    层间绝缘层，设于所述第一金属层上；以及
    第二金属层，设于所述层间绝缘层上；
    其中，所述缓冲层、所述栅极绝缘层、所述层间绝缘层，所述层间绝缘层均为无机层，所述第二开口贯穿所述层间绝缘层、所述栅极绝缘层以及所述缓冲层。
  5. 根据权利要求4所述的可拉伸显示面板，其中，所述可拉伸显示面板还包括：
    平坦层，设于所述第二金属层上，所述发光单元设于所述平坦层上；
    钝化层，设于所述平坦层上；
    其中，所述第一开口贯穿所述钝化层、所述平坦层、所述第二金属层、所述层间绝缘层、所述第一金属层、所述栅极绝缘层、所述有源层、以及所述缓冲层。
  6. 根据权利要求5所述的可拉伸显示面板，其中，填充于所述第一开口的所述可拉伸材料为OCA胶。
  7. 根据权利要求5所述的可拉伸显示面板，其中，所述平坦层为有机层，所述平坦层延伸至所述连接桥，并覆盖所述连接桥的多条所述连接走线。
  8. 根据权利要求1所述的可拉伸显示面板，其中，所述第一柔性支撑层与所述像素岛之间、所述第一柔性支撑层与所述连接桥之间、所述第二柔性支撑层与所述像素岛之间，以及所述第二柔性支撑层与所述连接桥之间通过所述可拉伸材料粘结。
  9. 一种可拉伸显示面板，包括：
    第一柔性支撑层；
    多个像素岛，设置在所述第一柔性支撑层上，且每个所述像素岛包括多个发光单元；
    多个连接桥，设置在所述第一柔性支撑层上，且所述连接桥连接相邻的两所述像素岛，所述连接桥包括多条走线，所述走线两端分别与两个相邻所述像素岛中的发光单元电连接；
    多个镂空区，设置于相邻的所述连接桥之间，和/或，设置于相邻的所述像素岛之间；
    其中，所述镂空区设置有第一开口，且所述第一开口中填充有可拉伸材料，所述可拉伸材料设置在所述第一柔性支撑层靠近所述像素岛的一侧。
  10. 根据权利要求9所述的可拉伸显示面板，其中，
    所述像素岛包括依次堆叠于所述第一柔性支撑层上的衬底岛、像素驱动电路以及电连接所述像素驱动电路的所述发光单元；
    所述连接桥包括依次堆叠于所述第一柔性支撑层上的衬底桥和多条所述走线，所述衬底桥的两端分别与两相邻的所述衬底岛连接。
  11. 根据权利要求10所述的可拉伸显示面板，其中，
    所述可拉伸显示面板包括设置于所述衬底岛上且异层设置的有源层、第一金属层、第二金属层，所述衬底岛、所述有源层、所述第一金属层、所述第二金属层中的两两相邻膜层之间均设有至少一层无机层；
    所述连接桥包括第二开口，所述第二开口贯穿多层所述无机层，且所述第二开口填充有有机填充层，所述有机填充层设置于所述衬底桥与所述走线之间。
  12. 根据权利要求11所述的可拉伸显示面板，其中，所述第二金属层包括所述像素驱动电路的源漏极层和所述走线。
  13. 根据权利要求11所述的可拉伸显示面板，其中，所述可拉伸显示面板包括：
    缓冲层，设于所述衬底岛上；
    所述有源层，设于所述缓冲层上；
    栅极绝缘层，设于所述有源层上；
    所述第一金属层，设于所述栅极绝缘层上；
    层间绝缘层，设于所述第一金属层上；以及
    第二金属层，设于所述层间绝缘层上；
    其中，所述缓冲层、所述栅极绝缘层、所述层间绝缘层，所述层间绝缘层均为无机层，所述第二开口贯穿所述层间绝缘层、所述栅极绝缘层以及所述缓冲层。
  14. 根据权利要求13所述的可拉伸显示面板，其中，所述可拉伸显示面板还包括：
    平坦层，设于所述第二金属层上，所述发光单元设于所述平坦层上；
    钝化层，设于所述平坦层上；
    其中，所述第一开口贯穿所述钝化层、所述平坦层、所述第二金属层、所述层间绝缘层、所述第一金属层、所述栅极绝缘层、所述有源层、以及所述缓冲层。
  15. 根据权利要求14所述的可拉伸显示面板，其中，填充于所述第一开口的所述可拉伸材料为OCA胶。
  16. 根据权利要求14所述的可拉伸显示面板，其中，所述平坦层为有机层，所述平坦层延伸至所述连接桥，并覆盖所述连接桥的多条所述连接走线。
  17. 根据权利要求9所述的可拉伸显示面板，其中，所述可拉伸显示面板还包括设置于所述像素岛和所述连接桥背离所述第一柔性支撑层一侧的第二柔性支撑层。
  18. 根据权利要求17所述的可拉伸显示面板，其中，所述第一柔性支撑层与所述像素岛之间、所述第一柔性支撑层与所述连接桥之间、所述第二柔性支撑层与所述像素岛之间，以及所述第二柔性支撑层与所述连接桥之间通过所述可拉伸材料粘结。
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CN117016054A (zh) * 2022-03-02 2023-11-07 京东方科技集团股份有限公司 可拉伸显示面板及其制造方法、显示装置
CN117501837A (zh) * 2022-04-29 2024-02-02 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
CN114937414B (zh) * 2022-05-23 2023-08-22 武汉华星光电半导体显示技术有限公司 柔性显示面板及其制作方法、显示终端
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